A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC.[1] Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".[2] The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.
A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery)
A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large die and several smaller dies all on the same module.[3]
Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection (HDI) substrate. The final assembled MCM substrate may be done in one of the following ways:
The substrate is a multi-layer laminated printed circuit board (PCB), such as those used in AMD's Zen 2 processors.
The ICs are deposited on the base substrate using Thin Film technology.
The ICs that make up the MCM package may be:
ICs that can perform most, if not all of the functions of a component of a computer, such as the CPU. Examples of this include implementations of IBM's POWER5 and Intel's Core 2 Quad. Multiple copies of the same IC are used to build the final product. In the case of POWER5, multiple POWER5 processors and their associated off-die L3 cache are used to build the final package. With the Core 2 Quad, effectively two Core 2 Duo dies were packaged together.
ICs that perform only some of the functions, or "Intellectual Property Blocks" ("IP Blocks"), of a component in a computer. These are known as chiplets.[4][5] An example of this are the processing ICs and I/O IC of AMD's Zen 2-based processors.
An interposer connects the ICs. This is often either organic (a laminated circuit board that contains carbon, hence organic) or is made of silicon (as in High Bandwidth Memory).[6] Each has advantages and limitations. Using interposers to connect several ICs instead of connecting several monolithic ICs in separate packages reduces the power needed to transmit signals between ICs, increases the number of transmission channels, and reduces delays caused by resistance and capacitance (RC delays).[7] However, communication between chiplets consumes more power and has higher latency than components within monolithic ICs.[8]
A relatively new development in MCM technology is the so-called "chip-stack" package.[9] Certain ICs, memories in particular, have very similar or identical pinouts when used multiple times within systems. A carefully designed substrate can allow these dies to be stacked in a vertical configuration making the resultant MCM's footprint much smaller (albeit at the cost of a thicker or taller chip). Since area is more often at a premium in miniature electronics designs, the chip-stack is an attractive option in many applications such as cell phones and personal digital assistants (PDAs). With the use of a 3D integrated circuit and a thinning process, as many as ten dies can be stacked to create a high capacity SD memory card.[10] This technique can also be used for High Bandwidth Memory.
The possible way to increasing the performance of data transfer in the Chip stack is use Wireless Networks on Chip (WiNoC).[11]
AMD Ryzen Threadripper and Epyc CPUs based on Zen or Zen+ architecture are MCMs of two or four chips[19] (Ryzen based on Zen or Zen+ is not MCM and consist of one chip)
AMD's non-APURyzen, Ryzen Threadripper and Epyc CPUs based on the Zen 2 or Zen 3 architecture are MCMs of one, two, four[20] or eight chips containing CPU cores and one bigger I/O chip[21]
AMD Instinct MI series GPUs based on CDNA 2 architecture are MCMs of one or two graphics compute die (GCD) chips.
AMD Radeon RX 7000 series GPUs based on RDNA 3 architecture are MCMs with one GCD and up to six memory cache die (MCD) chips.
^Dr. Ian Cutress, AnandTech "Intel Moving to Chiplets: 'Client 2.0' for 7nm"
^Jon Worrel (15 April 2012). "Intel migrates to desktop Multi-Chip Modules (MCMs) with 14nm Broadwell". Fudzilla.
^Richard Chirgwin, The Register. “Memory vendors pile on '3D' stacking standard.” April 2, 2013. February 5, 2016.
^Slyusar V. I., Slyusar D.V. Pyramidal design of nanoantennas array. // VIII International Conference on Antenna Theory and Techniques (ICATT’11). - Kyiv, Ukraine. - National Technical University of Ukraine “Kyiv Polytechnic Institute”. - September 20–23, 2011. - Pp. 140 - 142. [1]
^Ghoshal, U.; Van Duzer, T. (1992). "High-performance MCM interconnection circuits and fluxoelectronics". Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92. pp. 175–178. doi:10.1109/MCMC.1992.201478. ISBN0-8186-2725-5. S2CID 109329843.
^Burns, M. J.; Char, K.; Cole, B. F.; Ruby, W. S.; Sachtjen, S. A. (1993). "Multichip module using multilayer YBa2Cu3O7−δinterconnects". Applied Physics Letters. 62 (12): 1435–1437. Bibcode:1993ApPhL..62.1435B. doi:10.1063/1.108652.
^Satoru Iwata, Iwata Asks. “Changes in Television.” Retrieved August 4, 2015.
^"NAND based MCP | Samsung Memory Link". samsung.com.
^"e-MMC based MCP | Samsung Memory Link". samsung.com.
^Cutress, Ian. "The AMD Ryzen Threadripper 1950X and 1920X Review: CPUs on Steroids". www.anandtech.com. Retrieved 2020-04-10.
^Lilly, Paul (2019-12-17). "AMD Ryzen Threadripper 3960X, 3970X Meet Scalpel For Zen 2 Delidding Operation". HotHardware. Retrieved 2020-04-10.
^Cutress, Ian. "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". www.anandtech.com. Retrieved 2020-04-10.
External linksedit
Multichip Module Technology (MCM) or System on a Package (SoP)
AMD aims to stay in the race with Magny-Cours 12-core CPU
MCM Design in AutoCAD – CDS Master MCM Designer Suite
January 01, 1970
multi, chip, module, this, article, needs, additional, citations, verification, please, help, improve, this, article, adding, citations, reliable, sources, unsourced, material, challenged, removed, find, sources, news, newspapers, books, scholar, jstor, june, . This article needs additional citations for verification Please help improve this article by adding citations to reliable sources Unsourced material may be challenged and removed Find sources Multi chip module news newspapers books scholar JSTOR June 2013 Learn how and when to remove this message A multi chip module MCM is generically an electronic assembly such as a package with a number of conductor terminals or pins where multiple integrated circuits ICs or chips semiconductor dies and or other discrete components are integrated usually onto a unifying substrate so that in use it can be treated as if it were a larger IC 1 Other terms for MCM packaging include heterogeneous integration or hybrid integrated circuit 2 The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and or to improve yields over a conventional monolithic IC approach A ceramic multi chip module containing four POWER5 processor dies center and four 36 MB L3 cache dies periphery A Flip Chip Multi Chip Module FCMCM is a multi chip module that uses flip chip technology A FCMCM may have one large die and several smaller dies all on the same module 3 Contents 1 Overview 2 Chip stack MCMs 3 Examples of multi chip packages 4 3D multi chip modules 5 See also 6 References 7 External linksOverview editMulti chip modules come in a variety of forms depending on the complexity and development philosophies of their designers These can range from using pre packaged ICs on a small printed circuit board PCB meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection HDI substrate The final assembled MCM substrate may be done in one of the following ways The substrate is a multi layer laminated printed circuit board PCB such as those used in AMD s Zen 2 processors The substrate is built on ceramic such as low temperature co fired ceramic The ICs are deposited on the base substrate using Thin Film technology The ICs that make up the MCM package may be ICs that can perform most if not all of the functions of a component of a computer such as the CPU Examples of this include implementations of IBM s POWER5 and Intel s Core 2 Quad Multiple copies of the same IC are used to build the final product In the case of POWER5 multiple POWER5 processors and their associated off die L3 cache are used to build the final package With the Core 2 Quad effectively two Core 2 Duo dies were packaged together ICs that perform only some of the functions or Intellectual Property Blocks IP Blocks of a component in a computer These are known as chiplets 4 5 An example of this are the processing ICs and I O IC of AMD s Zen 2 based processors An interposer connects the ICs This is often either organic a laminated circuit board that contains carbon hence organic or is made of silicon as in High Bandwidth Memory 6 Each has advantages and limitations Using interposers to connect several ICs instead of connecting several monolithic ICs in separate packages reduces the power needed to transmit signals between ICs increases the number of transmission channels and reduces delays caused by resistance and capacitance RC delays 7 However communication between chiplets consumes more power and has higher latency than components within monolithic ICs 8 Chip stack MCMs edit nbsp Wireless NoC on 3D integrated circuit A relatively new development in MCM technology is the so called chip stack package 9 Certain ICs memories in particular have very similar or identical pinouts when used multiple times within systems A carefully designed substrate can allow these dies to be stacked in a vertical configuration making the resultant MCM s footprint much smaller albeit at the cost of a thicker or taller chip Since area is more often at a premium in miniature electronics designs the chip stack is an attractive option in many applications such as cell phones and personal digital assistants PDAs With the use of a 3D integrated circuit and a thinning process as many as ten dies can be stacked to create a high capacity SD memory card 10 This technique can also be used for High Bandwidth Memory The possible way to increasing the performance of data transfer in the Chip stack is use Wireless Networks on Chip WiNoC 11 Examples of multi chip packages editIBM Bubble memory MCMs 1970s IBM 3081 mainframe s thermal conduction module 1980s Superconducting Multichip modules 1990s 12 13 Intel Pentium Pro Pentium II OverDrive Pentium D Presler Xeon Dempsey Clovertown Harpertown and Tigerton Core 2 Quad Kentsfield Penryn QC and Yorkfield Clarkdale Arrandale Kaby Lake G and models with Crystalwell those with the GT3e or GT4e graphics SD cards Micro SD cards and Sony memory sticks eMMC and eUFS Xenos a GPU designed by ATI Technologies for the Xbox 360 with eDRAM POWER2 POWER4 POWER5 POWER7 POWER8 and Power10 from IBM IBM z196 Nintendo s Wii U Espresso microprocessor has its CPU GPU and onboard VRAM integrated into the GPU on one MCM 14 VIA Nano QuadCore 15 Flash and RAM memory combined on a PoP by Micron Samsung MCP solutions combining mobile DRAM and NAND storage 16 17 18 AMD Ryzen Threadripper and Epyc CPUs based on Zen or Zen architecture are MCMs of two or four chips 19 Ryzen based on Zen or Zen is not MCM and consist of one chip AMD s non APU Ryzen Ryzen Threadripper and Epyc CPUs based on the Zen 2 or Zen 3 architecture are MCMs of one two four 20 or eight chips containing CPU cores and one bigger I O chip 21 AMD Instinct MI series GPUs based on CDNA 2 architecture are MCMs of one or two graphics compute die GCD chips AMD Radeon RX 7000 series GPUs based on RDNA 3 architecture are MCMs with one GCD and up to six memory cache die MCD chips Intel Xe Ponte Vecchio GPUs Intel Meteor Lake CPUs Any other processor with High Bandwidth Memory Apple M series with CPU and memory3D multi chip modules editMain articles 3D integrated circuit and Package on packageSee also editSystem in package SIP System on a chip SoC Hybrid integrated circuit Advanced packaging semiconductors Chip carrier Chip packaging and package types list Single Chip Module SCM UFS Multi Chip Package uMCP References edit Rao Tummala Solid State Technology SoC vs MCM vs SiP vs SoP Retrieved August 4 2015 Don Scansen EE Times Chiplets A Short History Retrieved 26 April 2021 IMAPS Advancing Microelectronics 2020 Issue 3 Advanced SiP FlippingBook Retrieved 2023 12 05 Samuel K Moore IEEE Spectrum Intel s View of the Chiplet Revolution Retrieved 26 April 2021 Semi Engineering Chiplets Retrieved 26 April 2021 2 5D Semiconductor Engineering Semiengineering com Retrieved 2022 05 13 Interposers Dr Ian Cutress AnandTech Intel Moving to Chiplets Client 2 0 for 7nm Jon Worrel 15 April 2012 Intel migrates to desktop Multi Chip Modules MCMs with 14nm Broadwell Fudzilla Richard Chirgwin The Register Memory vendors pile on 3D stacking standard April 2 2013 February 5 2016 Slyusar V I Slyusar D V Pyramidal design of nanoantennas array VIII International Conference on Antenna Theory and Techniques ICATT 11 Kyiv Ukraine National Technical University of Ukraine Kyiv Polytechnic Institute September 20 23 2011 Pp 140 142 1 Ghoshal U Van Duzer T 1992 High performance MCM interconnection circuits and fluxoelectronics Proceedings 1992 IEEE Multi Chip Module Conference MCMC 92 pp 175 178 doi 10 1109 MCMC 1992 201478 ISBN 0 8186 2725 5 S2CID 109329843 Burns M J Char K Cole B F Ruby W S Sachtjen S A 1993 Multichip module using multilayer YBa2Cu3O7 dinterconnects Applied Physics Letters 62 12 1435 1437 Bibcode 1993ApPhL 62 1435B doi 10 1063 1 108652 Satoru Iwata Iwata Asks Changes in Television Retrieved August 4 2015 Shimpi Anand Lal VIA s QuadCore Nano Gets Bigger www anandtech com Retrieved 2020 04 10 MCP Multichip Package Samsung Semiconductor www samsung com NAND based MCP Samsung Memory Link samsung com e MMC based MCP Samsung Memory Link samsung com Cutress Ian The AMD Ryzen Threadripper 1950X and 1920X Review CPUs on Steroids www anandtech com Retrieved 2020 04 10 Lilly Paul 2019 12 17 AMD Ryzen Threadripper 3960X 3970X Meet Scalpel For Zen 2 Delidding Operation HotHardware Retrieved 2020 04 10 Cutress Ian AMD Zen 2 Microarchitecture Analysis Ryzen 3000 and EPYC Rome www anandtech com Retrieved 2020 04 10 External links editMultichip Module Technology MCM or System on a Package SoP AMD aims to stay in the race with Magny Cours 12 core CPU MCM Design in AutoCAD CDS Master MCM Designer Suite Retrieved from https en wikipedia org w index php title Multi chip module amp oldid 1214494094, wikipedia, wiki, book, books, library,
