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Apple silicon

January 01, 1970

Apple silicon refers to a series of system on a chip (SoC) and system in a package (SiP) processors designed by Apple Inc., mainly using the ARM architecture. They are the basis of Mac, iPhone, iPad, Apple TV, Apple Watch, AirPods, AirTag, HomePod, and Apple Vision Pro devices.

The A16 Bionic chip

Apple announced its plan to switch Mac computers from Intel processors to Apple silicon at WWDC 2020 on June 22, 2020.[1][2] The first Macs built with the Apple M1 chip were unveiled on November 10, 2020. As of June 2023, the entire Mac lineup uses Apple silicon chips.

Apple fully controls the integration of Apple silicon chips with the company's hardware and software products. Johny Srouji is in charge of Apple's silicon design.[3] Manufacturing of the chips is outsourced to semiconductor contract manufacturers such as TSMC.

A series

The "A" series is a family of SoCs used in the iPhone, certain iPad models, and the Apple TV. "A" series chips were also used in the discontinued iPod Touch line and the original HomePod. They integrate one or more ARM-based processing cores (CPU), a graphics processing unit (GPU), cache memory and other electronics necessary to provide mobile computing functions within a single physical package.[4]

Apple A4

Main article: Apple A4

The Apple A4 is a PoP SoC manufactured by Samsung, the first SoC Apple designed in-house.[5] It combines an ARM Cortex-A8 CPU – also used in Samsung's S5PC110A01 SoC[6][7] – and a PowerVR SGX 535 graphics processor (GPU),[8][9][10] all built on Samsung's 45-nanometer silicon chip fabrication process.[11][12] The design emphasizes power efficiency.[13] The A4 commercially debuted in 2010, in Apple's iPad tablet,[8] and was later used in the iPhone 4 smartphone,[14] the fourth-generation iPod Touch, and the 2nd-generation Apple TV.[15]

The Cortex-A8 core used in the A4, dubbed "Hummingbird", is thought to use performance improvements developed by Samsung in collaboration with chip designer Intrinsity, which was subsequently acquired by Apple[16][17] It can run at far higher clock rates than other Cortex-A8 designs yet remains fully compatible with the design provided by ARM.[18] The A4 runs at different speeds in different products: 1 GHz in the first iPads,[19] 800 MHz in the iPhone 4 and fourth-generation iPod Touch, and an undisclosed speed in the 2nd-generation Apple TV.

The A4's SGX535 GPU could theoretically push 35 million polygons per second and 500 million pixels per second, although real-world performance may be considerably less.[20] Other performance improvements include additional L2 cache.

The A4 processor package does not contain RAM, but supports PoP installation. The 1st-generation iPad, fourth-generation iPod Touch,[21] and the 2nd-generation Apple TV[22] have an A4 mounted with two low-power 128 MB DDR SDRAM chips (totaling 256 MB), while the iPhone 4 has two 256 MB packages for a total of 512 MB.[23][24][25] The RAM is connected to the processor using ARM's 64-bit-wide AMBA 3 AXI bus. To give the iPad high graphics bandwidth, the width of the RAM data bus is double that used in previous ARM11- and ARM9-based Apple devices.[26]

Apple A5

Main article: Apple A5

The Apple A5 is an SoC manufactured by Samsung[27] that replaced the A4. The chip commercially debuted with the release of Apple's iPad 2 tablet in March 2011,[28] followed by its release in the iPhone 4S smartphone later that year. Compared to the A4, the A5 CPU "can do twice the work" and the GPU has "up to nine times the graphics performance",[29] according to Apple.

The A5 contains a dual-core ARM Cortex-A9 CPU[30] with ARM's advanced SIMD extension, marketed as NEON, and a dual core PowerVR SGX543MP2 GPU. This GPU can push between 70 and 80 million polygons/second and has a pixel fill rate of 2 billion pixels/second. The iPad 2's technical specifications page says the A5 is clocked at 1 GHz,[31] though it can adjust its frequency to save battery life.[30][32] The clock speed of the unit used in the iPhone 4S is 800 MHz. Like the A4, the A5 process size is 45 nm.[33]

An updated 32 nm version of the A5 processor was used in the 3rd-generation Apple TV, the fifth-generation iPod Touch, the iPad Mini, and the new version of iPad 2 (version iPad2,4).[34] The chip in the Apple TV has one core locked.[35][36] Markings on the square package indicate that it is named APL2498, and in software, the chip is called S5L8942. The 32 nm variant of the A5 provides around 15% better battery life during web browsing, 30% better when playing 3D games and about 20% better battery life during video playback.[37]

In March 2013, Apple released an updated version of the 3rd-generation Apple TV (Rev A, model A1469) containing a smaller, single-core version of the A5 processor. Unlike the other A5 variants, this version of the A5 is not a PoP, having no stacked RAM. The chip is very small, just 6.1×6.2 mm, but as the decrease in size is not due to a decrease in feature size (it is still on a 32 nm fabrication process), this indicates that this A5 revision is of a new design.[38] Markings tell that it is named APL7498, and in software, the chip is called S5L8947.[39][40]

Apple A5X

Main article: Apple A5X

The Apple A5X is an SoC announced on March 7, 2012, at the launch of the third-generation iPad. It is a high-performance variant of the Apple A5; Apple claims it has twice the graphics performance of the A5.[41] It was superseded in the fourth-generation iPad by the Apple A6X processor.

The A5X has a quad-core graphics unit (PowerVR SGX543MP4) instead of the previous dual-core as well as a quad-channel memory controller that provides a memory bandwidth of 12.8 GB/s, roughly three times more than in the A5. The added graphics cores and extra memory channels add up to a very large die size of 165 mm²,[42] for example twice the size of Nvidia Tegra 3.[43] This is mainly due to the large PowerVR SGX543MP4 GPU. The clock frequency of the dual ARM Cortex-A9 cores have been shown to operate at the same 1 GHz frequency as in A5.[44] The RAM in A5X is separate from the main CPU package.[45]

Apple A6

Main article: Apple A6

The Apple A6 is a PoP SoC introduced on September 12, 2012, at the launch of the iPhone 5, then a year later was inherited by its minor successor the iPhone 5C. Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A5.[46] It is 22% smaller and draws less power than the 45 nm A5.[47]

The A6 is said to use a 1.3 GHz[48] custom[49] Apple-designed ARMv7 based dual-core CPU, called Swift,[50] rather than a licensed CPU from ARM like in previous designs, and an integrated 266 MHz triple-core PowerVR SGX 543MP3[51] graphics processing unit (GPU). The Swift core in the A6 uses a new tweaked instruction set, ARMv7s, featuring some elements of the ARM Cortex-A15 such as support for the Advanced SIMD v2, and VFPv4.[49] The A6 is manufactured by Samsung on a high-κ metal gate (HKMG) 32 nm process.[52]

Apple A6X

Main article: Apple A6X

Apple A6X is an SoC introduced at the launch of the fourth-generation iPad on October 23, 2012. It is a high-performance variant of the Apple A6. Apple claims the A6X has twice the CPU performance and up to twice the graphics performance of its predecessor, the Apple A5X.[53]

Like the A6, this SoC continues to use the dual-core Swift CPU, but it has a new quad core GPU, quad channel memory and slightly higher 1.4 GHz CPU clock rate.[54] It uses an integrated quad-core PowerVR SGX 554MP4 graphics processing unit (GPU) running at 300 MHz and a quad-channel memory subsystem.[54][55] Compared to the A6 the A6X is 30% larger, but it continues to be manufactured by Samsung on a high-κ metal gate (HKMG) 32 nm process.[55]

Apple A7

Main article: Apple A7

The Apple A7 is a 64-bit PoP SoC whose first appearance was in the iPhone 5S, which was introduced on September 10, 2013. The chip would also be used in the iPad Air, iPad Mini 2 and iPad Mini 3. Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A6.[56] The Apple A7 chip is the first 64-bit chip to be used in a smartphone and later a tablet computer.[57]

The A7 features an Apple-designed 1.3[58]–1.4[59] GHz 64-bit[60] ARMv8-A[61][62] dual-core CPU,[58] called Cyclone,[61] and an integrated PowerVR G6430 GPU in a four cluster configuration.[63] The ARMv8-A architecture doubles the number of registers of the A7 compared to the A6.[64] It now has 31 general-purpose registers that are each 64-bits wide and 32 floating-point/NEON registers that are each 128-bits wide.[60] The A7 is manufactured by Samsung on a high-κ metal gate (HKMG) 28 nm process[65] and the chip includes over 1 billion transistors on a die 102 mm2 in size.[58]

Apple A8

Main article: Apple A8

The Apple A8 is a 64-bit PoP SoC manufactured by TSMC. Its first appearance was in the iPhone 6 and iPhone 6 Plus, which were introduced on September 9, 2014.[66] A year later it would drive the iPad Mini 4. Apple states that it has 25% more CPU performance and 50% more graphics performance while drawing only 50% of the power compared to its predecessor, the Apple A7.[67] On February 9, 2018, Apple released the HomePod, which is powered by an Apple A8 with 1 GB of RAM.[68]

The A8 features an Apple-designed 1.4[69] GHz 64-bit[70] ARMv8-A[70] dual-core CPU, and an integrated custom PowerVR GX6450 GPU in a four cluster configuration.[69] The GPU features custom shader cores and compiler.[71] The A8 is manufactured on a 20 nm process[72] by TSMC,[73] which replaced Samsung as the manufacturer of Apple's mobile device processors. It contains 2 billion transistors. Despite that being double the number of transistors compared to the A7, its physical size has been reduced by 13% to 89 mm2 (consistent with a shrink only, not known to be a new microarchitecture).[74]

Apple A8X

Main article: Apple A8X

The Apple A8X is a 64-bit SoC introduced at the launch of the iPad Air 2 on October 16, 2014.[75] It is a high performance variant of the Apple A8. Apple states that it has 40% more CPU performance and 2.5 times the graphics performance of its predecessor, the Apple A7.[75][76]

Unlike the A8, this SoC uses a triple-core CPU, a new octa-core GPU, dual channel memory and slightly higher 1.5 GHz CPU clock rate.[77] It uses an integrated custom octa-core PowerVR GXA6850 graphics processing unit (GPU) running at 450 MHz and a dual-channel memory subsystem.[77] It is manufactured by TSMC on their 20 nm fabrication process, and consists of 3 billion transistors.

Apple A9

Main article: Apple A9

The Apple A9 is a 64-bit ARM-based SoC that first appeared in the iPhone 6S and 6S Plus, which were introduced on September 9, 2015.[78] Apple states that it has 70% more CPU performance and 90% more graphics performance compared to its predecessor, the Apple A8.[78] It is dual sourced, a first for an Apple SoC; it is manufactured by Samsung on their 14 nm FinFET LPE process and by TSMC on their 16 nm FinFET process. It was subsequently included in the first-generation iPhone SE, and the iPad (5th generation). The Apple A9 was the last CPU that Apple manufactured through a contract with Samsung, as all A-series chips after are manufactured by TSMC.

Apple A9X

Main article: Apple A9X

The Apple A9X is a 64-bit SoC that was announced on September 9, 2015, and released on November 11, 2015, and first appeared in the iPad Pro.[79] It offers 80% more CPU performance and two times the GPU performance of its predecessor, the Apple A8X. It is manufactured by TSMC using a 16 nm FinFET process.[80]

Apple A10 Fusion

Main article: Apple A10

The Apple A10 Fusion is a 64-bit ARM-based SoC that first appeared in the iPhone 7 and 7 Plus, which were introduced on September 7, 2016.[81] The A10 is also featured in the sixth-generation iPad, seventh-generation iPad and seventh-generation iPod Touch.[82] It has a new ARM big.LITTLE quad core design with two high performance cores, and two smaller highly efficient cores. It is 40% faster than the A9, with 50% faster graphics. It is manufactured by TSMC on their 16 nm FinFET process.

Apple A10X Fusion

Main article: Apple A10X

The Apple A10X Fusion is a 64-bit ARM-based SoC that first appeared in the 10.5" iPad Pro and the second generation of the 12.9" iPad Pro, which were both announced on June 5, 2017.[83] It is a variant of the A10 and Apple claims that it has 30 percent faster CPU performance and 40 percent faster GPU performance than its predecessor, the A9X.[83] On September 12, 2017, Apple announced that the Apple TV 4K would be powered by an A10X chip. It is made by TSMC on their 10 nm FinFET process.[84]

Apple A11 Bionic

Main article: Apple A11

The Apple A11 Bionic is a 64-bit ARM-based SoC[85] that first appeared in the iPhone 8, iPhone 8 Plus, and iPhone X, which were introduced on September 12, 2017.[85] It has two high-performance cores, which are 25% faster than the A10 Fusion, four high-efficiency cores, which are 70% faster than the energy-efficient cores in the A10, and for the first time an Apple-designed three-core GPU with 30% faster graphics performance than the A10.[85][86] It is also the first A-series chip to feature Apple's "Neural Engine," which enhances artificial intelligence and machine learning processes.[87]

Apple A12 Bionic

Main article: Apple A12

The Apple A12 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone XS, XS Max and XR, which were introduced on September 12, 2018. It is also used in the third-generation iPad Air, fifth-generation iPad Mini, and the eighth-generation iPad. It has two high-performance cores, which are 15% faster than the A11 Bionic, and four high-efficiency cores, which have 50% lower power usage than the energy-efficient cores in the A11 Bionic.[88] The A12 is manufactured by TSMC[89] using a 7 nm[90] FinFET process, the first to ship in a smartphone.[91][89] It is also used in the 6th generation Apple TV.

Apple A12X Bionic

Main article: Apple A12X

The Apple A12X Bionic is a 64-bit ARM-based SoC that first appeared in the 11.0" iPad Pro and the third generation of the 12.9" iPad Pro, which were both announced on October 30, 2018.[92] It offers 35% faster single-core and 90% faster multi-core CPU performance than its predecessor, the A10X. It has four high-performance cores and four high-efficiency cores. The A12X is manufactured by TSMC using a 7 nm FinFET process.

Apple A12Z Bionic

The Apple A12Z Bionic is an updated version of the A12X Bionic, first appearing in the fourth generation iPad Pro, which was announced on March 18, 2020.[93] It adds an additional GPU core, compared to the A12X, for improved graphics performance.[94] The A12Z is also used in the Developer Transition Kit prototype computer that helps developers prepare their software for Macs based on Apple silicon.[95]

Apple A13 Bionic

Main article: Apple A13

The Apple A13 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 11, 11 Pro, and 11 Pro Max, which were introduced on September 10, 2019. It is also featured in the second-generation iPhone SE (released April 15, 2020), the 9th generation iPad (announced September 14, 2021) and in the Studio Display (announced March 8, 2022)

The entire A13 SoC features a total of 18 cores – a six-core CPU, four-core GPU, and an eight-core Neural Engine processor, which is dedicated to handling on-board machine learning processes; four of the six cores on the CPU are low-powered cores that are dedicated to handling less CPU-intensive operations, such as voice calls, browsing the Web, and sending messages, while two higher-performance cores are used only for more CPU-intensive processes, such as recording 4K video or playing a video game.[96]

Apple A14 Bionic

Main article: Apple A14

The Apple A14 Bionic is a 64-bit ARM-based SoC that first appeared in the fourth-generation iPad Air and iPhone 12, released on October 23, 2020. It is the first commercially available 5 nm chipset and it contains 11.8 billion transistors and a 16-core AI processor.[97] It includes Samsung LPDDR4X DRAM, a 6-core CPU, and 4-Core GPU with real time machine learning capabilities. It was later used in the tenth-generation iPad, released on October 26, 2022.

Apple A15 Bionic

Main article: Apple A15

The Apple A15 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 13, unveiled on September 14, 2021. The A15 is built on a 5-nanometer manufacturing process with 15 billion transistors. It has 2 high-performance processing cores, 4 high-efficiency cores, a new 5-core graphics for iPhone 13 Pro series (4-core for iPhone 13 and 13 mini) processing unit, and a new 16-core Neural Engine capable of 15.8 trillion operations per second.[98][99] It is also used in the iPhone SE (3rd generation), iPhone 14, iPhone 14 Plus and iPad Mini 6.[100]

Apple A16 Bionic

Main article: Apple A16

The Apple A16 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 14 Pro, unveiled on September 7, 2022. The A16 has 16 billion transistors and is built on TSMC's N4P fabrication process, being touted by Apple as the first 4 nm processor in a smartphone.[101][102] However, N4 is an enhanced version of N5 technology, a de facto fourth-generation 5 nm manufacturing process.[103][104][105] The chip has 2 high-performance processing cores, 4 high-efficiency cores and 5-core graphics for iPhone 14 Pro series. Memory is upgraded to LPDDR5 for 50% higher bandwidth and a 7% faster 16-core Neural Engine capable of 17 trillion operations per second.

Apple A17 Pro

Main article: Apple A17

The Apple A17 Pro is a 64-bit ARM-based SoC that first appeared in the iPhone 15 Pro, unveiled on September 12, 2023. It is Apple's first 3 nm SoC. The chip has 2 high-performance processing cores, 4 high-efficiency cores, a 6-core GPU for iPhone 15 Pro series, and a 16-core Neural Engine capable of 35 trillion operations per second. The GPU was described as their biggest redesign in the history of Apple GPUs, it added hardware accelerated ray tracing and mesh shading support.[106]

Comparison of A series processors

General Semiconductor technology Computer architecture CPU GPU AI accelerator Memory technology First release
Name Codename Part No. Image Node Manufacturer Transistors count Die size CPU ISA Bit width Performance core Efficiency core Overall cores Cache Vendor Cores SIMD EU count FP32 ALU count Frequency FP32 FLOPS Cores OPS Memory bus width Total channel
Bit per channel 		Memory type Theoretical
bandwidth 		Available capacity
Core name Cores Core speed Core name Cores Core speed L1 L2 L3 SLC
APL0098 S5L8900   90 nm
[107] 		Samsung 72 mm2
[11] 		ARMv6 32-bit ARM11 1 412 MHz — — — Single-core L1i: 16 KB
L1d: 16 KB 		— — — PowerVR
MBX Lite 		1 1 8 60 MHz – 103 MHz 0.96 GFLOPS – 1.64 GFLOPS — — 16-bit 1 channel
16-bit/channel 		LPDDR-266
(133.25 
MHz) 		533 MB/s 128 MB June 29, 2007
APL0278 S5L8720   65 nm
[11] 		36 mm2
[11] 		533 MHz 103 MHz – 133 MHz 1.64 GFLOPs – 2.12 GFLOPS 32-bit 1 channel
32-bit/channel 		1066 MB/s July 11, 2008
APL0298 S5L8920   71.8 mm2
[12] 		ARMv7 Cortex-A8 600 MHz L1i: 32 KB
L1d: 32 KB 		256 KB PowerVR
SGX535
[108] 		2 16 200 MHz 6.4 GFLOPS LPDDR-400
(200 MHz) 		1.6 GB/s 256 MB June 19, 2009
APL2298 S5L8922   45 nm
[11][12]
[33] 		41.6 mm2
[11] 		September 9, 2009
A4 APL0398 S5L8930   53.3 mm2
[11][12] 		800 MHz 512 KB 200 MHz – 250 MHz 6.4 GFLOPS – 8.0 GFLOPS 64-bit 2 channels
32-bit/channel 		3.2 GB/s April 3, 2010
1.0 GHz
800 MHz 512 MB
A5 APL0498 S5L8940   122.2 mm2
[33] 		Cortex-A9 2 800 MHz Dual-core 1 MB PowerVR
SGX543
[109][51] 		2 4 32 200 MHz 12.8 GFLOPS LPDDR2-800
(400 MHz) 		6.4 GB/s March 11, 2011
1.0 GHz
APL2498 S5L8942   32 nm
Hκ MG
[34][40] 		69.6 mm2
[34] 		800 MHz March 7, 2012
1.0 GHz
2[a] Dual-core[b]
APL7498 S5L8947   37.8 mm2
[40] 		1 Single-core January 28, 2013
A5X APL5498 S5L8945   45 nm
[11][12]
[33] 		165 mm2
[42] 		2 Dual-core 4 8 64 25.6 GFLOPS 128-bit 4 channels
32-bit/channel 		12.8 GB/s 1 GB March 16, 2012
A6 APL0598 S5L8950   32 nm
Hκ MG
[52][110]
[55] 		96.71 mm2
[52][110] 		ARMv7s[111] Swift[49] 1.3 GHz
[112] 		3 6 48 266 or 709 MHz 25.5 or 68.0 GFLOPS 64-bit 2 channels
32-bit/channel 		LPDDR2-1066
(533 MHz) 		8.5 GB/s September 21, 2012
A6X APL5598 S5L8955   123 mm2
[55] 		1.4 GHz
[54] 		PowerVR
SGX554
[54][113] 		4 16 128 300 MHz 76.8 GFLOPS 128-bit 4 channels
32-bit/channel 		17.0 GB/s November 2, 2012
A7 APL0698 S5L8960   28 nm
Hκ MG
[65][114] 		1 billion 102 mm2
[60][114] 		ARMv8.0-A
[61][69] 		64-bit Cyclone 1.3 GHz L1i: 64 KB
L1d: 64 KB 		4 MB (Inclusive)
[61][115][59] 		PowerVR
G6430
[63][113] 		450 MHz 115.2 GFLOPS 64-bit 1 channel
64-bit/channel 		LPDDR3-1600
(800 MHz) 		12.8 GB/s September 20, 2013
APL5698 S5L8965   1.4 GHz November 1, 2013
A8 APL1011 T7000   20 nm
Hκ MG
[70][69] 		TSMC 2 billion 89 mm2
[116][77]
[117] 		Typhoon 1.1 GHz PowerVR
GX6450
[71][118][119] 		533 MHz 136.4 GFLOPS September 19, 2014
1.4 GHz
1.5 GHz 2 GB
A8X APL1021 T7001   3 billion 128 mm2
[77] 		3 3-core 2 MB PowerVR
GX6850
[71][77][117] 		8 32 256 450 MHz 230.4 GFLOPS 128-bit 2 channels
64-bit/channel 		25.6 GB/s October 22, 2014
A9 APL0898 S8000   14 nm
FinFET
[120] 		Samsung ≥ 2 billion 96 mm2
[121] 		Twister 2 1.85 GHz
[122][123] 		Dual-core 3 MB 4 MB (Victim)

[115][124]

PowerVR
GT7600
[71][125] 		6 24 192 650 MHz 249.6 GFLOPS 64-bit 1 channel
64-bit/channel 		LPDDR4-3200
(1600 MHz) 		September 25, 2015
APL1022 S8003   16 nm
FinFET
[121][126]
[127] 		TSMC 104.5 mm2
[121]
A9X APL1021 S8001   ≥ 3 billion 143.9 mm2
[126][84] 		2.16 GHz
[128][129] 		—
[115][126] 		PowerVR
GT7850
[71][126] 		12 48 384 499.2 GFLOPS 128-bit[c] 2 channels[d]
64-bit/channel 		November 11, 2015
2.26 GHz 128-bit 2 channels
64-bit/channel 		51.2 GB/s 4 GB
A10 Fusion APL1W24 T8010   3.3 billion 125 mm2
[127] 		ARMv8.1-A Hurricane 2 1.64 GHz Zephyr 2 1.09 GHz Quad-core[e] P-core:
L1i: 64 KB
L1d: 64 KB

E-core:
L1i: 32 KB
L1d: 32 KB 		P-core:
3 MB

E-core:
1 MB 		4 MB PowerVR
GT7600
Plus[130][71]
[131][132] 		6 24 192 900 MHz 345.6 GFLOPS 64-bit 1 channel
64-bit/channel 		25.6 GB/s 2 GB September 16, 2016
2.34 GHz
3 GB
A10X Fusion APL1071 T8011   10 nm
FinFET
[84] 		≥ 4 billion 96.4 mm2
[84] 		3 2.38 GHz 3 1.30 GHz 6-core[f] P-core:
8 MB

E-core:
1 MB 		—
[133][134] 		4 M4 12 48 384 1000 MHz 768.0 GFLOPS 128-bit 2 channels
64-bit/channel 		51.2 GB/s 3 GB June 13, 2017
4 GB
A11
Bionic 		APL1W72 T8015   4.3 billion 87.66 mm2
[135] 		ARMv8.2-A
[136] 		Monsoon 2 2.39 GHz Mistral 4[g] 1.19 GHz 6-core 1st
generation Apple-
designed 		3 12 192 1066 MHz 409.3 GFLOPS 2 600 billion OPS 64-bit 4 channels
16-bit/channel 		LPDDR4X-4266
(2133 MHz) 		34.1 GB/s 2 GB September 22, 2017
3 GB
A12
Bionic 		APL1W81 T8020   7 nm (N7)
FinFET
 6.9 billion 83.27 mm2
[137] 		ARMv8.3-A
[138] 		Vortex 2.49 GHz Tempest 4 1.59 GHz P-core:
L1i: 128 KB
L1d: 128 KB

E-core:
L1i: 32 KB
L1d: 32 KB 		P-core:
8 MB

E-core:
2 MB 		8 MB 2nd
generation Apple-
designed (Apple G11P) 		4 16 256 1125 MHz 576.0 GFLOPS 8 5 TOPS September 21, 2018
4 GB
A12X Bionic APL1083 T8027   10 billion 135 mm2
[139] 		4 8-core Second generation Apple-
designed (Apple G11G) 		7
 28 448 1.008 TFLOPS 128-bit 2 channels
64-bit/channel 		68.2 GB/s November 7, 2018
6 GB
A12Z Bionic   8 32 512 1.152 TFLOPS March 25, 2020
16 GB June 22, 2020
A13
Bionic 		APL1W85 T8030   7 nm (N7P)
FinFET 		8.5 billion 98.48 mm2
[140] 		ARMv8.4-A
[141] 		Lightning 2 2.66 GHz Thunder 1.72 GHz 6-core P-core:
L1i: 192 KB
L1d: 128 KB

E-core:
L1i: 96 KB
L1d: 48 KB 		P-core:
8 MB

E-core:
4 MB 		16 MB 3rd
generation Apple-
designed
[142] 		4 16
[143] 		256 1350 MHz 691.2 GFLOPS 5.5 TOPS 64-bit 4 channels
16-bit/channel 		34.1 GB/s 3 GB September 20, 2019
4 GB
A14
Bionic 		APL1W01 T8101   5 nm (N5)
FinFET 		11.8 billion 88 mm2
[144] 		ARMv8.5-A
[145] 		Firestorm 3.00 GHz Icestorm 1.82 GHz P-core:
L1i: 192 KB
L1d: 128 KB

E-core:
L1i: 128 KB
L1d: 64 KB 		4th
generation Apple-
designed
[146][142][147]
[148] 		1462.5 MHz 748.8 GFLOPS 16 11 TOPS October 23, 2020
4 GB
A15
Bionic 		APL1W07
[149] 		T8110   5 nm (N5P)
FinFET 		15 billion 108.01 mm2
[149] 		Avalanche 3.24 GHz Blizzard 2.02 GHz P-core:
12 MB

E-core:
4 MB 		32 MB 5th
generation Apple-
designed
[150][151][152] 		512
[143] 		1338 MHz
[143][153] 		1.370 TFLOPS[154] 15.8 TOPS 4 GB September 24, 2021
2.93 GHz 5 20
[153][155] 		640
[153][155] 		1.713 TFLOPS[156]
3.24 GHz 6 GB
A16
Bionic 		APL1W10

[157]

T8120   4 nm
(N4P)
FinFET

[103][104]
[105][102]
[158]

16 billion 112.75 mm2
[159] 		ARMv8.6-A
[160] 		Everest
[161][162] 		3.46 GHz Sawtooth
[161][162] 		P-core:
16 MB

E-core:
4 MB

[163]

24 MB

[163]

6th
generation Apple-
designed 		1398 MHz
[155] 		1.789 TFLOPS
[155] 		17 TOPS LPDDR5-6400 (3200 MHz) 51.2 GB/s September 16, 2022
A17
Pro 		APL1V02 T8130 3 nm (N3B) FinFET 19 billion 103.80 mm2
[159] 		— 3.78 GHz
[164] 		— 2.11 GHz
[164] 		7th
generation Apple-
designed 		6 24 768 2.147 TFLOPS 35 TOPS 8 GB September 22, 2023

H series

The Apple "H" series is a family of SoCs with low-power audio processing and wireless connectivity for use in headphones.

Apple H1

The Apple H1 chip was used in the second and third generation AirPods and the first generation AirPods Pro. It was also used in the Powerbeats Pro, the Beats Solo Pro, Beats Fit Pro, the 2020 Powerbeats, AirPods Max.[165] Specifically designed for headphones, it has Bluetooth 5.0, supports hands-free "Hey Siri" commands,[166] and offers 30 percent lower latency than the W1 chip used in earlier AirPods.[167]

Apple H2

The Apple H2 chip was first used in the 2022 version of AirPods Pro. It has Bluetooth 5.3, and implements 48 kHz noise reduction in hardware. The 2022 version of the H2 operates only on the 2.4 GHz frequency, while the 2023 version adds support for a number of Bluetooth service profiles in two specific frequency ranges of the 5 GHz band.[168]

Comparison of H series processors

Name Model no. Image Bluetooth First release
H1 343S00289[169]
(AirPods 2nd Generation)
343S00290[170]
(AirPods 3nd Generation)
343S00404[171]
(AirPods Max)
H1 SiP[172]
(AirPods Pro) 		     
    		5.0 March 20, 2019
H2 AirPods Pro (2nd generation) 5.3 September 7, 2022

M series

The Apple "M" series is a family of systems on a chip (SoC) used in Mac computers from November 2020 or later, iPad Pro tablets from April 2021 or later, iPad Air tablets from March 2022 or later, and Vision Pro. The "M" designation was previously used for Apple motion coprocessors.

Evolution of Apple "M" series
M1
November 10, 2020 – May 7, 2024
M1 Pro
October 18, 2021 – January 17, 2023
M1 Max
October 18, 2021 – June 5, 2023
M1 Ultra
March 8, 2022 – June 5, 2023
M2
June 6, 2022 – present
M2 Pro
January 17, 2023 – present
M2 Max
January 17, 2023 – present
M2 Ultra
June 5, 2023 – present
M3
October 30, 2023 – present
M3 Pro
October 30, 2023 – present
M3 Max
October 30, 2023 – present
M4
May 7, 2024 – present

Apple M1

Main article: Apple M1

The M1, Apple's first system on a chip designed for use in Macs, is manufactured using TSMC's 5 nm process. Announced on November 10, 2020, it is used in the MacBook Air (M1, 2020), Mac mini (M1, 2020), MacBook Pro (13-inch, M1, 2020), iMac (24-inch, M1, 2021), iPad Pro (5th generation) and iPad Air (5th generation). It comes with 4 performance cores and 4 efficiency cores, for a total of 8 CPU cores. It comes with up to 8 GPU cores, with the entry level MacBook Air having only 7 GPU cores. The M1 has 16 billion transistors.[173]

Apple M1 Pro

The M1 Pro is a more powerful version of the M1, with six to eight performance cores, two efficiency cores, 14 to 16 GPU cores, 16 Neural Engine cores, up to 32 GB unified RAM with up to 200 GB/s memory bandwidth, and more than double the transistors. It was announced on October 18, 2021, and is used in the 14- and 16-inch MacBook Pro. Apple claimed the CPU performance is about 70% faster than the M1, and that its GPU performance is about double. Apple claims the M1 Pro can deliver up to 20 streams of 4K or 7 streams of 8K ProRes video playback (up from 6 offered by Afterburner card for 2019 Mac Pro).

Apple M1 Max

The M1 Max is a larger version of the M1 Pro chip, with eight performance cores, two efficiency cores, 24 to 32 GPU cores, 16 Neural Engine cores, up to 64 GB unified RAM with up to 400 GB/s memory bandwidth, and more than double the number of transistors. It was announced on October 18, 2021, and is used in the 14- and 16-inch MacBook Pro, as well as the Mac Studio. Apple claims the M1 Max can deliver up to 30 streams of 4K (up from 23 offered by Afterburner card for 2019 Mac Pro) or 7 streams of 8K ProRes video playback.

Apple M1 Ultra

The M1 Ultra consists of two M1 Max dies connected together by a silicon interposer through Apple's UltraFusion technology.[174] It has 114 billion transistors, 16 performance cores, 4 efficiency cores, 48 to 64 GPU cores and 32 Neural Engine cores; it can be configured with up to 128 GB unified RAM of 800 GB/s memory bandwidth. It was announced on March 8, 2022, as an optional upgrade for the Mac Studio. Apple claims the M1 Ultra can deliver up to 18 streams of 8K ProRes video playback.[175]

Apple M2

Main article: Apple M2

Apple announced the M2 SoC on June 6, 2022, at WWDC, along with the new MacBook Air and the new 13-inch MacBook Pro and later the iPad Pro (6th generation) and the iPad Air (6th generation). The M2 is made with TSMC's "Enhanced 5-nanometer technology" N5P process and contains 20 billion transistors, a 25% increase from the previous generation M1. The M2 can be configured with up to 24 gigabytes of RAM and 2 terabytes of storage. It has 8 CPU cores (4 performance and 4 efficiency) and up to 10 GPU cores. The M2 also increases the memory bandwidth to 100 GB/s. Apple claims CPU improvements up to 18% and GPU improvements up to 35% compared to the previous M1.[176]

Apple M2 Pro

The M2 Pro is a more powerful version of the M2, with six to eight performance cores, four efficiency cores, 16 to 19 GPU cores, 16 Neural Engine cores, up to 32 GB unified RAM with up to 200 GB/s memory bandwidth, and double the transistors. It was announced on January 17, 2023 in a press release and it is used in the 14- and 16-inch 2023 MacBook Pro as well as the Mac Mini. Apple claims the CPU performance is 20 percent faster than the M1 Pro and the GPU is 30 percent faster than the M1 Pro.[177]

Apple M2 Max

The M2 Max is a larger version of the M2 Pro, with eight performance cores, four efficiency cores, 30 to 38 GPU cores, 16 Neural Engine cores, up to 96 GB unified RAM with up to 400 GB/s memory bandwidth, and more than double the transistors. It was announced on January 17, 2023 in a press release and it is used in the 14- and 16-inch 2023 MacBook Pro, as well as the Mac Studio.[178] Apple claims the CPU performance is 20 percent faster than M1 Max and the GPU is 30 percent faster than the M1 Max.[177]

Apple M2 Ultra

The M2 Ultra consists of two M2 Max dies connected together by a silicon interposer through Apple's UltraFusion technology. It has 134 billion transistors, 16 performance cores, 8 efficiency cores, 60 to 76 GPU cores and 32 Neural Engine cores; it can be configured with up to 192 GB unified RAM of 800 GB/s memory bandwidth. It was announced on June 5, 2023, as an optional upgrade for the Mac Studio and the sole processor for the Mac Pro. Apple claims the M2 Ultra can deliver up to 22 streams of 8K ProRes video playback.[179]

Apple M3

Main article: Apple M3

Apple announced the M3 series of chips on October 30, 2023, along with the new MacBook Pro and iMac. The M3 is based on the 3 nm process and contains 25 billion transistors, a 25% increase from the previous generation M2. It has 8 CPU cores (4 performance and 4 efficiency) and up to 10 GPU cores. Apple claims CPU improvements up to 35% and GPU improvements up to 65% compared to the M1.[180]

Apple M3 Pro

The M3 Pro is a more powerful version of the M3, with six performance cores, six efficiency cores, 14 to 18 GPU cores, 16 Neural Engine cores, up to 36 GB unified RAM with 150 GB/s memory bandwidth, and 48% more transistors. It is used in the 14- and 16-inch MacBook Pro. Apple claims the CPU performance is 30 percent faster than the M1 Pro and the GPU is 40 percent faster than the M1 Pro.[180]

Apple M3 Max

The M3 Max is a larger version of the M3 Pro, with ten or twelve performance cores, four efficiency cores, 30 to 40 GPU cores, 16 Neural Engine cores, up to 128 GB unified RAM with up to 400 GB/s memory bandwidth, and more than double the transistors. It is used in the 14- and 16-inch MacBook Pro. Apple claims the CPU performance is 80 percent faster than the M1 Max and the GPU is 50 percent faster than the M1 Max.[180]

Apple M4

Main article: Apple M4

Apple announced the M4 chip on May 7, 2024, along with the new seventh-generation iPad Pro models. The M4 is based on the N3E process rather than the N3B process used by the M3, and contains 28 billion transistors. It has three or four performance cores, six efficiency cores and ten GPU cores. Apple claims the M4 has up to 1.5x faster CPU performance compared to the M2.[181]

Comparison of M series processors

General Semiconductor technology CPU GPU AI accelerator Media Engine Memory technology First release
Name Codename
and part no. 		Image Process Transistor count
and die size 		CPU ISA Performance core Efficiency core Overall cores Cache Vendor Cores SIMD EU count FP32 ALU count Frequency FP32 FLOPS
(TFLOPS) 		Hardware-accelerated Ray Tracing Support Cores OPS Hardware Acceleration Media Decode/Encode Engine Memory bus width Total channel
Bit per channel 		Memory type Theoretical
bandwidth 		Available capacity
Core name Cores Core speed Core name Cores Core speed L1 L2 SLC Video decode Video encode ProRes decode & encode AV1 decode
M1 APL1102
T8103 		  TSMC
N5 		16 billion
118.91 mm²
[182] 		ARMv8.5-A Firestorm 4 3.20 GHz Icestorm 4 2.06 GHz 8-core P-core:
L1i: 192 KB
L1d: 128 KB

E-core:
L1i: 128 KB
L1d: 64 KB 		P-core:
12 MB

E-core:
4 MB 		8 MB 4th generation Apple-designed 7 28 896 1278 MHz 2.290 No 16 11 TOPS H264, HEVC 1 1 — — 128-bit 2 channels
64-bit/channel 		LPDDR4X-4266
(2133 MHz) 		68.25 GB/s 8 GB
16 GB 		November 17, 2020
8 32 1024 2.617
M1 Pro APL1103
T6000 		  33.7 billion
≈ 245 mm²
[183] 		6 3.23 GHz 2 P-core:
24 MB

E-core:
4 MB 		24 MB 14 56 1792 1296 MHz 4.644 H264, HEVC, ProRes, ProRes RAW 1 256-bit 2 channels
128-bit/channel 		LPDDR5-6400
(3200 MHz) 		204.8 GB/s 16 GB
32 GB 		October 26, 2021
8 10-core
16 64 2048 5.308
M1 Max APL1105
T6001
[184] 		  57 billion
≈ 432 mm²
[183] 		48 MB 24 96 3072 7.962 2 2 512-bit 4 channels
128-bit/channel 		409.6 GB/s 32 GB
64 GB
32 128 4096 10.616
M1 Ultra APL1W06
T6002 		  114 billion
≈ 864 mm² 		16 4 20-core P-core:
48 MB

E-core:
8 MB 		96 MB 48 192 6144 15.925 32 22 TOPS 2 4 4 1024-bit 8 channels
128-bit/channel 		819.2 GB/s 64 GB
128 GB 		March 18, 2022
64 256 8192 21.233
M2 APL1109
T8112 		  TSMC
N5P 		20 billion
155.25 mm²
[182] 		ARMv8.6-A Avalanche 4 3.50 GHz Blizzard 4 2.42 GHz 8-core P-core:
16 MB

E-core:
4 MB 		8 MB 5th generation Apple-designed 8 32 1024 1398 MHz 2.863 16 15.8 TOPS 1 1 1 128-bit 2 channels
64-bit/channel 		102.4 GB/s 8 GB
16 GB
24 GB 		June 24, 2022
10 40 1280 3.578 H264, HEVC —
H264, HEVC, ProRes, ProRes RAW 1
M2 Pro APL1113
T6020 		40 billion 6 10-core P-core:
32 MB

E-core:
4 MB 		24 MB 16 64 2048 5.726 256-bit 4 channels
64-bit/channel 		204.8 GB/s 16 GB
32 GB 		January 24, 2023
8 12-core 19 76 2432 6.799
M2 Max APL1111
T6021 		67 billion 3.69 GHz
[185] 		48 MB 30 120 3840 10.736 2 2 512-bit 4 channels
128-bit/channel 		409.6 GB/s 32 GB
64 GB
96 GB
38 152 4864 13.599
M2 Ultra APL1W12
T6022 		134 billion 16 ~3.00 GHz
-3.70 GHz
[185][186][187] 		8 24-core P-core:
64 MB

E-core:
8 MB 		96 MB 60 240 7680 21.473 32 31.6 TOPS 2 4 4 1024-bit 8 channels
128-bit/channel 		819.2 GB/s 64 GB
128 GB
192 GB 		June 13, 2023
76 304 9728 27.199
M3 APL1201
T8122 		TSMC
N3B 		25 billion — 4 4.05 GHz — 4 2.75 GHz 8-core P-core:
16 MB

E-core:
4 MB 		8 MB 7th generation Apple-designed 8 128 1024 1380 MHz

[188]

2.826 Yes 16 18 TOPS 1 1 1 1 128-bit 2 channels
64-bit/channel 		102.4 GB/s 8 GB
16 GB
24 GB 		November 7, 2023
10 160 1280 3.533
M3 Pro APL1203
T6030 		37 billion 5 6 11-core 12 MB 14 224 1792 4.946 192-bit 3 channels
64-bit/channel 		153.6 GB/s 18 GB
36 GB
6 12-core 18 288 2304 6.359
M3 Max T6034/T6031 92 billion 10 4 14-core P-core:
32 MB

E-core:
4 MB 		48 MB 30 480 3840 10.598 2 2 384-bit 3 channels
128-bit/channel 		307.2 GB/s 36 GB
96 GB
12 16-core 40 640 5120 14.131 512-bit 4 channels
128-bit/channel 		409.6 GB/s 48 GB
64 GB
128 GB
M4 TSMC
N3E 		28 billion ARMv9

[189]

3 4.40 GHz 6 2.85 GHz 9-core P-core:
16 MB

E-core:
4 MB 		10 160 1280 38 TOPS 1 1 128-bit 2 channels
64-bit/channel 		LPDDR5X-7500 (3750 MHz) 120 GB/s 8 GB May 15, 2024
4 10-core 16 GB

R series

Apple R1

The Apple R1 was announced by Apple on June 5, 2023 at its Worldwide Developers Conference. It is used in the Apple Vision Pro headset. The Apple R1 is dedicated to the real time processing of sensor inputs and delivering extremely low-latency images to the displays.

S series

The Apple "S" series is a family of systems in a package (SiP) used in the Apple Watch and HomePod. It uses a customized application processor that together with memory, storage and support processors for wireless connectivity, sensors, and I/O form a complete computer in a single package. They are designed by Apple and manufactured by contract manufacturers such as Samsung.

Apple S1

Main article: Apple S1

The Apple S1 is an integrated computer. It includes memory, storage and support circuits like wireless modems and I/O controllers in a sealed integrated package. It was announced on September 9, 2014, as part of the "Wish we could say more" event. It was used in the first-generation Apple Watch.[190]

Apple S1P

Used in Apple Watch Series 1. It has a dual-core processor identical to the S2, with the exception of the built-in GPS receiver. It contains the same dual-core CPU with the same new GPU capabilities as the S2, making it about 50% faster than the S1.[191][192]

Apple S2

Main article: Apple S2

Used in the Apple Watch Series 2. It has a dual-core processor and a built-in GPS receiver. The S2's two cores deliver 50% higher performance and the GPU delivers twice as much as the predecessor,[193] and is similar in performance to the Apple S1P.[194]

Apple S3

Used in the Apple Watch Series 3. It has a dual-core processor that is 70% faster than the Apple S2 and a built-in GPS receiver.[195] There is also an option for a cellular modem and an internal eSIM module.[195] It also includes the W2 chip.[195] The S3 also contains a barometric altimeter, the W2 wireless connectivity processor, and in some models UMTS (3G) and LTE (4G) cellular modems served by a built-in eSIM.[195]

Apple S4

Used in the Apple Watch Series 4. It introduced 64-bit ARMv8 cores to the Apple Watch through two Tempest cores,[196][197] which are also found in the A12 as energy-efficient cores. Despite its small size, Tempest uses a 3-wide decode out-of-order superscalar design, which makes it much more powerful than preceding in-order cores.

The S4 contains a Neural Engine that is able to run Core ML.[198] Third-party apps can use it starting from watchOS 6. The SiP also includes new accelerometer and gyroscope functionality that has twice the dynamic range in measurable values of its predecessor, as well as being able to sample data at 8 times the speed.[199]It contains the W3 wireless chip, which supports Bluetooth 5. It also contains a new custom GPU, which can use the Metal API.[200]

Apple S5

Used in the Apple Watch Series 5, Watch SE, and HomePod mini.[201] It adds a built-in magnetometer to the custom 64-bit dual-core processor and GPU of the S4.[202]

Apple S6

Used in the Apple Watch Series 6. It has a custom 64-bit dual-core processor that runs up to 20 percent faster than the S5.[203][204] The dual cores in the S6 are based on the A13's energy-efficient "little" Thunder cores at 1.8 GHz.[205] Like the S4 and S5, it also contains the W3 wireless chip.[204] The S6 adds the new U1 ultra wideband chip, an always-on altimeter, and 5 GHz WiFi.[203][204]

Apple S7

Used in the Apple Watch Series 7 and second-generation HomePod. The S7 has the same T8301 identifier and quoted performance as the S6.[206]

Apple S8

Used in the Apple Watch SE (2nd generation), Watch Series 8, and Watch Ultra. The S8 adds a new three-axis gyroscope and high g-force accelerometer.[207] It has the same T8301 identifier and quoted performance as the S6 and S7.[208]

Apple S9

Used in the Apple Watch Series 9 and Watch Ultra 2. The S9 has a new dual-core CPU with 60 percent more transistors than the S8, and a new four-core Neural Engine.[209]

Comparison of S series processors

Name Model no. Image Semiconductor technology Die size CPU ISA CPU CPU cache GPU Memory technology Modem First release
S1 APL
0778
[210] 		  28 nm Hκ MG[211][212] 32 mm2[211] ARMv7k[212][213] 520 MHz single-core Cortex-A7[212] L1d: 32 KB[214]
L2: 256 KB[214] 		PowerVR Series 5[212][215] LPDDR3[216] April 24, 2015
S1P TBC   TBC ARMv7k[217][191][193] 520 MHz dual-core Cortex-A7[217] L1d: 32 KB[214] PowerVR Series 6 'Rogue'[217] LPDDR3 September 12, 2016
S2  
S3   ARMv7k[218] Dual-core TBC LPDDR4 Qualcomm MDM9635M
Snapdragon X7 LTE 		September 22, 2017
S4   7 nm (TSMC N7) TBC ARMv8-A ILP32[219][220] 1.59 GHz Dual-core Tempest L1d: 32 KB[212]
L2: 2 MB[212] 		Apple G11M[220] TBC September 21, 2018
S5   September 20, 2019
S6   7 nm (TSMC N7P) TBC 1.8 GHz Dual-core Thunder L1d: 48 KB[221]
L2: 4 MB[222] 		TBC September 18, 2020
S7   October 15, 2021
S8   September 16, 2022
S9   4 nm (TSMC N4P)[223] Dual-core Sawtooth L1d: 64 KB
L2: 4 MB[224] 		September 22, 2023

T series

The T series chip operates as a secure enclave on Intel-based MacBook and iMac computers released from 2016 onwards. The chip processes and encrypts biometric information (Touch ID) and acts as a gatekeeper to the microphone and FaceTime HD camera, protecting them from hacking. The chip runs bridgeOS, a purported variant of watchOS.[225] The functions of the T series processor were built into the M series CPUs, thus ending the need for the T series.

Apple T1

The Apple T1 chip is an ARMv7 SoC (derived from the processor in the Apple Watch's S2) that drives the System Management Controller (SMC) and Touch ID sensor of the 2016 and 2017 MacBook Pro with Touch Bar.[226]

Apple T2

Main article: Apple T2

The Apple T2 security chip is a SoC first released in the iMac Pro. It is a 64-bit ARMv8 chip (a variant of the A10 Fusion, or T8010).[227] It provides a secure enclave for encrypted keys, enables users to lock down the computer's boot process, handles system functions like the camera and audio control, and handles on-the-fly encryption and decryption for the solid-state drive.[228][229][230] T2 also delivers "enhanced imaging processing" for the iMac Pro's FaceTime HD camera.[231][232]

Comparison of T series processors

Name Model no. Image Semiconductor technology Die size CPU ISA CPU CPU cache GPU Memory technology First release
Memory bandwidth
T1 APL
1023
[233] 		  Same as S2 TBC ARMv7 TBD November
12, 2016
T2 APL
1027
[234] 		  TSMC 16 nm FinFET.[235] 104 mm2[235] ARMv8-A
ARMv7-A 		2× Hurricane
2× Zephyr
+ Cortex-A7 		L1i: 64 KB
L1d: 64 KB
L2: 3 MB[235] 		3× cores[235] LP-DDR4[235] December
14, 2017

U series

The Apple "U" series is a family of systems in a package (SiP) implementing ultra-wideband (UWB) radio.

Apple U1

The Apple U1 is used in the iPhone 11 series through the iPhone 14 series (excluding the second and third generation iPhone SE); Apple Watch Series 6 through the Apple Watch Series 8 and Apple Watch Ultra (1st generation); HomePod (2nd generation) and HomePod Mini; AirTag trackers; and the charging case for AirPods Pro (2nd generation).[236]

Apple U2

The Apple U2 (referred to by Apple as its "Second-generation Ultra Wideband chip") is used in the iPhone 15 series, Apple Watch Series 9, and Apple Watch Ultra 2.

Comparison of U series processors

Name Model no. Image CPU Semiconductor technology First release
U1 TMK

A75
[237]

  Cortex-M4
ARMv7E-M[238] 		16 nm FinFET
(TSMC 16FF) 		September 20, 2019
U2 September 22, 2023

W series

The Apple "W" series is a family of RF SoCs used for Bluetooth and Wi-Fi connectivity.

Apple W1

The Apple W1 is a SoC used in the 2016 AirPods and select Beats headphones.[239][240] It maintains a Bluetooth[241] Class 1 connection with a computer device and decodes the audio stream that is sent to it.[242]

Apple W2

The Apple W2, used in the Apple Watch Series 3, is integrated into the Apple S3 SiP. Apple claimed the chip makes Wi-Fi 85% faster and allows Bluetooth and Wi-Fi to use half the power of the W1 implementation.[195]

Apple W3

The Apple W3 is used in the Apple Watch Series 4,[243] Series 5,[244] Series 6,[204] SE (1st generation),[204] Series 7, Series 8, SE (2nd generation), Ultra, Series 9 and Ultra 2. It is integrated into the Apple S4, S5, S6, S7, S8 and S9 SiPs. It supports Bluetooth 5.0/5.3.

Comparison of W series processors

Name Model no. Image Semiconductor technology Die size CPU ISA CPU CPU cache Memory technology Bluetooth First release
Memory bandwidth
W1 343S00130[245]
343S00131[245] 		  TBC 14.3
 mm2
[245] 		TBC 4.2 December
13, 2016
W2 338S00348[246]   TBC September
22, 2017
W3 338S00464[247]   5.0/5.3 September
21, 2018

M series coprocessors

Main article: Apple motion coprocessors

The Apple M-series coprocessors are motion coprocessors used by Apple Inc. in their mobile devices. First released in 2013, their function is to collect sensor data from integrated accelerometers, gyroscopes and compasses and offload the collecting and processing of sensor data from the main central processing unit (CPU).

Only the M7 and M8 coprocessors were housed on separate chips; the M9, M10, and M11 coprocessors were embedded in their corresponding A-series chips. Beginning with the A12 Bionic chip in 2018, the motion coprocessors were fully integrated into the SoC; this allowed Apple to reuse the "M"-series codename for their desktop SoCs.

Comparison of M series coprocessors

Name Model no. Image Semiconductor technology CPU ISA CPU First release
Apple M7 LPC18A1   90 nm ARMv7-M 150 MHz Cortex-M3 September
10, 2013
Apple M8 LPC18B1   September
9, 2014

Miscellaneous devices

This segment is about Apple-designed processors that are not easily sorted into another section.

Early series

See also: Early iPhone systems-on-chip

Apple first used SoCs in early versions of the iPhone and iPod Touch. They combine in one package a single ARM-based processing core (CPU), a graphics processing unit (GPU), and other electronics necessary for mobile computing.

The APL0098 (also 8900B[248] or S5L8900) is a package on package (PoP) system on a chip (SoC) that was introduced on June 29, 2007, at the launch of the original iPhone. It includes a 412 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 90 nm process.[11] The iPhone 3G and the first-generation iPod Touch also use it.[249]

The APL0278[250] (also S5L8720) is a PoP SoC introduced on September 9, 2008, at the launch of the second-generation iPod Touch. It includes a 533 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 65 nm process.[11][249]

The APL0298 (also S5L8920) is a PoP SoC introduced on June 8, 2009, at the launch of the iPhone 3GS. It includes a 600 MHz single-core Cortex-A8 CPU and a PowerVR SGX535 GPU. It was manufactured by Samsung on a 65 nm process.[107]

The APL2298 (also S5L8922) is a 45 nm die shrunk version of the iPhone 3GS SoC[11] and was introduced on September 9, 2009, at the launch of the third-generation iPod Touch.

Other

The Samsung S5L8747 is an ARM-based microcontroller used in Apple's Lightning Digital AV Adapter, a Lightning-to-HDMI adapter. This is a miniature computer with 256 MB RAM, running an XNU kernel loaded from the connected iPhone, iPod Touch, or iPad, then taking a serial signal from the iOS device translating that into a proper HDMI signal.[251][252]

Model no. Image First release CPU ISA Specs Application Utilizing devices Operating system
339S0196   September 2012 Unknown

ARM

256 MB
RAM 		Lightning to
HDMI conversion 		Apple Digital
AV Adapter 		XNU

See also

Similar platforms

Notes

  1. ^ 1 core locked
  2. ^ Single-core due to locked core
  3. ^ 64-bit due to unused channel
  4. ^ 1 channel unused
  5. ^ Only 2 cores performed at a same time
  6. ^ Only 3 cores performed at a same time
  7. ^ 1 efficiency core disabled in Apple TV 4K 3rd Gen

References

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  2. ^ Warren, Tom (June 22, 2020). "Apple is switching Macs to its own processors starting later this year". The Verge. from the original on June 22, 2020. Retrieved June 22, 2020.
  3. ^ "The Most Important Apple Executive You've Never Heard Of". Bloomberg News. from the original on March 31, 2019. Retrieved June 18, 2016.
  4. ^ Lovejoy, Ben (July 18, 2016). "Apple reportedly dropping Samsung for not only A10 in iPhone 7 but also A11 in iPhone 8". 9to5Mac. from the original on July 3, 2020. Retrieved July 1, 2020.
  5. ^ Clark, Don (April 5, 2010). "Apple iPad Taps Familiar Component Suppliers". The Wall Street Journal. from the original on September 19, 2018. Retrieved April 15, 2010.
  6. ^ Boldt, Paul; Scansen, Don; Whibley, Tim (June 16, 2010). "Apple's A4 dissected, discussed...and tantalizing". EE Times. from the original on October 22, 2021. Retrieved October 22, 2021.
  7. ^ (PDF). Archived from the original (PDF) on July 4, 2010. Retrieved July 7, 2010.
  8. ^ a b "Apple Launches iPad" (Press release). Apple. January 27, 2010. from the original on May 25, 2017. Retrieved January 28, 2010.
  9. ^ Wiens, Kyle (April 5, 2010). "Apple A4 Teardown". iFixit. Step 20. from the original on June 23, 2020. Retrieved June 19, 2020. It's clear from both hardware and software that this is a single core processor, so it must be the ARM Cortex A8, and NOT the rumored multicore A9.
  10. ^ Melanson, Donald (February 23, 2010). "iPad confirmed to use PowerVR SGX graphics". Engadget. from the original on December 7, 2012. Retrieved August 24, 2017.
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January 01, 1970
apple, silicon, refers, series, system, chip, system, package, processors, designed, apple, mainly, using, architecture, they, basis, iphone, ipad, apple, apple, watch, airpods, airtag, homepod, apple, vision, devices, bionic, chip, apple, announced, plan, swi. Apple silicon refers to a series of system on a chip SoC and system in a package SiP processors designed by Apple Inc mainly using the ARM architecture They are the basis of Mac iPhone iPad Apple TV Apple Watch AirPods AirTag HomePod and Apple Vision Pro devices The A16 Bionic chip Apple announced its plan to switch Mac computers from Intel processors to Apple silicon at WWDC 2020 on June 22 2020 1 2 The first Macs built with the Apple M1 chip were unveiled on November 10 2020 As of June 2023 the entire Mac lineup uses Apple silicon chips Apple fully controls the integration of Apple silicon chips with the company s hardware and software products Johny Srouji is in charge of Apple s silicon design 3 Manufacturing of the chips is outsourced to semiconductor contract manufacturers such as TSMC Contents 1 A series 1 1 Apple A4 1 2 Apple A5 1 3 Apple A5X 1 4 Apple A6 1 5 Apple A6X 1 6 Apple A7 1 7 Apple A8 1 8 Apple A8X 1 9 Apple A9 1 10 Apple A9X 1 11 Apple A10 Fusion 1 12 Apple A10X Fusion 1 13 Apple A11 Bionic 1 14 Apple A12 Bionic 1 15 Apple A12X Bionic 1 15 1 Apple A12Z Bionic 1 16 Apple A13 Bionic 1 17 Apple A14 Bionic 1 18 Apple A15 Bionic 1 19 Apple A16 Bionic 1 20 Apple A17 Pro 1 21 Comparison of A series processors 2 H series 2 1 Apple H1 2 2 Apple H2 2 3 Comparison of H series processors 3 M series 3 1 Apple M1 3 1 1 Apple M1 Pro 3 1 2 Apple M1 Max 3 1 3 Apple M1 Ultra 3 2 Apple M2 3 2 1 Apple M2 Pro 3 2 2 Apple M2 Max 3 2 3 Apple M2 Ultra 3 3 Apple M3 3 3 1 Apple M3 Pro 3 3 2 Apple M3 Max 3 4 Apple M4 3 5 Comparison of M series processors 4 R series 4 1 Apple R1 5 S series 5 1 Apple S1 5 1 1 Apple S1P 5 2 Apple S2 5 3 Apple S3 5 4 Apple S4 5 5 Apple S5 5 6 Apple S6 5 7 Apple S7 5 8 Apple S8 5 9 Apple S9 5 10 Comparison of S series processors 6 T series 6 1 Apple T1 6 2 Apple T2 6 3 Comparison of T series processors 7 U series 7 1 Apple U1 7 2 Apple U2 7 3 Comparison of U series processors 8 W series 8 1 Apple W1 8 2 Apple W2 8 3 Apple W3 8 4 Comparison of W series processors 9 M series coprocessors 9 1 Comparison of M series coprocessors 10 Miscellaneous devices 10 1 Early series 10 2 Other 11 See also 11 1 Similar platforms 12 Notes 13 References 14 Further readingA seriesEvolution of Apple A series A4March 12 2010 September 10 2013 A5March 2 2011 October 4 2016 A5XMarch 7 October 23 2012 A6September 12 2012 September 9 2015 A6XOctober 23 2012 October 22 2013March 18 October 16 2014 A7September 10 2013 March 21 2017 A8September 9 2014 October 18 2022 A8XOctober 16 2014 March 21 2017 A9September 9 2015 September 12 2018 A9XNovember 9 2015 June 5 2017 A10 FusionSeptember 7 2016 May 10 2022 A10X FusionJune 5 2017 April 20 2021 A11 BionicSeptember 12 2017 April 15 2020 A12 BionicSeptember 12 2018 October 18 2022 A12X BionicOctober 30 2018 March 18 2020 A13 BionicSeptember 10 2019 present A12Z BionicMarch 18 2020 April 20 2021 A14 BionicSeptember 15 2020 present A15 BionicSeptember 14 2021 present A16 BionicSeptember 7 2022 present A17 ProSeptember 12 2023 present The A series is a family of SoCs used in the iPhone certain iPad models and the Apple TV A series chips were also used in the discontinued iPod Touch line and the original HomePod They integrate one or more ARM based processing cores CPU a graphics processing unit GPU cache memory and other electronics necessary to provide mobile computing functions within a single physical package 4 Apple A4 Main article Apple A4 The Apple A4 is a PoP SoC manufactured by Samsung the first SoC Apple designed in house 5 It combines an ARM Cortex A8 CPU also used in Samsung s S5PC110A01 SoC 6 7 and a PowerVR SGX 535 graphics processor GPU 8 9 10 all built on Samsung s 45 nanometer silicon chip fabrication process 11 12 The design emphasizes power efficiency 13 The A4 commercially debuted in 2010 in Apple s iPad tablet 8 and was later used in the iPhone 4 smartphone 14 the fourth generation iPod Touch and the 2nd generation Apple TV 15 The Cortex A8 core used in the A4 dubbed Hummingbird is thought to use performance improvements developed by Samsung in collaboration with chip designer Intrinsity which was subsequently acquired by Apple 16 17 It can run at far higher clock rates than other Cortex A8 designs yet remains fully compatible with the design provided by ARM 18 The A4 runs at different speeds in different products 1 GHz in the first iPads 19 800 MHz in the iPhone 4 and fourth generation iPod Touch and an undisclosed speed in the 2nd generation Apple TV The A4 s SGX535 GPU could theoretically push 35 million polygons per second and 500 million pixels per second although real world performance may be considerably less 20 Other performance improvements include additional L2 cache The A4 processor package does not contain RAM but supports PoP installation The 1st generation iPad fourth generation iPod Touch 21 and the 2nd generation Apple TV 22 have an A4 mounted with two low power 128 MB DDR SDRAM chips totaling 256 MB while the iPhone 4 has two 256 MB packages for a total of 512 MB 23 24 25 The RAM is connected to the processor using ARM s 64 bit wide AMBA 3 AXI bus To give the iPad high graphics bandwidth the width of the RAM data bus is double that used in previous ARM11 and ARM9 based Apple devices 26 Apple A5 Main article Apple A5 The Apple A5 is an SoC manufactured by Samsung 27 that replaced the A4 The chip commercially debuted with the release of Apple s iPad 2 tablet in March 2011 28 followed by its release in the iPhone 4S smartphone later that year Compared to the A4 the A5 CPU can do twice the work and the GPU has up to nine times the graphics performance 29 according to Apple The A5 contains a dual core ARM Cortex A9 CPU 30 with ARM s advanced SIMD extension marketed as NEON and a dual core PowerVR SGX543MP2 GPU This GPU can push between 70 and 80 million polygons second and has a pixel fill rate of 2 billion pixels second The iPad 2 s technical specifications page says the A5 is clocked at 1 GHz 31 though it can adjust its frequency to save battery life 30 32 The clock speed of the unit used in the iPhone 4S is 800 MHz Like the A4 the A5 process size is 45 nm 33 An updated 32 nm version of the A5 processor was used in the 3rd generation Apple TV the fifth generation iPod Touch the iPad Mini and the new version of iPad 2 version iPad2 4 34 The chip in the Apple TV has one core locked 35 36 Markings on the square package indicate that it is named APL2498 and in software the chip is called S5L8942 The 32 nm variant of the A5 provides around 15 better battery life during web browsing 30 better when playing 3D games and about 20 better battery life during video playback 37 In March 2013 Apple released an updated version of the 3rd generation Apple TV Rev A model A1469 containing a smaller single core version of the A5 processor Unlike the other A5 variants this version of the A5 is not a PoP having no stacked RAM The chip is very small just 6 1 6 2 mm but as the decrease in size is not due to a decrease in feature size it is still on a 32 nm fabrication process this indicates that this A5 revision is of a new design 38 Markings tell that it is named APL7498 and in software the chip is called S5L8947 39 40 Apple A5X Main article Apple A5X The Apple A5X is an SoC announced on March 7 2012 at the launch of the third generation iPad It is a high performance variant of the Apple A5 Apple claims it has twice the graphics performance of the A5 41 It was superseded in the fourth generation iPad by the Apple A6X processor The A5X has a quad core graphics unit PowerVR SGX543MP4 instead of the previous dual core as well as a quad channel memory controller that provides a memory bandwidth of 12 8 GB s roughly three times more than in the A5 The added graphics cores and extra memory channels add up to a very large die size of 165 mm 42 for example twice the size of Nvidia Tegra 3 43 This is mainly due to the large PowerVR SGX543MP4 GPU The clock frequency of the dual ARM Cortex A9 cores have been shown to operate at the same 1 GHz frequency as in A5 44 The RAM in A5X is separate from the main CPU package 45 Apple A6 Main article Apple A6 The Apple A6 is a PoP SoC introduced on September 12 2012 at the launch of the iPhone 5 then a year later was inherited by its minor successor the iPhone 5C Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A5 46 It is 22 smaller and draws less power than the 45 nm A5 47 The A6 is said to use a 1 3 GHz 48 custom 49 Apple designed ARMv7 based dual core CPU called Swift 50 rather than a licensed CPU from ARM like in previous designs and an integrated 266 MHz triple core PowerVR SGX 543MP3 51 graphics processing unit GPU The Swift core in the A6 uses a new tweaked instruction set ARMv7s featuring some elements of the ARM Cortex A15 such as support for the Advanced SIMD v2 and VFPv4 49 The A6 is manufactured by Samsung on a high k metal gate HKMG 32 nm process 52 Apple A6X Main article Apple A6X Apple A6X is an SoC introduced at the launch of the fourth generation iPad on October 23 2012 It is a high performance variant of the Apple A6 Apple claims the A6X has twice the CPU performance and up to twice the graphics performance of its predecessor the Apple A5X 53 Like the A6 this SoC continues to use the dual core Swift CPU but it has a new quad core GPU quad channel memory and slightly higher 1 4 GHz CPU clock rate 54 It uses an integrated quad core PowerVR SGX 554MP4 graphics processing unit GPU running at 300 MHz and a quad channel memory subsystem 54 55 Compared to the A6 the A6X is 30 larger but it continues to be manufactured by Samsung on a high k metal gate HKMG 32 nm process 55 Apple A7 Main article Apple A7 The Apple A7 is a 64 bit PoP SoC whose first appearance was in the iPhone 5S which was introduced on September 10 2013 The chip would also be used in the iPad Air iPad Mini 2 and iPad Mini 3 Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A6 56 The Apple A7 chip is the first 64 bit chip to be used in a smartphone and later a tablet computer 57 The A7 features an Apple designed 1 3 58 1 4 59 GHz 64 bit 60 ARMv8 A 61 62 dual core CPU 58 called Cyclone 61 and an integrated PowerVR G6430 GPU in a four cluster configuration 63 The ARMv8 A architecture doubles the number of registers of the A7 compared to the A6 64 It now has 31 general purpose registers that are each 64 bits wide and 32 floating point NEON registers that are each 128 bits wide 60 The A7 is manufactured by Samsung on a high k metal gate HKMG 28 nm process 65 and the chip includes over 1 billion transistors on a die 102 mm2 in size 58 Apple A8 Main article Apple A8 The Apple A8 is a 64 bit PoP SoC manufactured by TSMC Its first appearance was in the iPhone 6 and iPhone 6 Plus which were introduced on September 9 2014 66 A year later it would drive the iPad Mini 4 Apple states that it has 25 more CPU performance and 50 more graphics performance while drawing only 50 of the power compared to its predecessor the Apple A7 67 On February 9 2018 Apple released the HomePod which is powered by an Apple A8 with 1 GB of RAM 68 The A8 features an Apple designed 1 4 69 GHz 64 bit 70 ARMv8 A 70 dual core CPU and an integrated custom PowerVR GX6450 GPU in a four cluster configuration 69 The GPU features custom shader cores and compiler 71 The A8 is manufactured on a 20 nm process 72 by TSMC 73 which replaced Samsung as the manufacturer of Apple s mobile device processors It contains 2 billion transistors Despite that being double the number of transistors compared to the A7 its physical size has been reduced by 13 to 89 mm2 consistent with a shrink only not known to be a new microarchitecture 74 Apple A8X Main article Apple A8X The Apple A8X is a 64 bit SoC introduced at the launch of the iPad Air 2 on October 16 2014 75 It is a high performance variant of the Apple A8 Apple states that it has 40 more CPU performance and 2 5 times the graphics performance of its predecessor the Apple A7 75 76 Unlike the A8 this SoC uses a triple core CPU a new octa core GPU dual channel memory and slightly higher 1 5 GHz CPU clock rate 77 It uses an integrated custom octa core PowerVR GXA6850 graphics processing unit GPU running at 450 MHz and a dual channel memory subsystem 77 It is manufactured by TSMC on their 20 nm fabrication process and consists of 3 billion transistors Apple A9 Main article Apple A9 The Apple A9 is a 64 bit ARM based SoC that first appeared in the iPhone 6S and 6S Plus which were introduced on September 9 2015 78 Apple states that it has 70 more CPU performance and 90 more graphics performance compared to its predecessor the Apple A8 78 It is dual sourced a first for an Apple SoC it is manufactured by Samsung on their 14 nm FinFET LPE process and by TSMC on their 16 nm FinFET process It was subsequently included in the first generation iPhone SE and the iPad 5th generation The Apple A9 was the last CPU that Apple manufactured through a contract with Samsung as all A series chips after are manufactured by TSMC Apple A9X Main article Apple A9X The Apple A9X is a 64 bit SoC that was announced on September 9 2015 and released on November 11 2015 and first appeared in the iPad Pro 79 It offers 80 more CPU performance and two times the GPU performance of its predecessor the Apple A8X It is manufactured by TSMC using a 16 nm FinFET process 80 Apple A10 Fusion Main article Apple A10 The Apple A10 Fusion is a 64 bit ARM based SoC that first appeared in the iPhone 7 and 7 Plus which were introduced on September 7 2016 81 The A10 is also featured in the sixth generation iPad seventh generation iPad and seventh generation iPod Touch 82 It has a new ARM big LITTLE quad core design with two high performance cores and two smaller highly efficient cores It is 40 faster than the A9 with 50 faster graphics It is manufactured by TSMC on their 16 nm FinFET process Apple A10X Fusion Main article Apple A10X The Apple A10X Fusion is a 64 bit ARM based SoC that first appeared in the 10 5 iPad Pro and the second generation of the 12 9 iPad Pro which were both announced on June 5 2017 83 It is a variant of the A10 and Apple claims that it has 30 percent faster CPU performance and 40 percent faster GPU performance than its predecessor the A9X 83 On September 12 2017 Apple announced that the Apple TV 4K would be powered by an A10X chip It is made by TSMC on their 10 nm FinFET process 84 Apple A11 Bionic Main article Apple A11 The Apple A11 Bionic is a 64 bit ARM based SoC 85 that first appeared in the iPhone 8 iPhone 8 Plus and iPhone X which were introduced on September 12 2017 85 It has two high performance cores which are 25 faster than the A10 Fusion four high efficiency cores which are 70 faster than the energy efficient cores in the A10 and for the first time an Apple designed three core GPU with 30 faster graphics performance than the A10 85 86 It is also the first A series chip to feature Apple s Neural Engine which enhances artificial intelligence and machine learning processes 87 Apple A12 Bionic Main article Apple A12 The Apple A12 Bionic is a 64 bit ARM based SoC that first appeared in the iPhone XS XS Max and XR which were introduced on September 12 2018 It is also used in the third generation iPad Air fifth generation iPad Mini and the eighth generation iPad It has two high performance cores which are 15 faster than the A11 Bionic and four high efficiency cores which have 50 lower power usage than the energy efficient cores in the A11 Bionic 88 The A12 is manufactured by TSMC 89 using a 7 nm 90 FinFET process the first to ship in a smartphone 91 89 It is also used in the 6th generation Apple TV Apple A12X Bionic Main article Apple A12X The Apple A12X Bionic is a 64 bit ARM based SoC that first appeared in the 11 0 iPad Pro and the third generation of the 12 9 iPad Pro which were both announced on October 30 2018 92 It offers 35 faster single core and 90 faster multi core CPU performance than its predecessor the A10X It has four high performance cores and four high efficiency cores The A12X is manufactured by TSMC using a 7 nm FinFET process Apple A12Z Bionic The Apple A12Z Bionic is an updated version of the A12X Bionic first appearing in the fourth generation iPad Pro which was announced on March 18 2020 93 It adds an additional GPU core compared to the A12X for improved graphics performance 94 The A12Z is also used in the Developer Transition Kit prototype computer that helps developers prepare their software for Macs based on Apple silicon 95 Apple A13 Bionic Main article Apple A13 The Apple A13 Bionic is a 64 bit ARM based SoC that first appeared in the iPhone 11 11 Pro and 11 Pro Max which were introduced on September 10 2019 It is also featured in the second generation iPhone SE released April 15 2020 the 9th generation iPad announced September 14 2021 and in the Studio Display announced March 8 2022 The entire A13 SoC features a total of 18 cores a six core CPU four core GPU and an eight core Neural Engine processor which is dedicated to handling on board machine learning processes four of the six cores on the CPU are low powered cores that are dedicated to handling less CPU intensive operations such as voice calls browsing the Web and sending messages while two higher performance cores are used only for more CPU intensive processes such as recording 4K video or playing a video game 96 Apple A14 Bionic Main article Apple A14 The Apple A14 Bionic is a 64 bit ARM based SoC that first appeared in the fourth generation iPad Air and iPhone 12 released on October 23 2020 It is the first commercially available 5 nm chipset and it contains 11 8 billion transistors and a 16 core AI processor 97 It includes Samsung LPDDR4X DRAM a 6 core CPU and 4 Core GPU with real time machine learning capabilities It was later used in the tenth generation iPad released on October 26 2022 Apple A15 Bionic Main article Apple A15 The Apple A15 Bionic is a 64 bit ARM based SoC that first appeared in the iPhone 13 unveiled on September 14 2021 The A15 is built on a 5 nanometer manufacturing process with 15 billion transistors It has 2 high performance processing cores 4 high efficiency cores a new 5 core graphics for iPhone 13 Pro series 4 core for iPhone 13 and 13 mini processing unit and a new 16 core Neural Engine capable of 15 8 trillion operations per second 98 99 It is also used in the iPhone SE 3rd generation iPhone 14 iPhone 14 Plus and iPad Mini 6 100 Apple A16 Bionic Main article Apple A16 The Apple A16 Bionic is a 64 bit ARM based SoC that first appeared in the iPhone 14 Pro unveiled on September 7 2022 The A16 has 16 billion transistors and is built on TSMC s N4P fabrication process being touted by Apple as the first 4 nm processor in a smartphone 101 102 However N4 is an enhanced version of N5 technology a de facto fourth generation 5 nm manufacturing process 103 104 105 The chip has 2 high performance processing cores 4 high efficiency cores and 5 core graphics for iPhone 14 Pro series Memory is upgraded to LPDDR5 for 50 higher bandwidth and a 7 faster 16 core Neural Engine capable of 17 trillion operations per second Apple A17 Pro Main article Apple A17 The Apple A17 Pro is a 64 bit ARM based SoC that first appeared in the iPhone 15 Pro unveiled on September 12 2023 It is Apple s first 3 nm SoC The chip has 2 high performance processing cores 4 high efficiency cores a 6 core GPU for iPhone 15 Pro series and a 16 core Neural Engine capable of 35 trillion operations per second The GPU was described as their biggest redesign in the history of Apple GPUs it added hardware accelerated ray tracing and mesh shading support 106 Comparison of A series processors General Semiconductor technology Computer architecture CPU GPU AI accelerator Memory technology First release Name Codename Part No Image Node Manufacturer Transistors count Die size CPU ISA Bit width Performance core Efficiency core Overall cores Cache Vendor Cores SIMD EU count FP32 ALU count Frequency FP32 FLOPS Cores OPS Memory bus width Total channelBit per channel Memory type Theoreticalbandwidth Available capacity Core name Cores Core speed Core name Cores Core speed L1 L2 L3 SLC APL0098 S5L8900 nbsp 90 nm 107 Samsung 72 mm2 11 ARMv6 32 bit ARM11 1 412 MHz Single core L1i 16 KBL1d 16 KB PowerVRMBX Lite 1 1 8 60 MHz 103 MHz 0 96 GFLOPS 1 64 GFLOPS 16 bit 1 channel16 bit channel LPDDR 266 133 25 MHz 533 MB s 128 MB June 29 2007 APL0278 S5L8720 nbsp 65 nm 11 36 mm2 11 533 MHz 103 MHz 133 MHz 1 64 GFLOPs 2 12 GFLOPS 32 bit 1 channel32 bit channel 1066 MB s July 11 2008 APL0298 S5L8920 nbsp 71 8 mm2 12 ARMv7 Cortex A8 600 MHz L1i 32 KBL1d 32 KB 256 KB PowerVRSGX535 108 2 16 200 MHz 6 4 GFLOPS LPDDR 400 200 MHz 1 6 GB s 256 MB June 19 2009 APL2298 S5L8922 nbsp 45 nm 11 12 33 41 6 mm2 11 September 9 2009 A4 APL0398 S5L8930 nbsp 53 3 mm2 11 12 800 MHz 512 KB 200 MHz 250 MHz 6 4 GFLOPS 8 0 GFLOPS 64 bit 2 channels32 bit channel 3 2 GB s April 3 2010 1 0 GHz 800 MHz 512 MB A5 APL0498 S5L8940 nbsp 122 2 mm2 33 Cortex A9 2 800 MHz Dual core 1 MB PowerVRSGX543 109 51 2 4 32 200 MHz 12 8 GFLOPS LPDDR2 800 400 MHz 6 4 GB s March 11 2011 1 0 GHz APL2498 S5L8942 nbsp 32 nmHk MG 34 40 69 6 mm2 34 800 MHz March 7 2012 1 0 GHz 2 a Dual core b APL7498 S5L8947 nbsp 37 8 mm2 40 1 Single core January 28 2013 A5X APL5498 S5L8945 nbsp 45 nm 11 12 33 165 mm2 42 2 Dual core 4 8 64 25 6 GFLOPS 128 bit 4 channels32 bit channel 12 8 GB s 1 GB March 16 2012 A6 APL0598 S5L8950 nbsp 32 nmHk MG 52 110 55 96 71 mm2 52 110 ARMv7s 111 Swift 49 1 3 GHz 112 3 6 48 266 or 709 MHz 25 5 or 68 0 GFLOPS 64 bit 2 channels32 bit channel LPDDR2 1066 533 MHz 8 5 GB s September 21 2012 A6X APL5598 S5L8955 nbsp 123 mm2 55 1 4 GHz 54 PowerVRSGX554 54 113 4 16 128 300 MHz 76 8 GFLOPS 128 bit 4 channels32 bit channel 17 0 GB s November 2 2012 A7 APL0698 S5L8960 nbsp 28 nmHk MG 65 114 1 billion 102 mm2 60 114 ARMv8 0 A 61 69 64 bit Cyclone 1 3 GHz L1i 64 KBL1d 64 KB 4 MB Inclusive 61 115 59 PowerVRG6430 63 113 450 MHz 115 2 GFLOPS 64 bit 1 channel64 bit channel LPDDR3 1600 800 MHz 12 8 GB s September 20 2013 APL5698 S5L8965 nbsp 1 4 GHz November 1 2013 A8 APL1011 T7000 nbsp 20 nmHk MG 70 69 TSMC 2 billion 89 mm2 116 77 117 Typhoon 1 1 GHz PowerVRGX6450 71 118 119 533 MHz 136 4 GFLOPS September 19 2014 1 4 GHz 1 5 GHz 2 GB A8X APL1021 T7001 nbsp 3 billion 128 mm2 77 3 3 core 2 MB PowerVRGX6850 71 77 117 8 32 256 450 MHz 230 4 GFLOPS 128 bit 2 channels64 bit channel 25 6 GB s October 22 2014 A9 APL0898 S8000 nbsp 14 nmFinFET 120 Samsung 2 billion 96 mm2 121 Twister 2 1 85 GHz 122 123 Dual core 3 MB 4 MB Victim 115 124 PowerVRGT7600 71 125 6 24 192 650 MHz 249 6 GFLOPS 64 bit 1 channel64 bit channel LPDDR4 3200 1600 MHz September 25 2015 APL1022 S8003 nbsp 16 nmFinFET 121 126 127 TSMC 104 5 mm2 121 A9X APL1021 S8001 nbsp 3 billion 143 9 mm2 126 84 2 16 GHz 128 129 115 126 PowerVRGT7850 71 126 12 48 384 499 2 GFLOPS 128 bit c 2 channels d 64 bit channel November 11 2015 2 26 GHz 128 bit 2 channels64 bit channel 51 2 GB s 4 GB A10 Fusion APL1W24 T8010 nbsp 3 3 billion 125 mm2 127 ARMv8 1 A Hurricane 2 1 64 GHz Zephyr 2 1 09 GHz Quad core e P core L1i 64 KBL1d 64 KBE core L1i 32 KBL1d 32 KB P core 3 MBE core 1 MB 4 MB PowerVRGT7600Plus 130 71 131 132 6 24 192 900 MHz 345 6 GFLOPS 64 bit 1 channel64 bit channel 25 6 GB s 2 GB September 16 2016 2 34 GHz 3 GB A10X Fusion APL1071 T8011 nbsp 10 nmFinFET 84 4 billion 96 4 mm2 84 3 2 38 GHz 3 1 30 GHz 6 core f P core 8 MBE core 1 MB 133 134 4 M4 12 48 384 1000 MHz 768 0 GFLOPS 128 bit 2 channels64 bit channel 51 2 GB s 3 GB June 13 2017 4 GB A11Bionic APL1W72 T8015 nbsp 4 3 billion 87 66 mm2 135 ARMv8 2 A 136 Monsoon 2 2 39 GHz Mistral 4 g 1 19 GHz 6 core 1stgeneration Apple designed 3 12 192 1066 MHz 409 3 GFLOPS 2 600 billion OPS 64 bit 4 channels16 bit channel LPDDR4X 4266 2133 MHz 34 1 GB s 2 GB September 22 2017 3 GB A12Bionic APL1W81 T8020 nbsp 7 nm N7 FinFET 6 9 billion 83 27 mm2 137 ARMv8 3 A 138 Vortex 2 49 GHz Tempest 4 1 59 GHz P core L1i 128 KBL1d 128 KBE core L1i 32 KBL1d 32 KB P core 8 MBE core 2 MB 8 MB 2ndgeneration Apple designed Apple G11P 4 16 256 1125 MHz 576 0 GFLOPS 8 5 TOPS September 21 2018 4 GB A12X Bionic APL1083 T8027 nbsp 10 billion 135 mm2 139 4 8 core Second generation Apple designed Apple G11G 7 28 448 1 008 TFLOPS 128 bit 2 channels64 bit channel 68 2 GB s November 7 2018 6 GB A12Z Bionic nbsp 8 32 512 1 152 TFLOPS March 25 2020 16 GB June 22 2020 A13Bionic APL1W85 T8030 nbsp 7 nm N7P FinFET 8 5 billion 98 48 mm2 140 ARMv8 4 A 141 Lightning 2 2 66 GHz Thunder 1 72 GHz 6 core P core L1i 192 KBL1d 128 KBE core L1i 96 KBL1d 48 KB P core 8 MBE core 4 MB 16 MB 3rdgeneration Apple designed 142 4 16 143 256 1350 MHz 691 2 GFLOPS 5 5 TOPS 64 bit 4 channels16 bit channel 34 1 GB s 3 GB September 20 2019 4 GB A14Bionic APL1W01 T8101 nbsp 5 nm N5 FinFET 11 8 billion 88 mm2 144 ARMv8 5 A 145 Firestorm 3 00 GHz Icestorm 1 82 GHz P core L1i 192 KBL1d 128 KBE core L1i 128 KBL1d 64 KB 4thgeneration Apple designed 146 142 147 148 1462 5 MHz 748 8 GFLOPS 16 11 TOPS October 23 2020 4 GB A15Bionic APL1W07 149 T8110 nbsp 5 nm N5P FinFET 15 billion 108 01 mm2 149 Avalanche 3 24 GHz Blizzard 2 02 GHz P core 12 MBE core 4 MB 32 MB 5thgeneration Apple designed 150 151 152 512 143 1338 MHz 143 153 1 370 TFLOPS 154 15 8 TOPS 4 GB September 24 2021 2 93 GHz 5 20 153 155 640 153 155 1 713 TFLOPS 156 3 24 GHz 6 GB A16Bionic APL1W10 157 T8120 nbsp 4 nm N4P FinFET 103 104 105 102 158 16 billion 112 75 mm2 159 ARMv8 6 A 160 Everest 161 162 3 46 GHz Sawtooth 161 162 P core 16 MBE core 4 MB 163 24 MB 163 6thgeneration Apple designed 1398 MHz 155 1 789 TFLOPS 155 17 TOPS LPDDR5 6400 3200 MHz 51 2 GB s September 16 2022 A17Pro APL1V02 T8130 3 nm N3B FinFET 19 billion 103 80 mm2 159 3 78 GHz 164 2 11 GHz 164 7thgeneration Apple designed 6 24 768 2 147 TFLOPS 35 TOPS 8 GB September 22 2023H seriesThe Apple H series is a family of SoCs with low power audio processing and wireless connectivity for use in headphones Apple H1 The Apple H1 chip was used in the second and third generation AirPods and the first generation AirPods Pro It was also used in the Powerbeats Pro the Beats Solo Pro Beats Fit Pro the 2020 Powerbeats AirPods Max 165 Specifically designed for headphones it has Bluetooth 5 0 supports hands free Hey Siri commands 166 and offers 30 percent lower latency than the W1 chip used in earlier AirPods 167 Apple H2 The Apple H2 chip was first used in the 2022 version of AirPods Pro It has Bluetooth 5 3 and implements 48 kHz noise reduction in hardware The 2022 version of the H2 operates only on the 2 4 GHz frequency while the 2023 version adds support for a number of Bluetooth service profiles in two specific frequency ranges of the 5 GHz band 168 Comparison of H series processors Name Model no Image Bluetooth First release H1 343S00289 169 AirPods 2nd Generation 343S00290 170 AirPods 3nd Generation 343S00404 171 AirPods Max H1 SiP 172 AirPods Pro nbsp nbsp nbsp nbsp nbsp 5 0 March 20 2019 H2 AirPods Pro 2nd generation 5 3 September 7 2022M seriesThis section relies excessively on references to primary sources Please improve this section by adding secondary or tertiary sources Find sources Apple silicon news newspapers books scholar JSTOR November 2023 Learn how and when to remove this message This section reads like a press release or a news article and may be largely based on routine coverage Please help improve this article and add independent sources November 2023 The Apple M series is a family of systems on a chip SoC used in Mac computers from November 2020 or later iPad Pro tablets from April 2021 or later iPad Air tablets from March 2022 or later and Vision Pro The M designation was previously used for Apple motion coprocessors Evolution of Apple M series M1November 10 2020 May 7 2024 M1 ProOctober 18 2021 January 17 2023 M1 MaxOctober 18 2021 June 5 2023 M1 UltraMarch 8 2022 June 5 2023 M2June 6 2022 present M2 ProJanuary 17 2023 present M2 MaxJanuary 17 2023 present M2 UltraJune 5 2023 present M3October 30 2023 present M3 ProOctober 30 2023 present M3 MaxOctober 30 2023 present M4May 7 2024 present Apple M1 Main article Apple M1 The M1 Apple s first system on a chip designed for use in Macs is manufactured using TSMC s 5 nm process Announced on November 10 2020 it is used in the MacBook Air M1 2020 Mac mini M1 2020 MacBook Pro 13 inch M1 2020 iMac 24 inch M1 2021 iPad Pro 5th generation and iPad Air 5th generation It comes with 4 performance cores and 4 efficiency cores for a total of 8 CPU cores It comes with up to 8 GPU cores with the entry level MacBook Air having only 7 GPU cores The M1 has 16 billion transistors 173 Apple M1 Pro The M1 Pro is a more powerful version of the M1 with six to eight performance cores two efficiency cores 14 to 16 GPU cores 16 Neural Engine cores up to 32 GB unified RAM with up to 200 GB s memory bandwidth and more than double the transistors It was announced on October 18 2021 and is used in the 14 and 16 inch MacBook Pro Apple claimed the CPU performance is about 70 faster than the M1 and that its GPU performance is about double Apple claims the M1 Pro can deliver up to 20 streams of 4K or 7 streams of 8K ProRes video playback up from 6 offered by Afterburner card for 2019 Mac Pro Apple M1 Max The M1 Max is a larger version of the M1 Pro chip with eight performance cores two efficiency cores 24 to 32 GPU cores 16 Neural Engine cores up to 64 GB unified RAM with up to 400 GB s memory bandwidth and more than double the number of transistors It was announced on October 18 2021 and is used in the 14 and 16 inch MacBook Pro as well as the Mac Studio Apple claims the M1 Max can deliver up to 30 streams of 4K up from 23 offered by Afterburner card for 2019 Mac Pro or 7 streams of 8K ProRes video playback Apple M1 Ultra The M1 Ultra consists of two M1 Max dies connected together by a silicon interposer through Apple s UltraFusion technology 174 It has 114 billion transistors 16 performance cores 4 efficiency cores 48 to 64 GPU cores and 32 Neural Engine cores it can be configured with up to 128 GB unified RAM of 800 GB s memory bandwidth It was announced on March 8 2022 as an optional upgrade for the Mac Studio Apple claims the M1 Ultra can deliver up to 18 streams of 8K ProRes video playback 175 Apple M2 Main article Apple M2 Apple announced the M2 SoC on June 6 2022 at WWDC along with the new MacBook Air and the new 13 inch MacBook Pro and later the iPad Pro 6th generation and the iPad Air 6th generation The M2 is made with TSMC s Enhanced 5 nanometer technology N5P process and contains 20 billion transistors a 25 increase from the previous generation M1 The M2 can be configured with up to 24 gigabytes of RAM and 2 terabytes of storage It has 8 CPU cores 4 performance and 4 efficiency and up to 10 GPU cores The M2 also increases the memory bandwidth to 100 GB s Apple claims CPU improvements up to 18 and GPU improvements up to 35 compared to the previous M1 176 Apple M2 Pro The M2 Pro is a more powerful version of the M2 with six to eight performance cores four efficiency cores 16 to 19 GPU cores 16 Neural Engine cores up to 32 GB unified RAM with up to 200 GB s memory bandwidth and double the transistors It was announced on January 17 2023 in a press release and it is used in the 14 and 16 inch 2023 MacBook Pro as well as the Mac Mini Apple claims the CPU performance is 20 percent faster than the M1 Pro and the GPU is 30 percent faster than the M1 Pro 177 Apple M2 Max The M2 Max is a larger version of the M2 Pro with eight performance cores four efficiency cores 30 to 38 GPU cores 16 Neural Engine cores up to 96 GB unified RAM with up to 400 GB s memory bandwidth and more than double the transistors It was announced on January 17 2023 in a press release and it is used in the 14 and 16 inch 2023 MacBook Pro as well as the Mac Studio 178 Apple claims the CPU performance is 20 percent faster than M1 Max and the GPU is 30 percent faster than the M1 Max 177 Apple M2 Ultra The M2 Ultra consists of two M2 Max dies connected together by a silicon interposer through Apple s UltraFusion technology It has 134 billion transistors 16 performance cores 8 efficiency cores 60 to 76 GPU cores and 32 Neural Engine cores it can be configured with up to 192 GB unified RAM of 800 GB s memory bandwidth It was announced on June 5 2023 as an optional upgrade for the Mac Studio and the sole processor for the Mac Pro Apple claims the M2 Ultra can deliver up to 22 streams of 8K ProRes video playback 179 Apple M3 Main article Apple M3 Apple announced the M3 series of chips on October 30 2023 along with the new MacBook Pro and iMac The M3 is based on the 3 nm process and contains 25 billion transistors a 25 increase from the previous generation M2 It has 8 CPU cores 4 performance and 4 efficiency and up to 10 GPU cores Apple claims CPU improvements up to 35 and GPU improvements up to 65 compared to the M1 180 Apple M3 Pro The M3 Pro is a more powerful version of the M3 with six performance cores six efficiency cores 14 to 18 GPU cores 16 Neural Engine cores up to 36 GB unified RAM with 150 GB s memory bandwidth and 48 more transistors It is used in the 14 and 16 inch MacBook Pro Apple claims the CPU performance is 30 percent faster than the M1 Pro and the GPU is 40 percent faster than the M1 Pro 180 Apple M3 Max The M3 Max is a larger version of the M3 Pro with ten or twelve performance cores four efficiency cores 30 to 40 GPU cores 16 Neural Engine cores up to 128 GB unified RAM with up to 400 GB s memory bandwidth and more than double the transistors It is used in the 14 and 16 inch MacBook Pro Apple claims the CPU performance is 80 percent faster than the M1 Max and the GPU is 50 percent faster than the M1 Max 180 Apple M4 Main article Apple M4 Apple announced the M4 chip on May 7 2024 along with the new seventh generation iPad Pro models The M4 is based on the N3E process rather than the N3B process used by the M3 and contains 28 billion transistors It has three or four performance cores six efficiency cores and ten GPU cores Apple claims the M4 has up to 1 5x faster CPU performance compared to the M2 181 Comparison of M series processors General Semiconductor technology CPU GPU AI accelerator Media Engine Memory technology First release Name Codenameand part no Image Process Transistor countand die size CPU ISA Performance core Efficiency core Overall cores Cache Vendor Cores SIMD EU count FP32 ALU count Frequency FP32 FLOPS TFLOPS Hardware accelerated Ray Tracing Support Cores OPS Hardware Acceleration Media Decode Encode Engine Memory bus width Total channelBit per channel Memory type Theoreticalbandwidth Available capacity Core name Cores Core speed Core name Cores Core speed L1 L2 SLC Video decode Video encode ProRes decode amp encode AV1 decode M1 APL1102T8103 nbsp TSMCN5 16 billion118 91 mm 182 ARMv8 5 A Firestorm 4 3 20 GHz Icestorm 4 2 06 GHz 8 core P core L1i 192 KBL1d 128 KBE core L1i 128 KBL1d 64 KB P core 12 MBE core 4 MB 8 MB 4th generation Apple designed 7 28 896 1278 MHz 2 290 No 16 11 TOPS H264 HEVC 1 1 128 bit 2 channels64 bit channel LPDDR4X 4266 2133 MHz 68 25 GB s 8 GB16 GB November 17 2020 8 32 1024 2 617 M1 Pro APL1103T6000 nbsp 33 7 billion 245 mm 183 6 3 23 GHz 2 P core 24 MBE core 4 MB 24 MB 14 56 1792 1296 MHz 4 644 H264 HEVC ProRes ProRes RAW 1 256 bit 2 channels128 bit channel LPDDR5 6400 3200 MHz 204 8 GB s 16 GB32 GB October 26 2021 8 10 core 16 64 2048 5 308 M1 Max APL1105T6001 184 nbsp 57 billion 432 mm 183 48 MB 24 96 3072 7 962 2 2 512 bit 4 channels128 bit channel 409 6 GB s 32 GB64 GB 32 128 4096 10 616 M1 Ultra APL1W06T6002 nbsp 114 billion 864 mm 16 4 20 core P core 48 MBE core 8 MB 96 MB 48 192 6144 15 925 32 22 TOPS 2 4 4 1024 bit 8 channels128 bit channel 819 2 GB s 64 GB128 GB March 18 2022 64 256 8192 21 233 M2 APL1109T8112 nbsp TSMCN5P 20 billion155 25 mm 182 ARMv8 6 A Avalanche 4 3 50 GHz Blizzard 4 2 42 GHz 8 core P core 16 MBE core 4 MB 8 MB 5th generation Apple designed 8 32 1024 1398 MHz 2 863 16 15 8 TOPS 1 1 1 128 bit 2 channels64 bit channel 102 4 GB s 8 GB16 GB24 GB June 24 2022 10 40 1280 3 578 H264 HEVC H264 HEVC ProRes ProRes RAW 1 M2 Pro APL1113T6020 40 billion 6 10 core P core 32 MBE core 4 MB 24 MB 16 64 2048 5 726 256 bit 4 channels64 bit channel 204 8 GB s 16 GB32 GB January 24 2023 8 12 core 19 76 2432 6 799 M2 Max APL1111T6021 67 billion 3 69 GHz 185 48 MB 30 120 3840 10 736 2 2 512 bit 4 channels128 bit channel 409 6 GB s 32 GB64 GB96 GB 38 152 4864 13 599 M2 Ultra APL1W12T6022 134 billion 16 3 00 GHz 3 70 GHz 185 186 187 8 24 core P core 64 MBE core 8 MB 96 MB 60 240 7680 21 473 32 31 6 TOPS 2 4 4 1024 bit 8 channels128 bit channel 819 2 GB s 64 GB128 GB192 GB June 13 2023 76 304 9728 27 199 M3 APL1201 T8122 TSMCN3B 25 billion 4 4 05 GHz 4 2 75 GHz 8 core P core 16 MBE core 4 MB 8 MB 7th generation Apple designed 8 128 1024 1380 MHz 188 2 826 Yes 16 18 TOPS 1 1 1 1 128 bit 2 channels64 bit channel 102 4 GB s 8 GB16 GB24 GB November 7 2023 10 160 1280 3 533 M3 Pro APL1203T6030 37 billion 5 6 11 core 12 MB 14 224 1792 4 946 192 bit 3 channels64 bit channel 153 6 GB s 18 GB36 GB 6 12 core 18 288 2304 6 359 M3 Max T6034 T6031 92 billion 10 4 14 core P core 32 MBE core 4 MB 48 MB 30 480 3840 10 598 2 2 384 bit 3 channels128 bit channel 307 2 GB s 36 GB96 GB 12 16 core 40 640 5120 14 131 512 bit 4 channels128 bit channel 409 6 GB s 48 GB64 GB128 GB M4 TSMCN3E 28 billion ARMv9 189 3 4 40 GHz 6 2 85 GHz 9 core P core 16 MBE core 4 MB 10 160 1280 38 TOPS 1 1 128 bit 2 channels64 bit channel LPDDR5X 7500 3750 MHz 120 GB s 8 GB May 15 2024 4 10 core 16 GBR seriesApple R1 The Apple R1 was announced by Apple on June 5 2023 at its Worldwide Developers Conference It is used in the Apple Vision Pro headset The Apple R1 is dedicated to the real time processing of sensor inputs and delivering extremely low latency images to the displays S seriesEvolution of Apple S series S1September 9 2014 September 7 2016 S2September 7 2016 September 12 2017 S1PSeptember 7 2016 September 12 2018 S3September 12 2017 September 7 2022 S4September 12 2018 September 10 2019 S5September 10 2019 present S6September 15 2020 September 14 2021 S7September 14 2021 September 7 2022January 18 2023 present S8September 7 2022 present S9September 12 2023 present The Apple S series is a family of systems in a package SiP used in the Apple Watch and HomePod It uses a customized application processor that together with memory storage and support processors for wireless connectivity sensors and I O form a complete computer in a single package They are designed by Apple and manufactured by contract manufacturers such as Samsung Apple S1 Main article Apple S1 The Apple S1 is an integrated computer It includes memory storage and support circuits like wireless modems and I O controllers in a sealed integrated package It was announced on September 9 2014 as part of the Wish we could say more event It was used in the first generation Apple Watch 190 Apple S1P Used in Apple Watch Series 1 It has a dual core processor identical to the S2 with the exception of the built in GPS receiver It contains the same dual core CPU with the same new GPU capabilities as the S2 making it about 50 faster than the S1 191 192 Apple S2 Main article Apple S2 Used in the Apple Watch Series 2 It has a dual core processor and a built in GPS receiver The S2 s two cores deliver 50 higher performance and the GPU delivers twice as much as the predecessor 193 and is similar in performance to the Apple S1P 194 Apple S3 Used in the Apple Watch Series 3 It has a dual core processor that is 70 faster than the Apple S2 and a built in GPS receiver 195 There is also an option for a cellular modem and an internal eSIM module 195 It also includes the W2 chip 195 The S3 also contains a barometric altimeter the W2 wireless connectivity processor and in some models UMTS 3G and LTE 4G cellular modems served by a built in eSIM 195 Apple S4 Used in the Apple Watch Series 4 It introduced 64 bit ARMv8 cores to the Apple Watch through two Tempest cores 196 197 which are also found in the A12 as energy efficient cores Despite its small size Tempest uses a 3 wide decode out of order superscalar design which makes it much more powerful than preceding in order cores The S4 contains a Neural Engine that is able to run Core ML 198 Third party apps can use it starting from watchOS 6 The SiP also includes new accelerometer and gyroscope functionality that has twice the dynamic range in measurable values of its predecessor as well as being able to sample data at 8 times the speed 199 It contains the W3 wireless chip which supports Bluetooth 5 It also contains a new custom GPU which can use the Metal API 200 Apple S5 Used in the Apple Watch Series 5 Watch SE and HomePod mini 201 It adds a built in magnetometer to the custom 64 bit dual core processor and GPU of the S4 202 Apple S6 Used in the Apple Watch Series 6 It has a custom 64 bit dual core processor that runs up to 20 percent faster than the S5 203 204 The dual cores in the S6 are based on the A13 s energy efficient little Thunder cores at 1 8 GHz 205 Like the S4 and S5 it also contains the W3 wireless chip 204 The S6 adds the new U1 ultra wideband chip an always on altimeter and 5 GHz WiFi 203 204 Apple S7 Used in the Apple Watch Series 7 and second generation HomePod The S7 has the same T8301 identifier and quoted performance as the S6 206 Apple S8 Used in the Apple Watch SE 2nd generation Watch Series 8 and Watch Ultra The S8 adds a new three axis gyroscope and high g force accelerometer 207 It has the same T8301 identifier and quoted performance as the S6 and S7 208 Apple S9 Used in the Apple Watch Series 9 and Watch Ultra 2 The S9 has a new dual core CPU with 60 percent more transistors than the S8 and a new four core Neural Engine 209 Comparison of S series processors Name Model no Image Semiconductor technology Die size CPU ISA CPU CPU cache GPU Memory technology Modem First release S1 APL0778 210 nbsp 28 nm Hk MG 211 212 32 mm2 211 ARMv7k 212 213 520 MHz single core Cortex A7 212 L1d 32 KB 214 L2 256 KB 214 PowerVR Series 5 212 215 LPDDR3 216 April 24 2015 S1P TBC nbsp TBC ARMv7k 217 191 193 520 MHz dual core Cortex A7 217 L1d 32 KB 214 PowerVR Series 6 Rogue 217 LPDDR3 September 12 2016 S2 nbsp S3 nbsp ARMv7k 218 Dual core TBC LPDDR4 Qualcomm MDM9635MSnapdragon X7 LTE September 22 2017 S4 nbsp 7 nm TSMC N7 TBC ARMv8 A ILP32 219 220 1 59 GHz Dual core Tempest L1d 32 KB 212 L2 2 MB 212 Apple G11M 220 TBC September 21 2018 S5 nbsp September 20 2019 S6 nbsp 7 nm TSMC N7P TBC 1 8 GHz Dual core Thunder L1d 48 KB 221 L2 4 MB 222 TBC September 18 2020 S7 nbsp October 15 2021 S8 nbsp September 16 2022 S9 nbsp 4 nm TSMC N4P 223 Dual core Sawtooth L1d 64 KBL2 4 MB 224 September 22 2023T seriesThe T series chip operates as a secure enclave on Intel based MacBook and iMac computers released from 2016 onwards The chip processes and encrypts biometric information Touch ID and acts as a gatekeeper to the microphone and FaceTime HD camera protecting them from hacking The chip runs bridgeOS a purported variant of watchOS 225 The functions of the T series processor were built into the M series CPUs thus ending the need for the T series Apple T1 The Apple T1 chip is an ARMv7 SoC derived from the processor in the Apple Watch s S2 that drives the System Management Controller SMC and Touch ID sensor of the 2016 and 2017 MacBook Pro with Touch Bar 226 Apple T2 Main article Apple T2 The Apple T2 security chip is a SoC first released in the iMac Pro It is a 64 bit ARMv8 chip a variant of the A10 Fusion or T8010 227 It provides a secure enclave for encrypted keys enables users to lock down the computer s boot process handles system functions like the camera and audio control and handles on the fly encryption and decryption for the solid state drive 228 229 230 T2 also delivers enhanced imaging processing for the iMac Pro s FaceTime HD camera 231 232 Comparison of T series processors Name Model no Image Semiconductor technology Die size CPU ISA CPU CPU cache GPU Memory technology First release Memory bandwidth T1 APL1023 233 nbsp Same as S2 TBC ARMv7 TBD November12 2016 T2 APL1027 234 nbsp TSMC 16 nm FinFET 235 104 mm2 235 ARMv8 AARMv7 A 2 Hurricane2 Zephyr Cortex A7 L1i 64 KBL1d 64 KBL2 3 MB 235 3 cores 235 LP DDR4 235 December14 2017U seriesThe Apple U series is a family of systems in a package SiP implementing ultra wideband UWB radio Apple U1 The Apple U1 is used in the iPhone 11 series through the iPhone 14 series excluding the second and third generation iPhone SE Apple Watch Series 6 through the Apple Watch Series 8 and Apple Watch Ultra 1st generation HomePod 2nd generation and HomePod Mini AirTag trackers and the charging case for AirPods Pro 2nd generation 236 Apple U2 The Apple U2 referred to by Apple as its Second generation Ultra Wideband chip is used in the iPhone 15 series Apple Watch Series 9 and Apple Watch Ultra 2 Comparison of U series processors Name Model no Image CPU Semiconductor technology First release U1 TMK A75 237 nbsp Cortex M4ARMv7E M 238 16 nm FinFET TSMC 16FF September 20 2019 U2 September 22 2023W seriesThe Apple W series is a family of RF SoCs used for Bluetooth and Wi Fi connectivity Apple W1 The Apple W1 is a SoC used in the 2016 AirPods and select Beats headphones 239 240 It maintains a Bluetooth 241 Class 1 connection with a computer device and decodes the audio stream that is sent to it 242 Apple W2 The Apple W2 used in the Apple Watch Series 3 is integrated into the Apple S3 SiP Apple claimed the chip makes Wi Fi 85 faster and allows Bluetooth and Wi Fi to use half the power of the W1 implementation 195 Apple W3 The Apple W3 is used in the Apple Watch Series 4 243 Series 5 244 Series 6 204 SE 1st generation 204 Series 7 Series 8 SE 2nd generation Ultra Series 9 and Ultra 2 It is integrated into the Apple S4 S5 S6 S7 S8 and S9 SiPs It supports Bluetooth 5 0 5 3 Comparison of W series processors Name Model no Image Semiconductor technology Die size CPU ISA CPU CPU cache Memory technology Bluetooth First release Memory bandwidth W1 343S00130 245 343S00131 245 nbsp TBC 14 3 mm2 245 TBC 4 2 December13 2016 W2 338S00348 246 nbsp TBC September22 2017 W3 338S00464 247 nbsp 5 0 5 3 September21 2018M series coprocessorsMain article Apple motion coprocessors The Apple M series coprocessors are motion coprocessors used by Apple Inc in their mobile devices First released in 2013 their function is to collect sensor data from integrated accelerometers gyroscopes and compasses and offload the collecting and processing of sensor data from the main central processing unit CPU Only the M7 and M8 coprocessors were housed on separate chips the M9 M10 and M11 coprocessors were embedded in their corresponding A series chips Beginning with the A12 Bionic chip in 2018 the motion coprocessors were fully integrated into the SoC this allowed Apple to reuse the M series codename for their desktop SoCs Comparison of M series coprocessors Name Model no Image Semiconductor technology CPU ISA CPU First release Apple M7 LPC18A1 nbsp 90 nm ARMv7 M 150 MHz Cortex M3 September10 2013 Apple M8 LPC18B1 nbsp September9 2014Miscellaneous devicesThis segment is about Apple designed processors that are not easily sorted into another section Early series See also Early iPhone systems on chip Apple first used SoCs in early versions of the iPhone and iPod Touch They combine in one package a single ARM based processing core CPU a graphics processing unit GPU and other electronics necessary for mobile computing The APL0098 also 8900B 248 or S5L8900 is a package on package PoP system on a chip SoC that was introduced on June 29 2007 at the launch of the original iPhone It includes a 412 MHz single core ARM11 CPU and a PowerVR MBX Lite GPU It was manufactured by Samsung on a 90 nm process 11 The iPhone 3G and the first generation iPod Touch also use it 249 The APL0278 250 also S5L8720 is a PoP SoC introduced on September 9 2008 at the launch of the second generation iPod Touch It includes a 533 MHz single core ARM11 CPU and a PowerVR MBX Lite GPU It was manufactured by Samsung on a 65 nm process 11 249 The APL0298 also S5L8920 is a PoP SoC introduced on June 8 2009 at the launch of the iPhone 3GS It includes a 600 MHz single core Cortex A8 CPU and a PowerVR SGX535 GPU It was manufactured by Samsung on a 65 nm process 107 The APL2298 also S5L8922 is a 45 nm die shrunk version of the iPhone 3GS SoC 11 and was introduced on September 9 2009 at the launch of the third generation iPod Touch Other The Samsung S5L8747 is an ARM based microcontroller used in Apple s Lightning Digital AV Adapter a Lightning to HDMI adapter This is a miniature computer with 256 MB RAM running an XNU kernel loaded from the connected iPhone iPod Touch or iPad then taking a serial signal from the iOS device translating that into a proper HDMI signal 251 252 Model no Image First release CPU ISA Specs Application Utilizing devices Operating system 339S0196 nbsp September 2012 Unknown ARM 256 MBRAM Lightning toHDMI conversion Apple DigitalAV Adapter XNUSee alsoARM Cortex A9 List of iPhone models List of iPad models List of Mac models grouped by CPU type List of Samsung platforms SoCs Exynos none have been used by Apple historical some were used in Apple products PowerVR SGX GPUs were also used in the iPhone 3GS and the third generation iPod Touch PWRficient a processor designed by P A Semi a company Apple acquired to form an in house custom chip design department Similar platforms A31 by AllWinner Atom by Intel BCM2xxxx by Broadcom eMAG and Altra by Ampere Computing Exynos by Samsung i MX by Freescale Semiconductor Jaguar and Puma by AMD Kirin by HiSilicon MTxxxx by MediaTek NovaThor by ST Ericsson OMAP by 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