Populated (rear) and unpopulated (front) TSOP land patterns on a printed circuit board.
A row of through-holes acting as the footprint for a pin header.
Component manufacturers often produce multiple pin-compatible product variants to allow systems integrators to change the exact component in use without changing the footprint on the circuit board. This can provide large cost savings for integrators, especially with dense BGA components where the footprint pads may be connected to multiple layers of the circuit board.
Many component vendors provide footprints for their components, including Texas Instruments, and CUI. Other sources include third party libraries, such as SnapEDA.[2]
footprint, electronics, footprint, land, pattern, arrangement, pads, surface, mount, technology, through, holes, through, hole, technology, used, physically, attach, electrically, connect, component, printed, circuit, board, land, pattern, circuit, board, matc. A footprint or land pattern is the arrangement of pads in surface mount technology 1 or through holes in through hole technology used to physically attach and electrically connect a component to a printed circuit board The land pattern on a circuit board matches the arrangement of leads on a component Populated rear and unpopulated front TSOP land patterns on a printed circuit board A row of through holes acting as the footprint for a pin header Component manufacturers often produce multiple pin compatible product variants to allow systems integrators to change the exact component in use without changing the footprint on the circuit board This can provide large cost savings for integrators especially with dense BGA components where the footprint pads may be connected to multiple layers of the circuit board Many component vendors provide footprints for their components including Texas Instruments and CUI Other sources include third party libraries such as SnapEDA 2 See also EditSurface mount technology Through hole technology Chip carrier List of integrated circuit packaging types IPC standards body JEDEC standards body References Edit IPC 7351 Generic Requirements for Surface Mount Design and Land Pattern Standard IPC 2005 p 4 Top 10 websites to find footprints for your next PCB project Electronics Lab 2019 07 26 Retrieved 2019 07 31 This electronics related article is a stub You can help Wikipedia by expanding it vte Retrieved from https en wikipedia org w index php title Footprint electronics amp oldid 1032241736, wikipedia, wiki, book, books, library,
