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Wikipedia

List of integrated circuit packaging types

January 07, 2023

Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers.

A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.

Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.

Through-hole packages

Main article: dual in-line package

Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB.

 
Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.
Acronym Full name Remark
SIP Single in-line package
DIP Dual in-line package 0.1 in (2.54 mm) pin spacing, rows 0.3 in (7.62 mm) or 0.6 in (15.24 mm) apart.
CDIP Ceramic DIP[1]
CERDIP Glass-sealed ceramic DIP[1]
QIP Quadruple in-line package Like DIP but with staggered (zig-zag) pins.[1]
SKDIP Skinny DIP Standard DIP with 0.1 in (2.54 mm) pin spacing, rows 0.3 in (7.62 mm) apart.[1]
SDIP Shrink DIP Non-standard DIP with smaller 0.07 in (1.78 mm) pin spacing.[1]
ZIP Zig-zag in-line package
MDIP Molded DIP[2]
PDIP Plastic DIP[1]

Surface mount

See also: Surface-mount technology
Acronym Full name Remark
CCGA Ceramic column-grid array (CGA)[3]
CGA Column-grid array[3]
CERPACK Ceramic package[4]
CQGP[5]
LLP Lead-less lead-frame package A package with metric pin distribution (0.5–0.8 mm pitch)[6]
LGA Land grid array[3]
LTCC Low-temperature co-fired ceramic[7]
MCM Multi-chip module[8]
MICRO SMDXT Micro surface-mount device extended technology[9]

Chip on board is a packaging technique that directly connects a die to a PCB, without an interposer or lead frame.

Chip carrier

Main article: chip carrier

A chip carrier is a rectangular package with contacts on all four edges. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.

Acronym Full name Remark
BCC Bump chip carrier[3]
CLCC Ceramic lead-less chip carrier[1]
LCC Lead-less chip carrier[3] Contacts are recessed vertically.
LCC Leaded chip carrier[3]
LCCC Leaded ceramic-chip carrier[3]
DLCC Dual lead-less chip carrier (ceramic)[3]
PLCC Plastic leaded chip carrier[1][3]

Pin grid arrays

Main article: Pin grid array
Acronym Full name Remark
OPGA Organic pin-grid array
FCPGA Flip-chip pin-grid array[3]
PAC Pin array cartridge[10]
PGA Pin-grid array Also known as PPGA[1]
CPGA Ceramic pin-grid array[3]

Flat packages

Main article: Quad Flat Package
Acronym Full name Remark
- Flat-pack Earliest version metal/ceramic packaging with flat leads
CFP Ceramic flat-pack[3]
CQFP Ceramic quad flat-pack[1][3] Similar to PQFP
BQFP Bumpered quad flat-pack[3]
DFN Dual flat-pack No lead[3]
ETQFP Exposed thin quad flat-package[11]
PQFN Power quad flat-pack No-leads, with exposed die-pad[s] for heatsinking[12]
PQFP Plastic quad flat-package[1][3]
LQFP Low-profile quad flat-package[3]
QFN Quad flat no-leads package Also called as micro lead frame (MLF).[3][13]
QFP Quad flat package[1][3]
MQFP Metric quad flat-pack QFP with metric pin distribution[3]
HVQFN Heat-sink very-thin quad flat-pack, no-leads
SIDEBRAZE[14][15] [clarification needed] [clarification needed]
TQFP Thin quad flat-pack[1][3]
VQFP Very-thin quad flat-pack[3]
TQFN Thin quad flat, no-lead
VQFN Very-thin quad flat, no-lead
WQFN Very-very-thin quad flat, no-lead
UQFN Ultra-thin quad flat-pack, no-lead
ODFN Optical dual flat, no-lead IC packaged in transparent packaging used in optical sensor

Small outline packages

Acronym Full name Remark
SOP Small-outline package[1]
CSOP Ceramic small-outline package
DSOP Dual small-outline package
HSOP Thermally-enhanced small-outline package
HSSOP Thermally-enhanced shrink small-outline package[16]
HTSSOP Thermally-enhanced thin shrink small-outline package[16]
mini-SOIC Mini small-outline integrated circuit
MSOP Mini small-outline package Maxim uses the trademarked name µMAX for MSOP packages
PSOP Plastic small-outline package[3]
PSON Plastic small-outline no-lead package
QSOP Quarter-size small-outline package The terminal pitch is 0.635 mm.[3]
SOIC Small-outline integrated circuit Also known as SOIC NARROW and SOIC WIDE
SOJ Small-outline J-leaded package
SON Small-outline no-lead package
SSOP Shrink small-outline package[3]
TSOP Thin small-outline package[3]
TSSOP Thin shrink small-outline package[3]
TVSOP Thin very-small-outline package[3]
VSOP Very-small-outline package[16]
VSSOP Very-thin shrink small-outline package[16] Also referred as MSOP = micro small-outline package
WSON Very-very-thin small-outline no-lead package
USON Very-very-thin small-outline no-lead package Slightly smaller than WSON

Chip-scale packages

 
Example WL-CSP devices sitting on the face of a U.S. penny. A SOT-23 device is shown (top) for comparison.
Acronym Full name Remark
BL Beam lead technology Bare silicon chip, an early chip-scale package
CSP Chip-scale package Package size is no more than 1.2× the size of the silicon chip[17][18]
TCSP True chip-size package Package is same size as silicon[19]
TDSP True die-size package Same as TCSP[19]
WCSP or WL-CSP or WLCSP Wafer-level chip-scale package A WL-CSP or WLCSP package is just a bare die with a redistribution layer (or I/O pitch) to rearrange the pins or contacts on the die so that they can be big enough and have sufficient spacing so that they can be handled just like a BGA package.[20]
PMCP Power mount CSP (chip-scale package) Variation of WLCSP, for power devices like MOSFETs. Made by Panasonic.[21]
Fan-out WLCSP Fan-out wafer-level packaging Variation of WLCSP. Like a BGA package but with the interposer built directly atop the die and encapsulated alongside it.
eWLB Embedded wafer level ball grid array Variation of WLCSP.
MICRO SMD - Chip-size package (CSP) developed by National Semiconductor[22]
COB Chip on board Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy.[23] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package.
COF Chip-on-flex Variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead.
TAB Tape-automated bonding Variation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires. Used by LCD driver ICs.
COG Chip-on-glass Variation of TAB, where a chip is mounted directly to a piece of glass - typically an LCD. Used by LCD and OLED driver ICs.

Ball grid array

Main article: Ball grid array

Ball grid array (BGA) uses the underside of the package to place pads with balls of solder in grid pattern as connections to PCB.[1][3]

Acronym Full name Remark
FBGA Fine-pitch ball-grid array A square or rectangular array of solder balls on one surface[3]
LBGA Low-profile ball-grid array Also known as laminate ball-grid array[3]
TEPBGA Thermally-enhanced plastic ball-grid array
CBGA Ceramic ball-grid array[3]
OBGA Organic ball-grid array[3]
TFBGA Thin fine-pitch ball-grid array[3]
PBGA Plastic ball-grid array[3]
MAP-BGA Mold array process - ball-grid array [1]
UCSP Micro (μ) chip-scale package Similar to a BGA (A Maxim trademark )[18]
μBGA Micro ball-grid array Ball spacing less than 1 mm
LFBGA Low-profile fine-pitch ball-grid array[3]
TBGA Thin ball-grid array[3]
SBGA Super ball-grid array[3] Above 500 balls
UFBGA Ultra-fine ball-grid array[3]

Transistor, diode, small-pin-count IC packages

 
A drawing of a ZN414 IC in a TO-18 package
  • MELF: Metal electrode leadless face (usually for resistors and diodes)
  • SOD: Small-outline diode.
  • SOT: Small-outline transistor (also SOT-23, SOT-223, SOT-323).
  • TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes.
    • TO-3: Panel-mount with leads
    • TO-5: Metal can package with radial leads
    • TO-18: Metal can package with radial leads
    • TO-39
    • TO-46
    • TO-66: Similar shape to the TO-3 but smaller
    • TO-92: Plastic-encapsulated package with three leads
    • TO-99: Metal can package with eight radial leads
    • TO-100
    • TO-126: Plastic-encapsulated package with three leads and a hole for mounting on a heat sink
    • TO-220: Through-hole plastic package with a (usually) metal heat sink tab and three leads
    • TO-226[24]
    • TO-247:[25] Plastic-encapsulated package with three leads and a hole for mounting on a heat sink
    • TO-251:[25] Also called IPAK: SMT package similar to the DPAK but with longer leads for SMT or TH mounting
    • TO-252:[25] (also called SOT428, DPAK):[25] SMT package similar to the DPAK but smaller
    • TO-262:[25] Also called I2PAK: SMT package similar to the D2PAK but with longer leads for SMT or TH mounting
    • TO-263:[25] Also called D2PAK: SMT package similar to the TO-220 without the extended tab and mounting hole
    • TO-274:[25] Also called Super-247: SMT package similar to the TO-247 without the mounting hole

Dimension reference

Surface-mount

 
C
Clearance between IC body and PCB
H
Total height
T
Lead thickness
L
Total carrier length
LW
Lead width
LL
Lead length
P
Pitch

Through-hole

 
C
Clearance between IC body and board
H
Total height
T
Lead thickness
L
Total carrier length
LW
Lead width
LL
Lead length
P
Pitch
WB
IC body width
WL
Lead-to-lead width

Package dimensions

All measurements below are given in mm. To convert mm to mils, divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 mil).

C
Clearance between package body and PCB.
H
Height of package from pin tip to top of package.
T
Thickness of pin.
L
Length of package body only.
LW
Pin width.
LL
Pin length from package to pin tip.
P
Pin pitch (distance between conductors to the PCB).
WB
Width of the package body only.
WL
Length from pin tip to pin tip on the opposite side.

Dual row

Image Family Pin Name Package L WB WL H C P LL T LW
  DIP Y Dual inline package 8-DIP 9.2–9.8 6.2–6.48 7.62 7.7 2.54 (0.1 in) 3.05–3.6 1.14–1.73
32-DIP 15.24 2.54 (0.1 in)
LFCSP N Lead-frame chip-scale package 0.5
  MSOP Y Mini small-outline package 8-MSOP 3 3 4.9 1.1 0.10 0.65 0.95 0.18 0.17–0.27
10-MSOP 3 3 4.9 1.1 0.10 0.5 0.95 0.18 0.17–0.27
16-MSOP 4.04 3 4.9 1.1 0.10 0.5 0.95 0.18 0.17–0.27
  SO
SOIC
SOP 		Y Small-outline integrated circuit 8-SOIC 4.8–5.0 3.9 5.8–6.2 1.72 0.10–0.25 1.27 1.05 0.19–0.25 0.39–0.46
14-SOIC 8.55–8.75 3.9 5.8–6.2 1.72 0.10–0.25 1.27 1.05 0.19–0.25 0.39–0.46
16-SOIC 9.9–10 3.9 5.8–6.2 1.72 0.10–0.25 1.27 1.05 0.19–0.25 0.39–0.46
16-SOIC 10.1–10.5 7.5 10.00–10.65 2.65 0.10–0.30 1.27 1.4 0.23–0.32 0.38–0.40
  SOT Y Small-outline transistor SOT-23-6 2.9 1.6 2.8 1.45 0.95 0.6 0.22–0.38
SSOP Y Shrink small-outline package 0.65
TDFN N Thin dual flat no-lead 8-TDFN 3 3 3 0.7–0.8 0.65 — 0.19–0.3
TSOP Y Thin small-outline package 0.5
 
 TSSOP Y Thin shrink small-outline package 8-TSSOP[26] 2.9-3.1 4.3-4.5 6.4 1.2 0.15 0.65 0.09–0.2 0.19–0.3
Y 14-TSSOP[27] 4.9-5.1 4.3-4.5 6.4 1.1 0.05-0.15 0.65 0.09-0.2 0.19-0.30
20-TSSOP[28] 6.4-6.6 4.3-4.5 6.4 1.1 .05-0.15 0.65 0.09-0.2 0.19-0.30
µSOP Y Micro small-outline package[29] µSOP-8 3 4.9 1.1 0.65
US8[30] Y US8 package 2 2.3 3.1 .7 0.5

Quad rows

Image Family Pin Name Package WB WL H C L P LL T LW
  PLCC N Plastic leaded chip-carrier 1.27
CLCC N Ceramic leadless chip-carrier 48-CLCC 14.22 14.22 2.21 14.22 1.016 — 0.508
  LQFP Y Low-profile quad flat package 0.50
  TQFP Y Thin quad flat-package TQFP-44 10.00 12.00 0.35–0.50 0.80 1.00 0.09–0.20 0.30–0.45
TQFN N Thin quad flat no-lead

LGA

Package x y z
52-ULGA 12 mm 17 mm 0.65 mm
52-ULGA 14 mm 18 mm 0.10 mm
52-VELGA ? ? ?

Multi-chip packages

A variety of techniques for interconnecting several chips within a single package have been proposed and researched:

By terminal count

 
Example of component sizes, metric and imperial codes and comparison included
 
Composite image of a 11×44 LED matrix lapel name tag display using 1608/0603-type SMD LEDs. Top: A little over half of the 21×86 mm display. Center: Close-up of LEDs in ambient light. Bottom: LEDs in their own red light.
 
SMD capacitors (on the left) with two through-hole capacitors (on the right)
Main article: Chip carrier

Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. The electronics industry has standardized package shapes and sizes (the leading standardisation body is JEDEC).

The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008). Exceptions occur for imperial in the two smallest rectangular passive sizes. The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm × 0.125 mm (0.0098 in × 0.0049 in),[32] but the imperial 01005 name is already being used for the 0.4 mm × 0.2 mm (0.0157 in × 0.0079 in) package. These increasingly small sizes, especially 0201 and 01005, can sometimes be a challenge from a manufacturability or reliability perspective.[33]

Two-terminal packages

Rectangular passive components

Mostly resistors and capacitors.

Package Approximate dimensions, length × width Typical resistor
power rating (W)
Metric Imperial
0201 008004 0.25 mm × 0.125 mm 0.010 in × 0.005 in
03015 009005 0.3 mm × 0.15 mm 0.012 in × 0.006 in 0.02[34]
0402 01005 0.4 mm × 0.2 mm 0.016 in × 0.008 in 0.031[35]
0603 0201 0.6 mm × 0.3 mm 0.02 in × 0.01 in 0.05[35]
1005 0402 1.0 mm × 0.5 mm 0.04 in × 0.02 in 0.062[36]–0.1[35]
1608 0603 1.6 mm × 0.8 mm 0.06 in × 0.03 in 0.1[35]
2012 0805 2.0 mm × 1.25 mm 0.08 in × 0.05 in 0.125[35]
2520 1008 2.5 mm × 2.0 mm 0.10 in × 0.08 in
3216 1206 3.2 mm × 1.6 mm 0.125 in × 0.06 in 0.25[35]
3225 1210 3.2 mm × 2.5 mm 0.125 in × 0.10 in 0.5[35]
4516 1806 4.5 mm × 1.6 mm 0.18 in × 0.06 in[37]
4532 1812 4.5 mm × 3.2 mm 0.18 in × 0.125 in 0.75[35]
4564 1825 4.5 mm × 6.4 mm 0.18 in × 0.25 in 0.75[35]
5025 2010 5.0 mm × 2.5 mm 0.20 in × 0.10 in 0.75[35]
6332 2512 6.3 mm × 3.2 mm 0.25 in × 0.125 in 1[35]
6863 2725 6.9 mm × 6.3 mm 0.27 in × 0.25 in 3
7451 2920 7.4 mm × 5.1 mm 0.29 in × 0.20 in[38]

Tantalum capacitors

Main article: Tantalum capacitor
Package Dimensions (Length, typ. × width, typ. × height, max.)
EIA 2012-12 (KEMET R, AVX R) 2.0 mm × 1.3 mm × 1.2 mm
EIA 3216-10 (KEMET I, AVX K) 3.2 mm × 1.6 mm × 1.0 mm
EIA 3216-12 (KEMET S, AVX S) 3.2 mm × 1.6 mm × 1.2 mm
EIA 3216-18 (KEMET A, AVX A) 3.2 mm × 1.6 mm × 1.8 mm
EIA 3528-12 (KEMET T, AVX T) 3.5 mm × 2.8 mm × 1.2 mm
EIA 3528-21 (KEMET B, AVX B) 3.5 mm × 2.8 mm × 2.1 mm
EIA 6032-15 (KEMET U, AVX W) 6.0 mm × 3.2 mm × 1.5 mm
EIA 6032-28 (KEMET C, AVX C) 6.0 mm × 3.2 mm × 2.8 mm
EIA 7260-38 (KEMET E, AVX V) 7.2 mm × 6.0 mm × 3.8 mm
EIA 7343-20 (KEMET V, AVX Y) 7.3 mm × 4.3 mm × 2.0 mm
EIA 7343-31 (KEMET D, AVX D) 7.3 mm × 4.3 mm × 3.1 mm
EIA 7343-43 (KEMET X, AVX E) 7.3 mm × 4.3 mm × 4.3 mm

[39][40]

Aluminum capacitors

Main article: Electrolytic capacitor
Package Dimensions (Length, typ. × width, typ. × height, max.)
Cornell-Dubilier A 3.3 mm × 3.3 mm × 5.5 mm
Chemi-Con D 4.3 mm × 4.3 mm × 5.7 mm
Panasonic B 4.3 mm × 4.3 mm × 6.1 mm
Chemi-Con E 5.3 mm × 5.3 mm × 5.7 mm
Panasonic C 5.3 mm × 5.3 mm × 6.1 mm
Chemi-Con F 6.6 mm × 6.6 mm × 5.7 mm
Panasonic D 6.6 mm × 6.6 mm × 6.1 mm
Panasonic E/F, Chemi-Con H 8.3 mm × 8.3 mm × 6.5 mm
Panasonic G, Chemi-Con J 10.3 mm × 10.3 mm × 10.5 mm
Chemi-Con K 13 mm × 13 mm × 14 mm
Panasonic H 13.5 mm × 13.5 mm × 14 mm
Panasonic J, Chemi-Con L 17 mm × 17 mm × 17 mm
Panasonic K, Chemi-Con M 19 mm × 19 mm × 17 mm

[41][42][43]

Small-outline diode (SOD)

Package Dimensions (Length, typ. × width, typ. × height, max.)
SOD-80C 3.5 mm × ⌀ 1.5 mm[44]
SOD-123 2.65 mm × 1.6 mm × 1.35 mm[45]
SOD-128 3.8 mm × 2.5 mm × 1.1 mm[46]
SOD-323 (SC-76) 1.7 mm × 1.25 mm × 1.1 mm[47]
SOD-523 (SC-79) 1.2 mm × 0.8 mm × 0.65 mm[48]
SOD-723 1.4 mm × 0.6 mm × 0.65 mm[49]
SOD-923 0.8 mm × 0.6 mm × 0.4 mm[50]

Metal electrode leadless face (MELF)

Main article: MELF Electronic Components

Mostly resistors and diodes; barrel shaped components, dimensions do not match those of rectangular references for identical codes.[51]

Package Dimensions
Typical resistor rating
Power (W) Voltage (V)
MicroMELF (MMU), 0102 2.2 mm × ⌀ 1.1 mm 0.2–0.3 150
MiniMELF (MMA), 0204 3.6 mm × ⌀ 1.4 mm 0.25–0.4 200
MELF (MMB), 0207 5.8 mm × ⌀ 2.2 mm 0.4–1.0 300

DO-214

Main article: DO-214

Commonly used for rectifier, Schottky, and other diodes.

Package Dimensions (incl. leads) (Length, typ. × width, typ. × height, max.)
DO-214AA (SMB) 5.4 mm × 3.6 mm × 2.65 mm[52]
DO-214AB (SMC) 7.95 mm × 5.9 mm × 2.25 mm[52]
DO-214AC (SMA) 5.2 mm × 2.6 mm × 2.15 mm[52]

Three- and four-terminal packages

Small-outline transistor (SOT)

Main article: Small-outline transistor
Package Aliases Dimensions (excl. leads) (Length, typ. × width, typ. × height, max.) Number of terminals Remark
SOT-23-3 TO-236-3, SC-59 2.92 mm × 1.3 mm × 1.12 mm[53] 3
SOT-89 TO-243,[54] SC-62[55] 4.5 mm × 2.5 mm × 1.5 mm[56] 4 Center pin is connected to a large heat-transfer pad
SOT-143 TO-253 2.9 mm × 1.3 mm × 1.22 mm[57] 4 Tapered body, one larger pad denotes terminal 1
SOT-223 TO-261 6.5 mm × 3.5 mm × 1.8 mm[58] 4 One terminal is a large heat-transfer pad
SOT-323 SC-70 2 mm × 1.25 mm × 1.1 mm[59] 3
SOT-416 SC-75 1.6 mm × 0.8 mm × 0.9 mm[60] 3
SOT-663 1.6 mm × 1.2 mm × 0.6 mm[61] 3
SOT-723 1.2 mm × 0.8 mm × 0.55[62] 3 Has flat leads
SOT-883 SC-101 1 mm × 0.6 mm × 0.5 mm[63] 3 Is lead-less

Other

  • DPAK (TO-252, SOT-428): Discrete Packaging. Developed by Motorola to house higher powered devices. Comes in three[64] or five-terminal[65] versions.
  • D2PAK (TO-263, SOT-404): Bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions.[66]
  • D3PAK (TO-268): Even larger than D2PAK.[67][68]

Five- and six-terminal packages

Small-outline transistor (SOT)

Package Aliases Dimensions (excl. leads) (Length, typ. × width, typ. × height, max.) Number of terminals Leaded or leadless
SOT-23-6 SOT-26, SC-74 2.9 mm × 1.3 mm × 1.3 mm[69] 6 Leaded
SOT-353 SC-88A 2 mm × 1.25 mm × 0.95 mm[70] 5 Leaded
SOT-363 SC-88, SC-70-6 2 mm × 1.25 mm × 0.95 mm[71] 6 Leaded
SOT-563 1.6 mm × 1.2 mm × 0.6 mm[72] 6 Leaded
SOT-665 1.6 mm × 1.6 mm × 0.55 mm[73] 5 Leaded
SOT-666 1.6 mm × 1.2 mm × 0.6 mm[74] 6 Leaded
SOT-886 1.45 mm × 1 mm × 0.5 mm[75] 6 Leadless
SOT-891 1 mm × 1 mm × 0.5 mm[76] 5 Leadless
SOT-953 1 mm × 0.8 mm × 0.5 mm[77] 5 Leaded
SOT-963 1 mm × 1 mm × 0.5 mm[78] 6 Leaded
SOT-1115 1 mm × 0.9 mm × 0.35 mm[79] 6 Leadless
SOT-1202 1 mm × 1 mm × 0.35 mm[80] 6 Leadless
 
Various SMD chips, desoldered
 
MLP package 28-pin chip, upside down to show contacts

Packages with more than six terminals

Dual-in-line

Main article: Dual in-line package

Quad-in-line

Quad-in-line:

  • Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm
  • Quad flat package (QFP): various sizes, with pins on all four sides
  • Low-profile quad flat-package (LQFP): 1.4 mm high, varying sized and pins on all four sides
  • Plastic quad flat-pack (PQFP), a square with pins on all four sides, 44 or more pins
  • Ceramic quad flat-pack (CQFP): similar to PQFP
  • Metric quad flat-pack (MQFP): a QFP package with metric pin distribution
  • Thin quad flat-pack (TQFP), a thinner version of LQFP
  • Quad flat no-lead (QFN): smaller footprint than leaded equivalent
  • Leadless chip carrier (LCC): contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
  • Micro leadframe package (MLP, MLF): with a 0.5 mm contact pitch, no leads (same as QFN)
  • Power quad flat no-lead (PQFN): with exposed die-pads for heatsinking

Grid arrays

  • Ball grid array (BGA): A square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm (0.050 in)
    • Fine-pitch ball grid array (FBGA): A square or rectangular array of solder balls on one surface
    • Low-profile fine-pitch ball grid array (LFBGA): A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
    • Micro ball grid array (μBGA): Ball spacing less than 1 mm
    • Thin fine-pitch ball grid array (TFBGA): A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
  • Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN, but mating is by spring pins within a socket rather than solder.
  • Column grid array (CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern.
    • Ceramic column grid array (CCGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
  • Lead-less package (LLP): A package with metric pin distribution (0.5 mm pitch).

Non-packaged devices

Although surface-mount, these devices require specific process for assembly.

  • Chip-on-board (COB), a bare silicon chip, that is usually an integrated circuit, is supplied without a package (which is usually a lead frame overmolded with epoxy) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
  • Chip-on-flex (COF), a variation of COB, where a chip is mounted directly to a flex circuit. Tape-automated bonding process is also a chip-on-flex process as well.
  • Chip-on-glass (COG), a variation of COB, where a chip, typically a liquid crystal display (LCD) controller, is mounted directly on glass.
  • Chip-on-wire (COW), a variation of COB, where a chip, typically a LED or RFID chip, is mounted directly on wire, thus making it a very thin and flexible wire. Such wire may then be covered with cotton, glass or other materials to make into smart textiles or electronic textiles.

There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards.

See also

References

  1. ^ a b c d e f g h i j k l m n o "CPU Collection Museum - Chip Package Information". The CPU Shack. Retrieved 2011-12-15.
  2. ^ (PDF). Archived from the original (PDF) on 2011-08-15. Retrieved 2011-02-03.{{cite web}}: CS1 maint: archived copy as title (link)
  3. ^ a b c d e f g h i j k l m n o p q r s t u v w x y z aa ab ac ad ae af ag ah ai aj ak al am "Integrated Circuit, IC Package Types; SOIC. Surface Mount Device Package". Interfacebus.com. Retrieved 2011-12-15.
  4. ^ . National.com. Archived from the original on 2012-02-18. Retrieved 2011-12-15.
  5. ^ . National.com. Archived from the original on 2007-10-21. Retrieved 2011-12-15.
  6. ^ . National.com. Archived from the original on 2011-02-13. Retrieved 2011-12-15.
  7. ^ "LTCC Low Temperature Co-fired Ceramic". Minicaps.com. Retrieved 2011-12-15.
  8. ^ Frye, R.C.; Gabara, T.J.; Tai, K.L.; Fischer, W.C.; Knauer, S.C. (1993). "Performance evaluation of MCM chip-to-chip interconnections using custom I/O buffer designs". Sixth Annual IEEE International ASIC Conference and Exhibit. Ieeexplore.ieee.org. pp. 464–467. doi:10.1109/ASIC.1993.410760. ISBN 978-0-7803-1375-0. S2CID 61288567.
  9. ^ . National.com. Archived from the original on 2012-02-18. Retrieved 2011-12-15.
  10. ^ Meyers, Michael; Jernigan, Scott (2004). Mike Meyers' A+ Guide to PC Hardware. The McGraw-Hill Companies. ISBN 978-0-07-223119-9.
  11. ^ . ir.conexant.com. Archived from the original on August 18, 2011.
  12. ^ "Press Releases - Motorola Mobility, Inc". Motorola.com. Retrieved 2011-12-15.
  13. ^ "Xilinx new CPLDs with two I/O banks". Eetasia.com. 2004-12-08. Retrieved 2011-12-15.
  14. ^ "Packages". Chelseatech.com. 2010-11-15. Retrieved 2011-12-15.
  15. ^ . Archived from the original on 2008-11-20. Retrieved 2009-10-24.
  16. ^ a b c d "Packaging Terminology". Texas Instruments.
  17. ^ "CSP - Chip Scale Package". Siliconfareast.com. Retrieved 2011-12-15.
  18. ^ a b "Understanding Flip-Chip and Chip-Scale Package Technologies and Their Applications - Maxim". Maxim-ic.com. 2007-04-18. Retrieved 2011-12-15.
  19. ^ a b "Chip Scale Review Online". Chipscalereview.com. Retrieved 2011-12-15.
  20. ^ https://www.nxp.com/docs/en/application-note/AN3846.pdf[bare URL PDF]
  21. ^ "Panasonic Industrial Devices".
  22. ^ . National.com. Archived from the original on 2010-08-01. Retrieved 2011-12-15.
  23. ^ "How Chip-On-Boards are Made - SparkFun Learn".
  24. ^ . Archived from the original on 2010-08-23.
  25. ^ a b c d e f g "IR Packages".
  26. ^ "TSSOP-8 Package Dimensions by Diodes Incorporated" (PDF).
  27. ^ "F Package -- 14-Lead Plastic TSSOP (4.4mm)-- (Reference LTC DWG # 05-08-1650)" (PDF).
  28. ^ "F Package -- 20-Lead Plastic TSSOP (4.4mm) -- (Reference LTC DWG # 05-08-1650)" (PDF).
  29. ^ http://pdfserv.maximintegrated.com/package_dwgs/21-0036.PDF[bare URL PDF]
  30. ^ (PDF). March 22, 2013. Archived from the original (PDF) on January 8, 2015.
  31. ^ , 2004, archived from the original on 2009-07-18
  32. ^ Murata, Tsuneo (2012-09-05). "Murata's world's Smallest Monolithic Ceramic Capacitor - 0201 <millimeter size> size (0.25 mm x 0.125 mm)" (Press release). Kyoto, Japan: Murata Manufacturing Co., Ltd. from the original on 2015-12-28. Retrieved 2015-12-28.
  33. ^ "White Paper 0201 and 01005 Adoption in Industry" (PDF). Retrieved 7 February 2018.
  34. ^ "SMR Series Ultra-Compact Chip Resistors" (PDF). Datasheet. Rohm Semiconductor.
  35. ^ a b c d e f g h i j k (PDF). Datasheet. Panasonic. Archived from the original (PDF) on 2014-02-09.
  36. ^ (PDF). Datasheet. electronic sensor + resistor GmbH. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  37. ^ "SMD/BLOCK Type EMI Suppression Filters EMIFIL" (PDF). Catalog. Murata Manufacturing Co., Ltd. from the original on 2015-12-28. Retrieved 2015-12-28.
  38. ^ "POLYFUSE® Resettable Fuses SMD2920" (PDF). Datasheet. Littelfuse. Retrieved 2015-12-28.
  39. ^ "TLJ Series - Tantalum Solid Electrolytic Chip Capacitors High CV Consumer Series" (PDF). Datasheet. AVX Corporation. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  40. ^ (PDF). Catalog. KEMET Electronics Corporation. 2011-09-06. Archived from the original (PDF) on 2011-12-26. Retrieved 2015-12-28.
  41. ^ (PDF). Datasheet. Panasonic. Archived from the original (PDF) on 2012-03-01. Retrieved 2015-12-28.
  42. ^ "Application Guide - Aluminum SMT Capacitors" (PDF). Resources. Cornell Dubilier. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  43. ^ "Surface Mount Aluminum Electrolytic Capacitors - Alchip-MVA Series" (PDF). Nippon Chemi-Con. Retrieved 2015-12-28.
  44. ^ "SOD 80C Hermetically sealed glass surface-mounted package" (PDF). NXP Semiconductors. (PDF) from the original on 2012-04-23. Retrieved 2015-12-28.
  45. ^ "Designer's™ Data Sheet - Surface Mount Silicon Zener Diodes - Plastic SOD-123 Package" (PDF). Motorola. Retrieved 2015-12-28.
  46. ^ "SOD128 plastic, surface mounted package" (PDF). NXP Semiconductors. 2017. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  47. ^ "SOD323 plastic, surface-mounted package" (PDF). NXP Semiconductors. 2019. (PDF) from the original on 2012-11-19. Retrieved 2015-12-28.
  48. ^ "SOD523 Package outline" (PDF). NXP Semiconductors. 2008. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  49. ^ "Comchip CDSP400-G" (PDF). Datasheet. Comchip Technology Corporation. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  50. ^ "SOD923 Microlead ultra small surface-mounted plastic package" (PDF). Datasheet. NXP Semiconductors.
  51. ^ "Professional Thin Film MELF Resistors" (PDF). Vishay Intertechnology. 2014-04-22. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  52. ^ a b c "Package Outline Dimensions - U-DFN1616-6 (Type F)" (PDF). Diodes Incorporated. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  53. ^ "Package Outline Drawing - P3.064" (PDF). Intersil. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  54. ^ "3-Lead Small Outline Transistor Package [SOT-89] (RK-3)" (PDF). Analog Devices. 2013-09-12. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  55. ^ "Standards for the Dimensions of Semiconductor Devices" (PDF). Electronic Industries Association of Japan. 1996-04-15. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  56. ^ "Package Information - SOT-89" (PDF). RICOH. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  57. ^ https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sot-143ra/ra_4.pdf[bare URL PDF]
  58. ^ "SOT-233 Molded Package" (PDF). Fairchild Semiconductor. 2008-02-26. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  59. ^ (PDF). NXP Semiconductors. 2008. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  60. ^ (PDF). NXP Semiconductors. 2010. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  61. ^ "SOT663 Package outline" (PDF). NXP Semiconductors. 2008. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  62. ^ "Mechanical Case Outline SOT-723" (PDF). ON Semiconductor. 2009-08-10. Retrieved 2015-12-28.
  63. ^ "SOT883 Package outline" (PDF). NXP Semiconductors. 2008. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  64. ^ (PDF). Vishay Intertechnology. 2012-12-05. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  65. ^ "Mechanical Case Outline - DPAK-5" (PDF). ON Semiconductor. 2014-05-15. Retrieved 2015-12-28.
  66. ^ (PDF). Vishay Intertechnology. 2015-07-08. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  67. ^ "Phase-leg Rectifier Diode" (PDF). IXYS Corporation. 2002. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  68. ^ admin. "D3PAK: Decawatt Package 3 (TO-268, Discrete Package) | MADPCB". Printed Circuit Board Manufacturing, PCB Assembly & PCB Design - MADPCB. Retrieved 2022-04-08.
  69. ^ "P6.064 Package Outline Drawing" (PDF). Intersil. 2010. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  70. ^ (PDF). NXP Semiconductors. 2008. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  71. ^ (PDF). NXP Semiconductors. 2008. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  72. ^ "SOT563 Package Details" (PDF). Central Semiconductor. 2015-05-22. (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  73. ^ (PDF). NXP Semiconductors. 2008. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  74. ^ (PDF). NXP Semiconductors. 2008. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  75. ^ "SOT886 Package outline" (PDF). NXP Semiconductors. 2017.
  76. ^ "SOT891 XSON6: plastic extremely thin small outline package; noleads" (PDF). NXP Semiconductors. 2016.
  77. ^ "SOT953 Package information" (PDF). Diodes Incorporated. 2017.
  78. ^ "SOT963 Package details" (PDF). Central Semiconductor Corp. 2010.
  79. ^ (PDF). NXP Semiconductors. 2010. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  80. ^ (PDF). NXP Semiconductors. 2010. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  81. ^ . www.SiliconFarEast.com. Archived from the original on 2013-07-26. Retrieved 2015-12-28.

External links

 
Wikimedia Commons has media related to IC packages.
  • JEDEC JEP95 official list of all (over 500) standard electronic packages
  • ICpackage.org
  • Solder Pad Layout Dimensions
  • International Microelectronics And Packaging Society

January 07, 2023
list, integrated, circuit, packaging, types, this, article, uses, bare, urls, which, uninformative, vulnerable, link, please, consider, converting, them, full, citations, ensure, article, remains, verifiable, maintains, consistent, citation, style, several, te. This article uses bare URLs which are uninformative and vulnerable to link rot Please consider converting them to full citations to ensure the article remains verifiable and maintains a consistent citation style Several templates and tools are available to assist in formatting such as Reflinks documentation reFill documentation and Citation bot documentation June 2022 Learn how and when to remove this template message Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage A very large number of different types of package exist Some package types have standardized dimensions and tolerances and are registered with trade industry associations such as JEDEC and Pro Electron Other types are proprietary designations that may be made by only one or two manufacturers Integrated circuit packaging is the last assembly process before testing and shipping devices to customers A standard sized 8 pin dual in line package DIP containing a 555 IC Occasionally specially processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier In flip chip systems the IC is connected by solder bumps to a substrate In beam lead technology the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit Assemblies using bare chips have additional packaging or filling with epoxy to protect the devices from moisture Contents 1 Through hole packages 2 Surface mount 3 Chip carrier 4 Pin grid arrays 5 Flat packages 6 Small outline packages 7 Chip scale packages 8 Ball grid array 9 Transistor diode small pin count IC packages 10 Dimension reference 10 1 Surface mount 10 2 Through hole 11 Package dimensions 11 1 Dual row 11 2 Quad rows 11 3 LGA 12 Multi chip packages 13 By terminal count 13 1 Two terminal packages 13 1 1 Rectangular passive components 13 1 2 Tantalum capacitors 13 1 3 Aluminum capacitors 13 1 4 Small outline diode SOD 13 1 5 Metal electrode leadless face MELF 13 1 6 DO 214 13 2 Three and four terminal packages 13 2 1 Small outline transistor SOT 13 2 2 Other 13 3 Five and six terminal packages 13 3 1 Small outline transistor SOT 13 4 Packages with more than six terminals 13 4 1 Dual in line 13 4 2 Quad in line 13 4 3 Grid arrays 13 4 4 Non packaged devices 14 See also 15 References 16 External linksThrough hole packages EditMain article dual in line package Through hole technology uses holes drilled through the printed circuit board PCB for mounting the components The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB Three 14 pin DIP14 plastic dual in line packages containing IC chips Acronym Full name RemarkSIP Single in line packageDIP Dual in line package 0 1 in 2 54 mm pin spacing rows 0 3 in 7 62 mm or 0 6 in 15 24 mm apart CDIP Ceramic DIP 1 CERDIP Glass sealed ceramic DIP 1 QIP Quadruple in line package Like DIP but with staggered zig zag pins 1 SKDIP Skinny DIP Standard DIP with 0 1 in 2 54 mm pin spacing rows 0 3 in 7 62 mm apart 1 SDIP Shrink DIP Non standard DIP with smaller 0 07 in 1 78 mm pin spacing 1 ZIP Zig zag in line packageMDIP Molded DIP 2 PDIP Plastic DIP 1 Surface mount EditSee also Surface mount technology Acronym Full name RemarkCCGA Ceramic column grid array CGA 3 CGA Column grid array 3 CERPACK Ceramic package 4 CQGP 5 LLP Lead less lead frame package A package with metric pin distribution 0 5 0 8 mm pitch 6 LGA Land grid array 3 LTCC Low temperature co fired ceramic 7 MCM Multi chip module 8 MICRO SMDXT Micro surface mount device extended technology 9 Chip on board is a packaging technique that directly connects a die to a PCB without an interposer or lead frame Chip carrier EditMain article chip carrier A chip carrier is a rectangular package with contacts on all four edges Leaded chip carriers have metal leads wrapped around the edge of the package in the shape of a letter J Leadless chip carriers have metal pads on the edges Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering though sockets can be used for testing Acronym Full name RemarkBCC Bump chip carrier 3 CLCC Ceramic lead less chip carrier 1 LCC Lead less chip carrier 3 Contacts are recessed vertically LCC Leaded chip carrier 3 LCCC Leaded ceramic chip carrier 3 DLCC Dual lead less chip carrier ceramic 3 PLCC Plastic leaded chip carrier 1 3 Pin grid arrays EditMain article Pin grid array Acronym Full name RemarkOPGA Organic pin grid arrayFCPGA Flip chip pin grid array 3 PAC Pin array cartridge 10 PGA Pin grid array Also known as PPGA 1 CPGA Ceramic pin grid array 3 Flat packages EditMain article Quad Flat Package Acronym Full name Remark Flat pack Earliest version metal ceramic packaging with flat leadsCFP Ceramic flat pack 3 CQFP Ceramic quad flat pack 1 3 Similar to PQFPBQFP Bumpered quad flat pack 3 DFN Dual flat pack No lead 3 ETQFP Exposed thin quad flat package 11 PQFN Power quad flat pack No leads with exposed die pad s for heatsinking 12 PQFP Plastic quad flat package 1 3 LQFP Low profile quad flat package 3 QFN Quad flat no leads package Also called as micro lead frame MLF 3 13 QFP Quad flat package 1 3 MQFP Metric quad flat pack QFP with metric pin distribution 3 HVQFN Heat sink very thin quad flat pack no leadsSIDEBRAZE 14 15 clarification needed clarification needed TQFP Thin quad flat pack 1 3 VQFP Very thin quad flat pack 3 TQFN Thin quad flat no leadVQFN Very thin quad flat no leadWQFN Very very thin quad flat no leadUQFN Ultra thin quad flat pack no leadODFN Optical dual flat no lead IC packaged in transparent packaging used in optical sensorSmall outline packages EditAcronym Full name RemarkSOP Small outline package 1 CSOP Ceramic small outline packageDSOP Dual small outline packageHSOP Thermally enhanced small outline packageHSSOP Thermally enhanced shrink small outline package 16 HTSSOP Thermally enhanced thin shrink small outline package 16 mini SOIC Mini small outline integrated circuitMSOP Mini small outline package Maxim uses the trademarked name µMAX for MSOP packagesPSOP Plastic small outline package 3 PSON Plastic small outline no lead packageQSOP Quarter size small outline package The terminal pitch is 0 635 mm 3 SOIC Small outline integrated circuit Also known as SOIC NARROW and SOIC WIDESOJ Small outline J leaded packageSON Small outline no lead packageSSOP Shrink small outline package 3 TSOP Thin small outline package 3 TSSOP Thin shrink small outline package 3 TVSOP Thin very small outline package 3 VSOP Very small outline package 16 VSSOP Very thin shrink small outline package 16 Also referred as MSOP micro small outline packageWSON Very very thin small outline no lead packageUSON Very very thin small outline no lead package Slightly smaller than WSONChip scale packages Edit Example WL CSP devices sitting on the face of a U S penny A SOT 23 device is shown top for comparison Acronym Full name RemarkBL Beam lead technology Bare silicon chip an early chip scale packageCSP Chip scale package Package size is no more than 1 2 the size of the silicon chip 17 18 TCSP True chip size package Package is same size as silicon 19 TDSP True die size package Same as TCSP 19 WCSP or WL CSP or WLCSP Wafer level chip scale package A WL CSP or WLCSP package is just a bare die with a redistribution layer or I O pitch to rearrange the pins or contacts on the die so that they can be big enough and have sufficient spacing so that they can be handled just like a BGA package 20 PMCP Power mount CSP chip scale package Variation of WLCSP for power devices like MOSFETs Made by Panasonic 21 Fan out WLCSP Fan out wafer level packaging Variation of WLCSP Like a BGA package but with the interposer built directly atop the die and encapsulated alongside it eWLB Embedded wafer level ball grid array Variation of WLCSP MICRO SMD Chip size package CSP developed by National Semiconductor 22 COB Chip on board Bare die supplied without a package It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy 23 Also used for LEDs In LEDs transparent epoxy or a silicon caulk like material that may contain a phosphor is poured into a mold containing the LED s and cured The mold forms part of the package COF Chip on flex Variation of COB where a chip is mounted directly to a flex circuit Unlike COB it may not use wires nor be covered with epoxy using underfill instead TAB Tape automated bonding Variation of COF where a flip chip is mounted directly to a flex circuit without the use of bonding wires Used by LCD driver ICs COG Chip on glass Variation of TAB where a chip is mounted directly to a piece of glass typically an LCD Used by LCD and OLED driver ICs Ball grid array EditMain article Ball grid array Ball grid array BGA uses the underside of the package to place pads with balls of solder in grid pattern as connections to PCB 1 3 Acronym Full name RemarkFBGA Fine pitch ball grid array A square or rectangular array of solder balls on one surface 3 LBGA Low profile ball grid array Also known as laminate ball grid array 3 TEPBGA Thermally enhanced plastic ball grid arrayCBGA Ceramic ball grid array 3 OBGA Organic ball grid array 3 TFBGA Thin fine pitch ball grid array 3 PBGA Plastic ball grid array 3 MAP BGA Mold array process ball grid array 1 UCSP Micro m chip scale package Similar to a BGA A Maxim trademark example 18 mBGA Micro ball grid array Ball spacing less than 1 mmLFBGA Low profile fine pitch ball grid array 3 TBGA Thin ball grid array 3 SBGA Super ball grid array 3 Above 500 ballsUFBGA Ultra fine ball grid array 3 Transistor diode small pin count IC packages Edit A drawing of a ZN414 IC in a TO 18 package MELF Metal electrode leadless face usually for resistors and diodes SOD Small outline diode SOT Small outline transistor also SOT 23 SOT 223 SOT 323 TO XX wide range of small pin count packages often used for discrete parts like transistors or diodes TO 3 Panel mount with leads TO 5 Metal can package with radial leads TO 18 Metal can package with radial leads TO 39 TO 46 TO 66 Similar shape to the TO 3 but smaller TO 92 Plastic encapsulated package with three leads TO 99 Metal can package with eight radial leads TO 100 TO 126 Plastic encapsulated package with three leads and a hole for mounting on a heat sink TO 220 Through hole plastic package with a usually metal heat sink tab and three leads TO 226 24 TO 247 25 Plastic encapsulated package with three leads and a hole for mounting on a heat sink TO 251 25 Also called IPAK SMT package similar to the DPAK but with longer leads for SMT or TH mounting TO 252 25 also called SOT428 DPAK 25 SMT package similar to the DPAK but smaller TO 262 25 Also called I2PAK SMT package similar to the D2PAK but with longer leads for SMT or TH mounting TO 263 25 Also called D2PAK SMT package similar to the TO 220 without the extended tab and mounting hole TO 274 25 Also called Super 247 SMT package similar to the TO 247 without the mounting holeDimension reference EditSurface mount Edit C Clearance between IC body and PCB H Total height T Lead thickness L Total carrier length LW Lead width LL Lead length P Pitch Through hole Edit C Clearance between IC body and board H Total height T Lead thickness L Total carrier length LW Lead width LL Lead length P Pitch WB IC body width WL Lead to lead widthPackage dimensions EditAll measurements below are given in mm To convert mm to mils divide mm by 0 0254 i e 2 54 mm 0 0254 100 mil C Clearance between package body and PCB H Height of package from pin tip to top of package T Thickness of pin L Length of package body only LW Pin width LL Pin length from package to pin tip P Pin pitch distance between conductors to the PCB WB Width of the package body only WL Length from pin tip to pin tip on the opposite side Dual row Edit Image Family Pin Name Package L WB WL H C P LL T LW DIP Y Dual inline package 8 DIP 9 2 9 8 6 2 6 48 7 62 7 7 2 54 0 1 in 3 05 3 6 1 14 1 7332 DIP 15 24 2 54 0 1 in LFCSP N Lead frame chip scale package 0 5 MSOP Y Mini small outline package 8 MSOP 3 3 4 9 1 1 0 10 0 65 0 95 0 18 0 17 0 2710 MSOP 3 3 4 9 1 1 0 10 0 5 0 95 0 18 0 17 0 2716 MSOP 4 04 3 4 9 1 1 0 10 0 5 0 95 0 18 0 17 0 27 SOSOICSOP Y Small outline integrated circuit 8 SOIC 4 8 5 0 3 9 5 8 6 2 1 72 0 10 0 25 1 27 1 05 0 19 0 25 0 39 0 4614 SOIC 8 55 8 75 3 9 5 8 6 2 1 72 0 10 0 25 1 27 1 05 0 19 0 25 0 39 0 4616 SOIC 9 9 10 3 9 5 8 6 2 1 72 0 10 0 25 1 27 1 05 0 19 0 25 0 39 0 4616 SOIC 10 1 10 5 7 5 10 00 10 65 2 65 0 10 0 30 1 27 1 4 0 23 0 32 0 38 0 40 SOT Y Small outline transistor SOT 23 6 2 9 1 6 2 8 1 45 0 95 0 6 0 22 0 38SSOP Y Shrink small outline package 0 65TDFN N Thin dual flat no lead 8 TDFN 3 3 3 0 7 0 8 0 65 0 19 0 3TSOP Y Thin small outline package 0 5 TSSOP Y Thin shrink small outline package 8 TSSOP 26 2 9 3 1 4 3 4 5 6 4 1 2 0 15 0 65 0 09 0 2 0 19 0 3Y 14 TSSOP 27 4 9 5 1 4 3 4 5 6 4 1 1 0 05 0 15 0 65 0 09 0 2 0 19 0 3020 TSSOP 28 6 4 6 6 4 3 4 5 6 4 1 1 05 0 15 0 65 0 09 0 2 0 19 0 30µSOP Y Micro small outline package 29 µSOP 8 3 4 9 1 1 0 65US8 30 Y US8 package 2 2 3 3 1 7 0 5Quad rows Edit Image Family Pin Name Package WB WL H C L P LL T LW PLCC N Plastic leaded chip carrier 1 27CLCC N Ceramic leadless chip carrier 48 CLCC 14 22 14 22 2 21 14 22 1 016 0 508 LQFP Y Low profile quad flat package 0 50 TQFP Y Thin quad flat package TQFP 44 10 00 12 00 0 35 0 50 0 80 1 00 0 09 0 20 0 30 0 45TQFN N Thin quad flat no leadLGA Edit Package x y z52 ULGA 12 mm 17 mm 0 65 mm52 ULGA 14 mm 18 mm 0 10 mm52 VELGA Multi chip packages EditA variety of techniques for interconnecting several chips within a single package have been proposed and researched SiP system in package PoP package on package 3D SICs Monolithic 3D ICs and other three dimensional integrated circuits Multi chip module WSI wafer scale integration Proximity communication 31 By terminal count Edit Example of component sizes metric and imperial codes and comparison included Composite image of a 11 44 LED matrix lapel name tag display using 1608 0603 type SMD LEDs Top A little over half of the 21 86 mm display Center Close up of LEDs in ambient light Bottom LEDs in their own red light SMD capacitors on the left with two through hole capacitors on the right Main article Chip carrier Surface mount components are usually smaller than their counterparts with leads and are designed to be handled by machines rather than by humans The electronics industry has standardized package shapes and sizes the leading standardisation body is JEDEC The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches For example a metric 2520 component is 2 5 mm by 2 0 mm which corresponds roughly to 0 10 inches by 0 08 inches hence imperial size is 1008 Exceptions occur for imperial in the two smallest rectangular passive sizes The metric codes still represent the dimensions in mm even though the imperial size codes are no longer aligned Problematically some manufacturers are developing metric 0201 components with dimensions of 0 25 mm 0 125 mm 0 0098 in 0 0049 in 32 but the imperial 01005 name is already being used for the 0 4 mm 0 2 mm 0 0157 in 0 0079 in package These increasingly small sizes especially 0201 and 01005 can sometimes be a challenge from a manufacturability or reliability perspective 33 Two terminal packages Edit Rectangular passive components Edit Mostly resistors and capacitors Package Approximate dimensions length width Typical resistor power rating W Metric Imperial0201 008004 0 25 mm 0 125 mm 0 010 in 0 005 in03015 009005 0 3 mm 0 15 mm 0 012 in 0 006 in 0 02 34 0402 01005 0 4 mm 0 2 mm 0 016 in 0 008 in 0 031 35 0603 0201 0 6 mm 0 3 mm 0 02 in 0 01 in 0 05 35 1005 0402 1 0 mm 0 5 mm 0 04 in 0 02 in 0 062 36 0 1 35 1608 0603 1 6 mm 0 8 mm 0 06 in 0 03 in 0 1 35 2012 0805 2 0 mm 1 25 mm 0 08 in 0 05 in 0 125 35 2520 1008 2 5 mm 2 0 mm 0 10 in 0 08 in3216 1206 3 2 mm 1 6 mm 0 125 in 0 06 in 0 25 35 3225 1210 3 2 mm 2 5 mm 0 125 in 0 10 in 0 5 35 4516 1806 4 5 mm 1 6 mm 0 18 in 0 06 in 37 4532 1812 4 5 mm 3 2 mm 0 18 in 0 125 in 0 75 35 4564 1825 4 5 mm 6 4 mm 0 18 in 0 25 in 0 75 35 5025 2010 5 0 mm 2 5 mm 0 20 in 0 10 in 0 75 35 6332 2512 6 3 mm 3 2 mm 0 25 in 0 125 in 1 35 6863 2725 6 9 mm 6 3 mm 0 27 in 0 25 in 37451 2920 7 4 mm 5 1 mm 0 29 in 0 20 in 38 Tantalum capacitors Edit Main article Tantalum capacitor Package Dimensions Length typ width typ height max EIA 2012 12 KEMET R AVX R 2 0 mm 1 3 mm 1 2 mmEIA 3216 10 KEMET I AVX K 3 2 mm 1 6 mm 1 0 mmEIA 3216 12 KEMET S AVX S 3 2 mm 1 6 mm 1 2 mmEIA 3216 18 KEMET A AVX A 3 2 mm 1 6 mm 1 8 mmEIA 3528 12 KEMET T AVX T 3 5 mm 2 8 mm 1 2 mmEIA 3528 21 KEMET B AVX B 3 5 mm 2 8 mm 2 1 mmEIA 6032 15 KEMET U AVX W 6 0 mm 3 2 mm 1 5 mmEIA 6032 28 KEMET C AVX C 6 0 mm 3 2 mm 2 8 mmEIA 7260 38 KEMET E AVX V 7 2 mm 6 0 mm 3 8 mmEIA 7343 20 KEMET V AVX Y 7 3 mm 4 3 mm 2 0 mmEIA 7343 31 KEMET D AVX D 7 3 mm 4 3 mm 3 1 mmEIA 7343 43 KEMET X AVX E 7 3 mm 4 3 mm 4 3 mm 39 40 Aluminum capacitors Edit Main article Electrolytic capacitor Package Dimensions Length typ width typ height max Cornell Dubilier A 3 3 mm 3 3 mm 5 5 mmChemi Con D 4 3 mm 4 3 mm 5 7 mmPanasonic B 4 3 mm 4 3 mm 6 1 mmChemi Con E 5 3 mm 5 3 mm 5 7 mmPanasonic C 5 3 mm 5 3 mm 6 1 mmChemi Con F 6 6 mm 6 6 mm 5 7 mmPanasonic D 6 6 mm 6 6 mm 6 1 mmPanasonic E F Chemi Con H 8 3 mm 8 3 mm 6 5 mmPanasonic G Chemi Con J 10 3 mm 10 3 mm 10 5 mmChemi Con K 13 mm 13 mm 14 mmPanasonic H 13 5 mm 13 5 mm 14 mmPanasonic J Chemi Con L 17 mm 17 mm 17 mmPanasonic K Chemi Con M 19 mm 19 mm 17 mm 41 42 43 Small outline diode SOD Edit Package Dimensions Length typ width typ height max SOD 80C 3 5 mm 1 5 mm 44 SOD 123 2 65 mm 1 6 mm 1 35 mm 45 SOD 128 3 8 mm 2 5 mm 1 1 mm 46 SOD 323 SC 76 1 7 mm 1 25 mm 1 1 mm 47 SOD 523 SC 79 1 2 mm 0 8 mm 0 65 mm 48 SOD 723 1 4 mm 0 6 mm 0 65 mm 49 SOD 923 0 8 mm 0 6 mm 0 4 mm 50 Metal electrode leadless face MELF Edit Main article MELF Electronic Components Mostly resistors and diodes barrel shaped components dimensions do not match those of rectangular references for identical codes 51 Package Dimensions Typical resistor ratingPower W Voltage V MicroMELF MMU 0102 2 2 mm 1 1 mm 0 2 0 3 150MiniMELF MMA 0204 3 6 mm 1 4 mm 0 25 0 4 200MELF MMB 0207 5 8 mm 2 2 mm 0 4 1 0 300DO 214 Edit Main article DO 214 Commonly used for rectifier Schottky and other diodes Package Dimensions incl leads Length typ width typ height max DO 214AA SMB 5 4 mm 3 6 mm 2 65 mm 52 DO 214AB SMC 7 95 mm 5 9 mm 2 25 mm 52 DO 214AC SMA 5 2 mm 2 6 mm 2 15 mm 52 Three and four terminal packages Edit Small outline transistor SOT Edit Main article Small outline transistor Package Aliases Dimensions excl leads Length typ width typ height max Number of terminals RemarkSOT 23 3 TO 236 3 SC 59 2 92 mm 1 3 mm 1 12 mm 53 3SOT 89 TO 243 54 SC 62 55 4 5 mm 2 5 mm 1 5 mm 56 4 Center pin is connected to a large heat transfer padSOT 143 TO 253 2 9 mm 1 3 mm 1 22 mm 57 4 Tapered body one larger pad denotes terminal 1SOT 223 TO 261 6 5 mm 3 5 mm 1 8 mm 58 4 One terminal is a large heat transfer padSOT 323 SC 70 2 mm 1 25 mm 1 1 mm 59 3SOT 416 SC 75 1 6 mm 0 8 mm 0 9 mm 60 3SOT 663 1 6 mm 1 2 mm 0 6 mm 61 3SOT 723 1 2 mm 0 8 mm 0 55 62 3 Has flat leadsSOT 883 SC 101 1 mm 0 6 mm 0 5 mm 63 3 Is lead lessOther Edit DPAK TO 252 SOT 428 Discrete Packaging Developed by Motorola to house higher powered devices Comes in three 64 or five terminal 65 versions D2PAK TO 263 SOT 404 Bigger than the DPAK basically a surface mount equivalent of the TO220 through hole package Comes in 3 5 6 7 8 or 9 terminal versions 66 D3PAK TO 268 Even larger than D2PAK 67 68 Five and six terminal packages Edit Small outline transistor SOT Edit Package Aliases Dimensions excl leads Length typ width typ height max Number of terminals Leaded or leadlessSOT 23 6 SOT 26 SC 74 2 9 mm 1 3 mm 1 3 mm 69 6 LeadedSOT 353 SC 88A 2 mm 1 25 mm 0 95 mm 70 5 LeadedSOT 363 SC 88 SC 70 6 2 mm 1 25 mm 0 95 mm 71 6 LeadedSOT 563 1 6 mm 1 2 mm 0 6 mm 72 6 LeadedSOT 665 1 6 mm 1 6 mm 0 55 mm 73 5 LeadedSOT 666 1 6 mm 1 2 mm 0 6 mm 74 6 LeadedSOT 886 1 45 mm 1 mm 0 5 mm 75 6 LeadlessSOT 891 1 mm 1 mm 0 5 mm 76 5 LeadlessSOT 953 1 mm 0 8 mm 0 5 mm 77 5 LeadedSOT 963 1 mm 1 mm 0 5 mm 78 6 LeadedSOT 1115 1 mm 0 9 mm 0 35 mm 79 6 LeadlessSOT 1202 1 mm 1 mm 0 35 mm 80 6 Leadless Various SMD chips desoldered MLP package 28 pin chip upside down to show contacts Packages with more than six terminals Edit Dual in line Edit Main article Dual in line package Flatpack was one of the earliest surface mounted packages Small outline integrated circuit SOIC dual in line 8 or more pins gull wing lead form pin spacing 1 27 mm Small outline package J leaded SOJ The same as SOIC except J leaded 81 Thin small outline package TSOP thinner than SOIC with smaller pin spacing of 0 5 mm Shrink small outline package SSOP pin spacing of 0 65 mm sometimes 0 635 mm or in some cases 0 8 mm Thin shrink small outline package TSSOP Quarter size small outline package QSOP with pin spacing of 0 635 mm Very small outline package VSOP even smaller than QSOP 0 4 0 5 or 0 65 mm pin spacing Dual flat no lead DFN smaller footprint than leaded equivalent Quad in line Edit Quad in line Plastic leaded chip carrier PLCC square J lead pin spacing 1 27 mm Quad flat package QFP various sizes with pins on all four sides Low profile quad flat package LQFP 1 4 mm high varying sized and pins on all four sides Plastic quad flat pack PQFP a square with pins on all four sides 44 or more pins Ceramic quad flat pack CQFP similar to PQFP Metric quad flat pack MQFP a QFP package with metric pin distribution Thin quad flat pack TQFP a thinner version of LQFP Quad flat no lead QFN smaller footprint than leaded equivalent Leadless chip carrier LCC contacts are recessed vertically to wick in solder Common in aviation electronics because of robustness to mechanical vibration Micro leadframe package MLP MLF with a 0 5 mm contact pitch no leads same as QFN Power quad flat no lead PQFN with exposed die pads for heatsinkingGrid arrays Edit Ball grid array BGA A square or rectangular array of solder balls on one surface ball spacing typically 1 27 mm 0 050 in Fine pitch ball grid array FBGA A square or rectangular array of solder balls on one surface Low profile fine pitch ball grid array LFBGA A square or rectangular array of solder balls on one surface ball spacing typically 0 8 mm Micro ball grid array mBGA Ball spacing less than 1 mm Thin fine pitch ball grid array TFBGA A square or rectangular array of solder balls on one surface ball spacing typically 0 5 mm Land grid array LGA An array of bare lands only Similar to in appearance to QFN but mating is by spring pins within a socket rather than solder Column grid array CGA A circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern Ceramic column grid array CCGA A circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern The body of the component is ceramic Lead less package LLP A package with metric pin distribution 0 5 mm pitch Non packaged devices Edit Although surface mount these devices require specific process for assembly Chip on board COB a bare silicon chip that is usually an integrated circuit is supplied without a package which is usually a lead frame overmolded with epoxy and is attached often with epoxy directly to a circuit board The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy glob top Chip on flex COF a variation of COB where a chip is mounted directly to a flex circuit Tape automated bonding process is also a chip on flex process as well Chip on glass COG a variation of COB where a chip typically a liquid crystal display LCD controller is mounted directly on glass Chip on wire COW a variation of COB where a chip typically a LED or RFID chip is mounted directly on wire thus making it a very thin and flexible wire Such wire may then be covered with cotton glass or other materials to make into smart textiles or electronic textiles There are often subtle variations in package details from manufacturer to manufacturer and even though standard designations are used designers need to confirm dimensions when laying out printed circuit boards See also Edit Electronics portalSurface mount technology Three dimensional integrated circuit Interposer IPC electronics List of chip carriers List of electronics package dimensions Redistribution layer Small outline transistor Wafer level packagingReferences Edit a b c d e f g h i j k l m n o CPU Collection Museum Chip Package Information The CPU Shack Retrieved 2011 12 15 Archived copy PDF Archived from the original PDF on 2011 08 15 Retrieved 2011 02 03 a href Template Cite web html title Template Cite web cite web a CS1 maint archived copy as title link a b c d e f g h i j k l m n o p q r s t u v w x y z aa ab ac ad ae af ag ah ai aj ak al am Integrated Circuit IC Package Types SOIC Surface Mount Device Package Interfacebus com Retrieved 2011 12 15 National Semiconductor CERPACK Package Products National com Archived from the original on 2012 02 18 Retrieved 2011 12 15 National Semiconductor CQGP Package Products National com Archived from the original on 2007 10 21 Retrieved 2011 12 15 National s LLP Package National com Archived from the original on 2011 02 13 Retrieved 2011 12 15 LTCC Low Temperature Co fired Ceramic Minicaps com Retrieved 2011 12 15 Frye R C Gabara T J Tai K L Fischer W C Knauer S C 1993 Performance evaluation of MCM chip to chip interconnections using custom I O buffer designs Sixth Annual IEEE International ASIC Conference and Exhibit Ieeexplore ieee org pp 464 467 doi 10 1109 ASIC 1993 410760 ISBN 978 0 7803 1375 0 S2CID 61288567 National Semiconductor Launches New Generation of Ultra Miniature High Pin Count Integrated Circuit Packages National com Archived from the original on 2012 02 18 Retrieved 2011 12 15 Meyers Michael Jernigan Scott 2004 Mike Meyers A Guide to PC Hardware The McGraw Hill Companies ISBN 978 0 07 223119 9 Conexant Systems Inc Conexant First to Launch DVB S2 Demodulator and FEC Decoder ir conexant com Archived from the original on August 18 2011 Press Releases Motorola Mobility Inc Motorola com Retrieved 2011 12 15 Xilinx new CPLDs with two I O banks Eetasia com 2004 12 08 Retrieved 2011 12 15 Packages Chelseatech com 2010 11 15 Retrieved 2011 12 15 Chip Package SIDEBRAZE DIP Archived from the original on 2008 11 20 Retrieved 2009 10 24 a b c d Packaging Terminology Texas Instruments CSP Chip Scale Package Siliconfareast com Retrieved 2011 12 15 a b Understanding Flip Chip and Chip Scale Package Technologies and Their Applications Maxim Maxim ic com 2007 04 18 Retrieved 2011 12 15 a b Chip Scale Review Online Chipscalereview com Retrieved 2011 12 15 https www nxp com docs en application note AN3846 pdf bare URL PDF Panasonic Industrial Devices Packaging Technology National Semiconductor Package Drawings Part Marking Package Codes LLP micro SMD Micro Array National com Archived from the original on 2010 08 01 Retrieved 2011 12 15 How Chip On Boards are Made SparkFun Learn TO 226 Package Archived from the original on 2010 08 23 a b c d e f g IR Packages TSSOP 8 Package Dimensions by Diodes Incorporated PDF F Package 14 Lead Plastic TSSOP 4 4mm Reference LTC DWG 05 08 1650 PDF F Package 20 Lead Plastic TSSOP 4 4mm Reference LTC DWG 05 08 1650 PDF http pdfserv maximintegrated com package dwgs 21 0036 PDF bare URL PDF Fairchild s TinyLogic family overview PDF March 22 2013 Archived from the original PDF on January 8 2015 Proximity Communication the Technology 2004 archived from the original on 2009 07 18 Murata Tsuneo 2012 09 05 Murata s world s Smallest Monolithic Ceramic Capacitor 0201 lt millimeter size gt size 0 25 mm x 0 125 mm Press release Kyoto Japan Murata Manufacturing Co Ltd Archived from the original on 2015 12 28 Retrieved 2015 12 28 White Paper 0201 and 01005 Adoption in Industry PDF Retrieved 7 February 2018 SMR Series Ultra Compact Chip Resistors PDF Datasheet Rohm Semiconductor a b c d e f g h i j k Thick Film Chip Resistors PDF Datasheet Panasonic Archived from the original PDF on 2014 02 09 Thick Film Chip Resistor SMDC Series PDF Datasheet electronic sensor resistor GmbH Archived from the original PDF on 2015 12 28 Retrieved 2015 12 28 SMD BLOCK Type EMI Suppression Filters EMIFIL PDF Catalog Murata Manufacturing Co Ltd Archived from the original on 2015 12 28 Retrieved 2015 12 28 POLYFUSE Resettable Fuses SMD2920 PDF Datasheet Littelfuse Retrieved 2015 12 28 TLJ Series Tantalum Solid Electrolytic Chip Capacitors High CV Consumer Series PDF Datasheet AVX Corporation Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 Tantalum Surface Mount Capacitors Standard Tantalum PDF Catalog KEMET Electronics Corporation 2011 09 06 Archived from the original PDF on 2011 12 26 Retrieved 2015 12 28 SMT Aluminum Electrolytic Capacitors PDF Datasheet Panasonic Archived from the original PDF on 2012 03 01 Retrieved 2015 12 28 Application Guide Aluminum SMT Capacitors PDF Resources Cornell Dubilier Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 Surface Mount Aluminum Electrolytic Capacitors Alchip MVA Series PDF Nippon Chemi Con Retrieved 2015 12 28 SOD 80C Hermetically sealed glass surface mounted package PDF NXP Semiconductors Archived PDF from the original on 2012 04 23 Retrieved 2015 12 28 Designer s Data Sheet Surface Mount Silicon Zener Diodes Plastic SOD 123 Package PDF Motorola Retrieved 2015 12 28 SOD128 plastic surface mounted package PDF NXP Semiconductors 2017 Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 SOD323 plastic surface mounted package PDF NXP Semiconductors 2019 Archived PDF from the original on 2012 11 19 Retrieved 2015 12 28 SOD523 Package outline PDF NXP Semiconductors 2008 Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 Comchip CDSP400 G PDF Datasheet Comchip Technology Corporation Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 SOD923 Microlead ultra small surface mounted plastic package PDF Datasheet NXP Semiconductors Professional Thin Film MELF Resistors PDF Vishay Intertechnology 2014 04 22 Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 a b c Package Outline Dimensions U DFN1616 6 Type F PDF Diodes Incorporated Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 Package Outline Drawing P3 064 PDF Intersil Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 3 Lead Small Outline Transistor Package SOT 89 RK 3 PDF Analog Devices 2013 09 12 Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 Standards for the Dimensions of Semiconductor Devices PDF Electronic Industries Association of Japan 1996 04 15 Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 Package Information SOT 89 PDF RICOH Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 https www analog com media en package pcb resources package pkg pdf sot 143ra ra 4 pdf bare URL PDF SOT 233 Molded Package PDF Fairchild Semiconductor 2008 02 26 Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 SOT323 Package outline PDF NXP Semiconductors 2008 Archived from the original PDF on 2015 12 28 Retrieved 2015 12 28 SOT416 Package outline PDF NXP Semiconductors 2010 Archived from the original PDF on 2015 12 28 Retrieved 2015 12 28 SOT663 Package outline PDF NXP Semiconductors 2008 Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 Mechanical Case Outline SOT 723 PDF ON Semiconductor 2009 08 10 Retrieved 2015 12 28 SOT883 Package outline PDF NXP Semiconductors 2008 Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 D PAK TO 252AA Outline Dimensions PDF Vishay Intertechnology 2012 12 05 Archived from the original PDF on 2015 12 28 Retrieved 2015 12 28 Mechanical Case Outline DPAK 5 PDF ON Semiconductor 2014 05 15 Retrieved 2015 12 28 D2PAK Outline Dimensions PDF Vishay Intertechnology 2015 07 08 Archived from the original PDF on 2015 12 28 Retrieved 2015 12 28 Phase leg Rectifier Diode PDF IXYS Corporation 2002 Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 admin D3PAK Decawatt Package 3 TO 268 Discrete Package MADPCB Printed Circuit Board Manufacturing PCB Assembly amp PCB Design MADPCB Retrieved 2022 04 08 P6 064 Package Outline Drawing PDF Intersil 2010 Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 SOT353 Package outline PDF NXP Semiconductors 2008 Archived from the original PDF on 2015 12 28 Retrieved 2015 12 28 SOT363 Package outline PDF NXP Semiconductors 2008 Archived from the original PDF on 2015 12 28 Retrieved 2015 12 28 SOT563 Package Details PDF Central Semiconductor 2015 05 22 Archived PDF from the original on 2015 12 28 Retrieved 2015 12 28 SOT665 Package outline PDF NXP Semiconductors 2008 Archived from the original PDF on 2015 12 28 Retrieved 2015 12 28 SOT666 Package outline PDF NXP Semiconductors 2008 Archived from the original PDF on 2015 12 28 Retrieved 2015 12 28 SOT886 Package outline PDF NXP Semiconductors 2017 SOT891 XSON6 plastic extremely thin small outline package noleads PDF NXP Semiconductors 2016 SOT953 Package information PDF Diodes Incorporated 2017 SOT963 Package details PDF Central Semiconductor Corp 2010 SOT1115 Package outline PDF NXP Semiconductors 2010 Archived from the original PDF on 2015 12 28 Retrieved 2015 12 28 SOT1202 Package outline PDF NXP Semiconductors 2010 Archived from the original PDF on 2015 12 28 Retrieved 2015 12 28 IC Package Types www SiliconFarEast com Archived from the original on 2013 07 26 Retrieved 2015 12 28 External links Edit Wikimedia Commons has media related to IC packages JEDEC JEP95 official list of all over 500 standard electronic packages Fairchild Index of Package Information An illustrated listing of different package types with links to typical dimensions features of each Intersil packaging information ICpackage org Solder Pad Layout Dimensions International Microelectronics And Packaging Society Retrieved from https en wikipedia org w index php title List of integrated circuit packaging types amp oldid 1121791828, wikipedia, wiki, book, books, library,

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