They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics.[1]
Physical propertiesedit
The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm.
Exposed Padedit
Some TSSOP packages have an exposed pad. This is a rectangular metal pad on the bottom side of the package. The exposed pad will be soldered on the pcb to transfer heat from the package to the pcb. In most applications, the exposed pad is connected to ground.[2]
HTSSOPedit
The Heat sink thin shrink small outline package[3] (HTSSOP) is Texas Instruments name for a TSSOP with an exposed pad on the bottom side.[4] There are some other manufacturers who use the same name.
^"TSSOP in STATS ChipPAC datasheet". Retrieved 14 December 2020.
^"Exposed pads: a brief introduction". www.maximintegrated.com. Retrieved 8 January 2021.
^"Plastic Packages for Integrated Circuits (HTSSOP)". www.renesas.com. Retrieved 8 January 2021.
^"TSSOP on mbedded ninja". mbedded ninja. Retrieved 8 June 2022.
External linksedit
Wikimedia Commons has media related to TSSOP integrated circuit packages.
Soldering a TSSOP chip by hand
October 28, 2023
thin, shrink, small, outline, package, this, article, needs, additional, citations, verification, please, help, improve, this, article, adding, citations, reliable, sources, unsourced, material, challenged, removed, find, sources, news, newspapers, books, scho. This article needs additional citations for verification Please help improve this article by adding citations to reliable sources Unsourced material may be challenged and removed Find sources Thin shrink small outline package news newspapers books scholar JSTOR January 2021 Learn how and when to remove this template message The Thin Shrink Small Outline Package TSSOP is a rectangular surface mount plastic integrated circuit IC package with gull wing leads Drawing of a 16 pins TSSOP packagePhilips TDA6651TT in TSSOP package Contents 1 Application 2 Physical properties 3 Exposed Pad 3 1 HTSSOP 4 See also 5 Similar package types 6 References 7 External linksApplication editThey are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers controllers and Drivers Logic Memory and RF Wireless Disk drives video audio and consumer electronics 1 Physical properties editThe Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package It is also smaller and thinner than a TSOP with the same lead count Body widths are 3 0 mm 4 4 mm and 6 1 mm The lead counts range from 8 to 80 pins The lead pitches are 0 5 or 0 65 mm Exposed Pad editSome TSSOP packages have an exposed pad This is a rectangular metal pad on the bottom side of the package The exposed pad will be soldered on the pcb to transfer heat from the package to the pcb In most applications the exposed pad is connected to ground 2 HTSSOP edit The Heat sink thin shrink small outline package 3 HTSSOP is Texas Instruments name for a TSSOP with an exposed pad on the bottom side 4 There are some other manufacturers who use the same name See also editList of integrated circuit packaging types Small outline integrated circuitSimilar package types editShrink Small Outline Package Mini Small Outline Package Small outline integrated circuitReferences edit TSSOP in STATS ChipPAC datasheet Retrieved 14 December 2020 Exposed pads a brief introduction www maximintegrated com Retrieved 8 January 2021 Plastic Packages for Integrated Circuits HTSSOP www renesas com Retrieved 8 January 2021 TSSOP on mbedded ninja mbedded ninja Retrieved 8 June 2022 External links edit nbsp Wikimedia Commons has media related to TSSOP integrated circuit packages Soldering a TSSOP chip by hand Retrieved from https en wikipedia org w index php title Thin shrink small outline package amp oldid 1170688919, wikipedia, wiki, book, books, library,
