The processor was developed by Microsoft and IBM under the IBM chip program codenamed "Waternoose", which was named after the Monsters, Inc. character Henry J. Waternoose III.[1] The development program was originally announced on November 3, 2003.[2]
The processor is based on IBM PowerPCinstruction set architecture. It consists of three independent processor cores on a single die. These cores are slightly modified versions of the PPE in the Cell processor used on the PlayStation 3.[3][4] Each core has two symmetric hardware threads (SMT), for a total of six hardware threads available to games. Each individual core also includes 32 KB of L1 instruction cache and 32 KB of L1 data cache.
Three cores, each two-way SMT-capable and clocked at 3.2 GHz[6]
SIMD: Two VMX128 units with a dedicated (128×128 bit) register file for each core,[6] one for each thread
1 MB L2 cache[6] (lockable by the GPU) running at half-speed (1.6 GHz) with a 256-bit bus
51.2 GB/s of L2 memory bandwidth (256 bit × 1600 MHz)
21.6 GB/s front-side bus (On the CPU side, this interfaces to a 1.35 GHz, 8B wide, FSB dataflow; on the GPU side, it connects to a 16B wide FSB dataflow running at 675 MHz.)[6]
The Xbox 360 S introduced the XCGPU, which integrated the Xenon CPU and the Xenos GPU onto the same die, and the eDRAM into the same package. The XCGPU follows the trend started with the integrated EE+GS in PlayStation 2 Slimline, combining CPU, GPU, memory controllers and IO in a single cost-reduced chip. It also contains a "front side bus replacement block" that connects the CPU and GPU internally in exactly the same manner as the front side bus would have done when the CPU and GPU were separate chips, so that the XCGPU doesn't change the hardware characteristics of the Xbox 360.
XCGPU contains 372 million transistors and is manufactured by GlobalFoundries on a 45 nm process. Compared to the original chipset in the Xbox 360 the combined power requirements are reduced by 60% and the physical chip area by 50%.[10][11]
Gallery
Illustrations of the different generations of processors in Xbox 360 and Xbox 360 S.
The original XCPU-ES manufactured at 90 nm by IBM in 2005. ES stands for "Engineering Sample" and the device is packaged by IBM at their Bromont facility in Canada. It runs at 2.8GHz, as opposed to the final chip, which ran at 3.2GHz.
The 90nm XCPU manufactured at 90 nm by Chartered in Singapore 2006.
The 65nm XCPU manufactured at 65 nm by Chartered in Singapore 2007.
The two chips of the XCGPU: The larger is the XCGPU itself and the smaller is the 10 MB eDRAM. Manufactured at 45 nm by Global Foundries in Singapore in 2010.
The XCGPU with heatspreader. The complete device is packaged by IBM at their Bromont facility in Canada.
References
^Takahashi, Dean (May 1, 2006). . Electronic Business. Archived from the original on August 27, 2009.
^"IBM News room - 2003-11-03 Microsoft and IBM Announce Technology Agreement - United States". ibm.com.
^"Processing The Truth: An Interview With David Shippy", Leigh Alexander, Gamasutra, January 16, 2009
^"Playing the Fool", Jonathan V. Last, Wall Street Journal, December 30, 2008
^"IBM News room - 2005-10-25 IBM Delivers Power-based Chip for Microsoft Xbox 360 Worldwide Launch - United States". ibm.com.
^ abcdefJeffrey Brown (December 6, 2005). . IBM. Archived from the original on October 25, 2007. Retrieved September 8, 2007.
^César A. Berardini (August 21, 2006). . Archived from the original on January 23, 2008. Retrieved January 9, 2008.
^Patel, Nilay (June 14, 2010). "New Xbox 360 looks angular and Ominous". Engadget.com. Retrieved June 14, 2010.
^ ab"Xbox360 security system". YouTube. Archived from the original on December 19, 2021.
^Jon Stokes, Ars Technica (August 24, 2010). "Microsoft beats Intel, AMD to market with CPU/GPU combo chip". Retrieved August 24, 2010.
^PC Perspective (June 21, 2010). . Archived from the original on June 25, 2010. Retrieved June 24, 2010.
Xenon hardware overview February 20, 2006, at the Wayback Machine by Pete Isensee, Development Lead, Xbox Advanced Technology Group, written some time before June 23, 2007
External links
Ars Technica explains the Xenon CPU
June 27, 2023
xenon, processor, confused, with, xenos, also, used, xbox, unrelated, intel, xeon, intel, waternoose, redirects, here, fictional, character, henry, waternoose, microsoft, xcpu, codenamed, xenon, used, xbox, game, console, used, with, xenos, graphics, chip, mic. Not to be confused with the ATI Xenos also used in the Xbox 360 as the GPU or the unrelated Intel Xeon or Intel Xe Waternoose redirects here For the fictional character see Henry J Waternoose Microsoft XCPU codenamed Xenon is a CPU used in the Xbox 360 game console to be used with ATI s Xenos graphics chip Microsoft XCPU codenamed Xenon Picture of the microprocessor XCPU ES shown General informationDesigned byIBMCommon manufacturer s IBM GlobalFoundriesCacheL1 cache32 32 KBL2 cache1 MBArchitecture and classificationInstruction setPowerPCPhysical specificationsCores3 coresThe processor was developed by Microsoft and IBM under the IBM chip program codenamed Waternoose which was named after the Monsters Inc character Henry J Waternoose III 1 The development program was originally announced on November 3 2003 2 The processor is based on IBM PowerPC instruction set architecture It consists of three independent processor cores on a single die These cores are slightly modified versions of the PPE in the Cell processor used on the PlayStation 3 3 4 Each core has two symmetric hardware threads SMT for a total of six hardware threads available to games Each individual core also includes 32 KB of L1 instruction cache and 32 KB of L1 data cache The XCPU processors were manufactured at IBM s East Fishkill New York fabrication plant and Chartered Semiconductor Manufacturing now part of GlobalFoundries in Singapore 5 Chartered reduced the fabrication process in 2007 to 65 nm from 90 nm thus reducing manufacturing costs for Microsoft Contents 1 Specifications 2 XCGPU 3 Gallery 4 References 5 External linksSpecifications Edit90 nm process 6 65 nm process upgrade in 2007 7 codenamed Loki 45 nm process since Xbox 360 S model 8 165 million transistors Three cores each two way SMT capable and clocked at 3 2 GHz 6 SIMD Two VMX128 units with a dedicated 128 128 bit register file for each core 6 one for each thread 1 MB L2 cache 6 lockable by the GPU running at half speed 1 6 GHz with a 256 bit bus 51 2 GB s of L2 memory bandwidth 256 bit 1600 MHz 21 6 GB s front side bus On the CPU side this interfaces to a 1 35 GHz 8B wide FSB dataflow on the GPU side it connects to a 16B wide FSB dataflow running at 675 MHz 6 Dot product performance 9 6 billion per second In order instruction execution 6 768 bits of IBM eFUSE based OTP memory 9 ROM and 64 KB SRAM storing Microsoft s Secure Bootloader and encryption hypervisor 9 Big endian architectureXCGPU EditThe Xbox 360 S introduced the XCGPU which integrated the Xenon CPU and the Xenos GPU onto the same die and the eDRAM into the same package The XCGPU follows the trend started with the integrated EE GS in PlayStation 2 Slimline combining CPU GPU memory controllers and IO in a single cost reduced chip It also contains a front side bus replacement block that connects the CPU and GPU internally in exactly the same manner as the front side bus would have done when the CPU and GPU were separate chips so that the XCGPU doesn t change the hardware characteristics of the Xbox 360 XCGPU contains 372 million transistors and is manufactured by GlobalFoundries on a 45 nm process Compared to the original chipset in the Xbox 360 the combined power requirements are reduced by 60 and the physical chip area by 50 10 11 Gallery EditIllustrations of the different generations of processors in Xbox 360 and Xbox 360 S The original XCPU ES manufactured at 90 nm by IBM in 2005 ES stands for Engineering Sample and the device is packaged by IBM at their Bromont facility in Canada It runs at 2 8GHz as opposed to the final chip which ran at 3 2GHz The 90nm XCPU manufactured at 90 nm by Chartered in Singapore 2006 The 65nm XCPU manufactured at 65 nm by Chartered in Singapore 2007 The two chips of the XCGPU The larger is the XCGPU itself and the smaller is the 10 MB eDRAM Manufactured at 45 nm by Global Foundries in Singapore in 2010 The XCGPU with heatspreader The complete device is packaged by IBM at their Bromont facility in Canada References Edit Takahashi Dean May 1 2006 Learning from failure The inside story on how IBM out foxed Intel with the Xbox 360 Electronic Business Archived from the original on August 27 2009 IBM News room 2003 11 03 Microsoft and IBM Announce Technology Agreement United States ibm com Processing The Truth An Interview With David Shippy Leigh Alexander Gamasutra January 16 2009 Playing the Fool Jonathan V Last Wall Street Journal December 30 2008 IBM News room 2005 10 25 IBM Delivers Power based Chip for Microsoft Xbox 360 Worldwide Launch United States ibm com a b c d e f Jeffrey Brown December 6 2005 Application customized CPU design The Microsoft Xbox 360 CPU story IBM Archived from the original on October 25 2007 Retrieved September 8 2007 Cesar A Berardini August 21 2006 Chartered to Manufacture 65 nm Xbox 360 CPUs Archived from the original on January 23 2008 Retrieved January 9 2008 Patel Nilay June 14 2010 New Xbox 360 looks angular and Ominous Engadget com Retrieved June 14 2010 a b Xbox360 security system YouTube Archived from the original on December 19 2021 Jon Stokes Ars Technica August 24 2010 Microsoft beats Intel AMD to market with CPU GPU combo chip Retrieved August 24 2010 PC Perspective June 21 2010 The New Xbox 360 S Slim Teardown Opened and Tested Archived from the original on June 25 2010 Retrieved June 24 2010 Xenon hardware overview Archived February 20 2006 at the Wayback Machine by Pete Isensee Development Lead Xbox Advanced Technology Group written some time before June 23 2007External links EditArs Technica explains the Xenon CPU Retrieved from https en wikipedia org w index php title Xenon processor amp oldid 1147010911, wikipedia, wiki, book, books, library,
