The IEEE Electronics Packaging Award, formerly called the IEEE Components, Packaging, and Manufacturing Technologies Award, is a Technical Field Award established by the IEEE Board of Directors in 2002. It is awarded for meritorious contribution to the advancement of components, electronic packaging or manufacturing technologies.
The award may be presented to an individual or a team of up to three recipients.
Recipients of this award receive a bronze medal, certificate and an honorarium.
^Mauro J. Walker, Driver of Microelectronics Production Advancements, to Receive 2012 IEEE Components, Packaging and Manufacturing Technology Award, IEEE Press release 2014-05-02 at the Wayback Machine
^Rao Tummala to Receive IEEE CPMT Award, Georgia Inst. Technology, July 23, 2010. March 31, 2012, at the Wayback Machine
^Rao R. Tummala, Microelectronics Packaging Trailblazer, to Receive 2011 IEEE Components Packaging and Manufacturing Technology Award, TMCnet.com, May 19, 2011.
^IEEE Components, Packaging & Manufacturing Technology Award 2010, Fraunhofer IZM, July 2009.
^Herbert Reichl awarded IEEE CPMT field award for 2010, ElectroIQ, June 10, 2010.
^Harman Receives IEEE Award for Wire Bonding Improvements, ElectroIQ, May 13, 2009.
^C. P. Wong, Regent's Professor, Georgia Inst. Technology 2011-10-25 at the Wayback Machine
External links
Information on the award at IEEE
This science awards article is a stub. You can help Wikipedia by expanding it.
ieee, electronics, packaging, award, formerly, called, ieee, components, packaging, manufacturing, technologies, award, technical, field, award, established, ieee, board, directors, 2002, awarded, meritorious, contribution, advancement, components, electronic,. The IEEE Electronics Packaging Award formerly called the IEEE Components Packaging and Manufacturing Technologies Award is a Technical Field Award established by the IEEE Board of Directors in 2002 It is awarded for meritorious contribution to the advancement of components electronic packaging or manufacturing technologies The award may be presented to an individual or a team of up to three recipients Recipients of this award receive a bronze medal certificate and an honorarium Recipients EditRecipients of the award for each year include 2021 Chin C Lee 2020 Mitsumasa Koyanagi and Peter Ramm 2019 Ephraim Suhir 2018 William Chen 2017 Paul S Ho and King Ning Tu 2016 Michael Pecht 2015 Nasser Borozorg Grayeli 2014 Avram Bar Cohen 2013 John Lau 2012 Mauro Walker 1 2011 Rao R Tummala 2 3 2010 Herbert Reichl 4 5 2009 George G Harman 6 2008 Karl Puttlitz and Paul A Totta 2007 Dimitry Grabbe 2006 C P Wong 7 2005 Yutaka Tsukada 2004 John W BaldeReferences Edit Mauro J Walker Driver of Microelectronics Production Advancements to Receive 2012 IEEE Components Packaging and Manufacturing Technology Award IEEE Press release Archived 2014 05 02 at the Wayback Machine Rao Tummala to Receive IEEE CPMT Award Georgia Inst Technology July 23 2010 Archived March 31 2012 at the Wayback Machine Rao R Tummala Microelectronics Packaging Trailblazer to Receive 2011 IEEE Components Packaging and Manufacturing Technology Award TMCnet com May 19 2011 IEEE Components Packaging amp Manufacturing Technology Award 2010 Fraunhofer IZM July 2009 Herbert Reichl awarded IEEE CPMT field award for 2010 ElectroIQ June 10 2010 Harman Receives IEEE Award for Wire Bonding Improvements ElectroIQ May 13 2009 C P Wong Regent s Professor Georgia Inst Technology Archived 2011 10 25 at the Wayback MachineExternal links EditInformation on the award at IEEE This science awards article is a stub You can help Wikipedia by expanding it vte Retrieved from https en wikipedia org w index php title IEEE Electronics Packaging Award amp oldid 1084357256, wikipedia, wiki, book, books, library,
