Thin small outline package (TSOP) is a type of surface mountIC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).
An outline drawing of a Type I TSOP with 32 leads
They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory, FSRAM and E2PROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications.
TSOP is the smallest leaded form factor for flash memory.[1]
TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages. [3]
HTSOP (Heatsink TSOP) is a variant of TSOP with an exposed pad on the bottom side.[citation needed] The pad is soldered to the PCB to transfer heat from the package to the PCB.
Similar packagesedit
There are a variety of small form-factor IC carrier available other than TSOPs
thin, small, outline, package, this, article, needs, additional, citations, verification, please, help, improve, this, article, adding, citations, reliable, sources, unsourced, material, challenged, removed, find, sources, news, newspapers, books, scholar, jst. This article needs additional citations for verification Please help improve this article by adding citations to reliable sources Unsourced material may be challenged and removed Find sources Thin small outline package news newspapers books scholar JSTOR July 2007 Learn how and when to remove this template message Thin small outline package TSOP is a type of surface mount IC package They are very low profile about 1mm and have tight lead spacing as low as 0 5mm An outline drawing of a Type I TSOP with 32 leadsThey are frequently used for RAM or Flash memory ICs due to their high pin count and small volume In some applications they are being supplanted by ball grid array packages which can achieve even higher densities The prime application for this technology is memory SRAM flash memory FSRAM and E2PROM manufacturers find this package well suited to their end use products It answers the needs required by telecom cellular memory modules PC cards PCMCIA cards wireless netbooks and countless other product applications TSOP is the smallest leaded form factor for flash memory 1 Contents 1 History 2 Physical properties 2 1 Type I 2 2 Type II 3 HTSOP 4 Similar packages 5 See also 6 References 7 External linksHistory editThe TSOP package was developed to fit the reduced package height available in a PCMCIA PC Card 2 Physical properties edit nbsp TSOP type I Atmel AT29C010ATSOPs are rectangular in shape and come in two varieties Type I and Type II Type I ICs have the pins on the shorter side and Type II have the pins on the longer side The table below shows basic measurements for common TSOP packages 3 Type I edit Part number Pins Body width mm Body length mm Lead pitch mm TSOP28 28 8 1 11 8 0 55TSOP28 32 28 32 8 18 4 0 5TSOP40 40 10 18 4 0 5TSOP48 48 12 18 4 0 5TSOP56 56 14 18 4 0 5Type II edit Part number Pins Body width mm Body length mm Lead pitch mm TSOP6 SOT457 4 6 1 5 2 9 0 95TSOP20 24 26 20 24 26 7 6 17 14 1 27TSOP24 28 24 28 10 16 18 41 1 27TSOP32 32 10 16 20 95 1 27TSOP40 44 40 44 10 16 18 42 0 8TSOP50 50 10 16 20 95 0 8TSOP54 54 10 16 22 22 0 8TSOP66 66 10 16 22 22 0 65HTSOP editHTSOP Heatsink TSOP is a variant of TSOP with an exposed pad on the bottom side citation needed The pad is soldered to the PCB to transfer heat from the package to the PCB Similar packages editThere are a variety of small form factor IC carrier available other than TSOPs Small outline integrated circuit SOIC Plastic small outline package PSOP Shrink small outline package SSOP Thin shrink small outline package TSSOP See also editIntegrated circuit Chip carrier Chip packaging and package types listReferences edit Intel 1999 Small Outline Package Guide PDF p 1 1 Archived from the original PDF on February 11 2017 Retrieved December 17 2021 Texas Instruments Recent Advancements in Bus Interface Packaging and Processing 1997 p 2 SiliconFarEast TSOP Thin Small Outline Package Sc 74 Tsop6 Sot457 External links edit nbsp Wikimedia Commons has media related to TSOP integrated circuit packages TSOP Package Information from Amkor Technology Retrieved from https en wikipedia org w index php title Thin small outline package amp oldid 1163176390, wikipedia, wiki, book, books, library,
