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Hot air solder leveling

HASL or HAL (for hot air (solder) leveling) is a type of finish used on printed circuit boards (PCBs).

The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder. Excess solder is removed by passing the PCB between hot air knives.

HASL can be applied with or without lead (Pb), but only lead-free HASL is RoHS compliant.

Advantages of HASL Edit

  • Excellent wetting during component soldering
  • Avoids copper corrosion.

Disadvantages of HASL Edit

  • Low planarity on vertical levelers may make this surface finish unsuitable for use with fine pitch components. Improved planarity can be achieved using a horizontal leveler.
  • High thermal stress during the process may introduce defects into PCB

See also Edit

solder, leveling, this, article, does, cite, sources, please, help, improve, this, article, adding, citations, reliable, sources, unsourced, material, challenged, removed, find, sources, news, newspapers, books, scholar, jstor, november, 2012, learn, when, rem. This article does not cite any sources Please help improve this article by adding citations to reliable sources Unsourced material may be challenged and removed Find sources Hot air solder leveling news newspapers books scholar JSTOR November 2012 Learn how and when to remove this template message HASL redirects here For other uses see HASL disambiguation HASL or HAL for hot air solder leveling is a type of finish used on printed circuit boards PCBs The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder Excess solder is removed by passing the PCB between hot air knives HASL can be applied with or without lead Pb but only lead free HASL is RoHS compliant Advantages of HASL EditExcellent wetting during component soldering Avoids copper corrosion Disadvantages of HASL EditLow planarity on vertical levelers may make this surface finish unsuitable for use with fine pitch components Improved planarity can be achieved using a horizontal leveler High thermal stress during the process may introduce defects into PCBSee also EditElectroless Nickel Immersion Gold ENIG Immersion Silver IAg Organic Solderability Preservative OSP Reflow soldering Wave soldering Retrieved from https en wikipedia org w index php title Hot air solder leveling amp oldid 1149438547, wikipedia, wiki, book, books, library,

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