Many integrated circuits are available in the MSOP form factor. They are suited for space-limited applications requiring 1 mm or less mounted height and are commonly used in Disk drives, video/audio and consumer electronics.[1]
Physical properties
The size of the Mini Small Outline Package is only 3mm x 3mm for the 8 & 10 pins[1] version and 3mm x 4mm for the 12 & 16 pins version.[2][3] The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability.[1] Some versions have an exposed pad on the bottom side. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB.[2][1]
Part number
Pins
Body width (mm)
Body length (mm)
Lead pitch (mm)
MSOP8
8
3
3
0.65
MSOP10
10
3
3
0.5
MSOP12
12
3
4
0.65
MSOP16
16
3
4
0.5
Synonyms for the MSOP Package
μMAX or micro max - Maxim name for the msop package.[4][2]
µMAX-EP or micro max exposed pad - Maxim name for the msop package with exposed pad.[2][4]
^ abcd"MSOP in STATS ChipPAC datasheet". Retrieved 8 December 2020.
^ abcde"MSOP on mbedded.ninja". blog.mbedded.ninja. Retrieved 8 December 2020.
^"MSOP on EESemi.com". eesemi.com. Retrieved 8 December 2020.
^ ab"Package Information - Maxim Integrated". www.maximintegrated.com. Retrieved 2021-01-04.
External links
Wikimedia Commons has media related to MSOP integrated circuit packages.
January 23, 2023
mini, small, outline, package, msop, miniaturized, version, shrink, small, outline, package, surface, mount, msop, form, factor, contents, application, physical, properties, synonyms, msop, package, similar, package, types, also, references, external, linksapp. The Mini Small Outline Package MSOP a miniaturized version of the Shrink Small Outline ic package A surface mount IC in the MSOP form factor Contents 1 Application 2 Physical properties 3 Synonyms for the MSOP Package 4 Similar package types 5 See also 6 References 7 External linksApplication EditMany integrated circuits are available in the MSOP form factor They are suited for space limited applications requiring 1 mm or less mounted height and are commonly used in Disk drives video audio and consumer electronics 1 Physical properties EditThe size of the Mini Small Outline Package is only 3mm x 3mm for the 8 amp 10 pins 1 version and 3mm x 4mm for the 12 amp 16 pins version 2 3 The small package offers a small footprint short wires for improved electrical connections and good moisture reliability 1 Some versions have an exposed pad on the bottom side The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB 2 1 Part number Pins Body width mm Body length mm Lead pitch mm MSOP8 8 3 3 0 65MSOP10 10 3 3 0 5MSOP12 12 3 4 0 65MSOP16 16 3 4 0 5Synonyms for the MSOP Package EditmMAX or micro max Maxim name for the msop package 4 2 µMAX EP or micro max exposed pad Maxim name for the msop package with exposed pad 2 4 MSE Linear Technology name for the msop package with exposed pad 2 Similar package types EditThin shrink small outline packageSee also EditList of integrated circuit packaging typesReferences Edit a b c d MSOP in STATS ChipPAC datasheet Retrieved 8 December 2020 a b c d e MSOP on mbedded ninja blog mbedded ninja Retrieved 8 December 2020 MSOP on EESemi com eesemi com Retrieved 8 December 2020 a b Package Information Maxim Integrated www maximintegrated com Retrieved 2021 01 04 External links Edit Wikimedia Commons has media related to MSOP integrated circuit packages Retrieved from https en wikipedia org w index php title Mini Small Outline Package amp oldid 1115399448, wikipedia, wiki, book, books, library,
